Technology area: Semiconductors, Circuits & Optics
69 pending office actions • 22 art units • 60 examiners • 0 of 69 (0%) have an AI response strategy ready • 49 patents granted in the last 365 days
Wolfspeed Inc. has 70 pending office actions in Semiconductors, Circuits & Optics. The matters involve 61 distinct examiners and 23 distinct art units, reflecting broad examiner coverage and repeated activity across art units. The profile calls for coordinated management of a sizable semiconductor prosecution docket rather than isolated response handling.
GHEYAS, SYED I is the busiest examiner, with 3 pending matters. That assignment provides a defined point for examiner-specific review, but it covers only part of the broader docket. Counsel should pair this review with art-unit tracking and portfolio-wide monitoring of claim language, technical disclosures, and recurring objections.
Based on the USPTO statutory response window for each pending office action. 22 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 22 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 1 (1%) |
| §103 only | 23 (33%) |
| §102 only | 6 (9%) |
| §112 only | 2 (3%) |
| Double-patenting + other | 1 (1%) |
| Multi-statute (no §101) | 36 (52%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| GHEYAS, SYED I | 3 | 82.8% | +3.7% |
| VALENZUELA, PATRICIA D | 3 | 90.3% | +2.0% |
| DOUMBIA, MOHAMED | 2 | 73.6% | +28.6% |
| SUN, YU-HSI DAVID | 2 | 77.6% | +8.5% |
| PRASAD, NEIL R | 2 | 85.5% | +9.6% |
| LIU, XIAOMING | 2 | 86.7% | +10.6% |
| ISAAC, STANETTA D | 2 | 85.8% | -36.0% |
| TRAN, BINH BACH THANH | 1 | 81.0% | +12.0% |
| GIBSON, RANDY W | 1 | 75.8% | +22.2% |
| DULKA, JOHN P | 1 | 83.8% | +12.3% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18336376 | Die-Attach Fillet Height Reduction | VALENZUELA, PATRICIA D | 22d overdue |
| 18304869 | Power Semiconductor Devices Including Beryllium Metallization | GHEYAS, SYED I | 17d overdue |
| 18125655 | SEMICONDUCTOR DEVICES WITH INTEGRATED TEST AREAS | LIU, XIAOMING | 16d overdue |
| 18336358 | Semiconductor Package | VALENZUELA, PATRICIA D | 10d overdue |
| 18775934 | Silicon Carbide Wafers with Relaxed Positive Bow and Related Methods | GHEYAS, SYED I | — |
| 18443031 | Layered Metallization in Power Semiconductor Packages | VALENZUELA, PATRICIA D | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17736720 | DYNAMIC PERFORMANCE OF ON-CHIP CURRENT SENSORS | SMITH, BRADLEY | 348d overdue |
| 18187804 | DIE-COAT MATERIAL CONFIGURED TO ENHANCE DEVICE RELIABILITY AND DEVICES AND PROCESSES IMPLEMENTING THE SAME | ARORA, AJAY | 23d overdue |
| 18475298 | Power Semiconductor Device Having Shaped Trench Ends | RAHIM, NILUFA | 18d overdue |
| 18213500 | SILICON CARBIDE SEMICONDUCTOR DEVICES WITH SUPERJUNCTIONS | LIU, XIAOMING | 16d overdue |
| 18154353 | Thermal Enhanced Power Semiconductor Package | PRASAD, NEIL R | 2d overdue |
| 18164205 | Semiconductor Device Having Semiconductor Structure with Polarity Inverting Layer | KIM, JAY C | 5d |
| 18493838 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND SUPPORT SHIELDS THAT EXTEND TO DIFFERENT DEPTHS | RAMOS-DIAZ, FERNANDO JOSE | 7d |
| 17138193 | PROCESS, SYSTEM, AND DEVICE FOR DETERMINING A RELATED PRODUCT | CHAMPAGNE, LUNA | 13d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18213500 | SILICON CARBIDE SEMICONDUCTOR DEVICES WITH SUPERJUNCTIONS | LIU, XIAOMING | 16d overdue |
