Listed by the USPTO as ISAAC, STANETTA D
Tech Center 2800 • Art Units: 2812 2898
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18826981 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 19069197 | ORGANIC LIGHT EMITTING DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18771623 | METHOD OF MANUFACTURING FILM ASSEMBLY FOR TRANSFERRING LIGHT EMITTING ELEMENT, FILM ASSEMBLY, AND METHOD OF MANUFACTURING DISPLAY DEVICE USING FILM ASSEMBLY | Non-Final OA | Samsung Display Co., LTD. |
| 18713663 | DISPLAY SUBSTRATE AND DRIVE METHOD AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 17365044 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Panasonic Intellectual Property Management Co., Ltd. |
| 18628469 | INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT | Non-Final OA | QUALCOMM Incorporated |
| 18655448 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | InnoLux Corporation |
| 17537788 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Mitsubishi Electric Corporation |
| 18621724 | HIGH VOLTAGE DEVICE AND METHOD | Non-Final OA | Micron Technology, Inc. |
| 17231313 | METHOD OF MANUFACTURING MICROELECTRONIC DEVICES AND RELATED MICROELECTRONIC DEVICES, TOOLS, AND APPARATUS | Non-Final OA | Micron Technology, Inc. |
| 18762786 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 17488586 | PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING | Final Rejection | Texas Instruments Incorporated |
| 18689715 | OPTOELECTRONIC COMPONENT, COMPONENT UNIT AND METHOD FOR PRODUCING THE SAME | Final Rejection | ams-OSRAM International GmbH |
| 18435064 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 16534104 | PLACE-AND-ROUTE RESISTANCE AND CAPACITANCE OPTIMIZATION USING MULTI-HEIGHT INTERCONNECT TRENCHES AND AIR GAP DIELECTRICS | Non-Final OA | SK Hynix NAND Product Solutions Corp. (dba Solidigm) |
| 18836043 | SUBSTRATE FOR HIGH-FREQUENCY DEVICE, AND METHOD FOR PRODUCING SAME | Non-Final OA | SHIN-ETSU HANDOTAI CO., LTD. |
| 18524282 | In-Situ Tungsten for Gate Stack of Multigate Device | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18486382 | SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18366531 | Dopant Concentration Boost in Epitaxially Formed Material | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18099097 | SEMICONDUCTOR MANUFACTURING METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17814525 | WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18788881 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18783597 | MULTIPLE THRESHOLD VOLTAGE IMPLEMENTATION THROUGH LANTHANUM INCORPORATION | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18779190 | STRESS-INDUCING SILICON LINER IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17819381 | Semiconductor Device and Method of Manufacture | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18785091 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
| 18654173 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy85.8% of resolved applications examined by Stanetta D Isaac were allowed (979 resolved cases), compared with 82.1% across Art Unit 2812 over the last five years.
This examiner's interview lift is -36.0 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Stanetta D Isaac took 903 days on average from filing to allowance.
Stanetta D Isaac examines applications in Art Unit 2812 in Tech Center 2800 (Semiconductors, Circuits & Optics).
