Listed by the USPTO as GUMEDZOE, PENIEL M
Tech Center 2800 • Art Units: 2891 2899
This examiner grants 83% of resolved cases
GUMEDZOE, PENIEL M is a USPTO patent examiner in tech center 2800 and art unit 2891. The profile includes 1336 resolved cases, an allowance rate of 83.3%, and an interview lift of 3.6%. The median time to allowance is 804 days. The high allowance measure is supported by a large recorded case history, while the interview measure indicates limited observed change associated with interviews. The timing measure provides a useful planning reference for applicants seeking to forecast prosecution progression in this art unit.
The listed companies are Taiwan Semiconductor Manufacturing Company, Ltd., Sony Group Corporation, and Micron Technology Inc. The listed firms are Haynes and Boone, LLP (24061), JCIPRNET, and CHIP LAW GROUP. The technology profile is concentrated in semiconductor and electronic-device matters. Practitioners may place greater emphasis on precise initial claim drafting and efficient written responses, while using interviews selectively for technical clarification. The volume and allowance record make this profile relevant to recurring semiconductor portfolios.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18699022 | LIGHT DEFLECTING DEVICE AND DISTANCE MEASURING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18578324 | IMAGE PICKUP ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18649297 | HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE CONNECTION | Non-Final OA | Micron Technology, Inc. |
| 18191295 | HIGH DENSITY METAL-INSULATOR-METAL CAPACITOR | Non-Final OA | International Business Machines Corporation |
| 18788671 | Grounded Metal Ring Structure For Through-Silicon Via | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18773466 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18673328 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18786939 | ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18783905 | SOURCE/DRAIN ISOLATION STRUCTURE AND METHODS THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18775879 | HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18613172 | SEMICONDUCTOR DIES HAVING ELECTRICAL ISOLATION LAYERS AND METHODS OF MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18257975 | LIGHT-EMITTING DIODE PACKAGE | Final Rejection | SEOUL VIOSYS CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy83.3% of resolved applications examined by Peniel M Gumedzoe were allowed (1,336 resolved cases), compared with 69.5% across Art Unit 2891 over the last five years.
This examiner's interview lift is +3.6 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Peniel M Gumedzoe took 804 days on average from filing to allowance.
Peniel M Gumedzoe examines applications in Art Unit 2891 in Tech Center 2800 (Semiconductors, Circuits & Optics).