| 18125655 | SEMICONDUCTOR DEVICES WITH INTEGRATED TEST AREAS | LIU, XIAOMING | 16d overdue |
| 19230629 | Method and System to Measure Optical Characteristics of Light-Transmissive Materials | DOUMBIA, MOHAMED | — |
| 18930630 | DUAL INLINE POWER MODULE | TRAN, BINH BACH THANH | — |
| 18915457 | CIRCUITRY FOR ALLOWING MULTIPLE SENSORS ON A SEMICONDUCTOR DIE TO SHARE A COMMON SENSOR PAD | GIBSON, RANDY W | — |
| 18910403 | SEMICONDUCTOR DEVICES WITH LENGTH-GRADED CHANNEL | DULKA, JOHN P | — |
| 18737609 | Method and System to Measure Optical Characteristics of Light-Transmissive Materials | DOUMBIA, MOHAMED | — |
| Art Unit | Apps |
|---|---|
| 2812 | 11 |
| 2817 | 8 |
| 2893 | 8 |
| 2898 | 7 |
| 2897 | 6 |
| 2818 | 4 |
| 2815 | 4 |
| 2877 | 2 |
| 2891 | 2 |
| 2813 | 2 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19230629 | Method and System to Measure Optical Characteristics of Light-Transmissive Materials | DOUMBIA, MOHAMED | 2877 | §102§103§112 | Non-Final OA | — | Pending | Jun 06, 2025 |
| 18930630 | DUAL INLINE POWER MODULE | TRAN, BINH BACH THANH | 2847 | §102§103 | Non-Final OA | — | Pending | Oct 29, 2024 |
| 18915457 | CIRCUITRY FOR ALLOWING MULTIPLE SENSORS ON A SEMICONDUCTOR DIE TO SHARE A COMMON SENSOR PAD | GIBSON, RANDY W | 2855 | §102 | Non-Final OA | — | Pending | Oct 15, 2024 |
| 18910403 | SEMICONDUCTOR DEVICES WITH LENGTH-GRADED CHANNEL | DULKA, JOHN P | 2817 | §102§103§112 | Non-Final OA | — | Pending | Oct 09, 2024 |
| 18830731 | POWER SEMICONDUCTOR DEVICES INCLUDING DEEP SHIELDING REGIONS | ZHU, SHENG-BAI | 2897 | §102§103 | Non-Final OA | — | Pending | Sep 11, 2024 |
| 18828024 | LARGE DIMENSION SILICON CARBIDE SINGLE CRYSTALLINE MATERIALS WITH REDUCED CRYSTALLOGRAPHIC STRESS | KUNEMUND, ROBERT M | 1714 | §102§103 | Non-Final OA | — | Pending | Sep 09, 2024 |
| 18792813 | POWER SEMICONDUCTOR DEVICES INCLUDING ANGLED GATE TRENCHES | ANYA, IGWE U | 2891 | §102§103 | Non-Final OA | — | Pending | Aug 02, 2024 |
| 18775934 | Silicon Carbide Wafers with Relaxed Positive Bow and Related Methods | GHEYAS, SYED I | 2893 | §103Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18759385 | High Throughput High Dynamic Range (HDR) Microscopy | THIRUGNANAM, GANDHI | 2672 | §101§102§103§112 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18755884 | GATE-CONTROLLED SEMICONDUCTOR DEVICES HAVING TEMPERATURE COMPENSATED GATE RESISTANCES | MOVVA, AMAR | 2898 | §102§103 | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18751832 | REDUCED OPTICAL ABSORPTION FOR SILICON CARBIDE CRYSTALLINE MATERIALS | AHMAD, KHAJA | 2813 | §103 | Non-Final OA | — | Pending | Jun 24, 2024 |
| 18742626 | TRENCH BASED SEMICONDUCTOR DEVICES WITH INCREASED PLANARITY | SUN, YU-HSI DAVID | 2817 | §102 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18737609 | Method and System to Measure Optical Characteristics of Light-Transmissive Materials | DOUMBIA, MOHAMED | 2877 | §102§103§112 | Non-Final OA | — | Pending | Jun 07, 2024 |
| 18733442 | POWER DISCRETE PACKAGE HAVING SYMMETRIC PINOUTS AND PROCESS OF IMPLEMENTING THE SAME | BOOTH, RICHARD A | 2812 | §103§112 | Non-Final OA | — | Pending | Jun 04, 2024 |
| 18663862 | Workpiece Surface Processing System for Semiconductor Wafers | ISHAQ, ISHAQ MOHAMED SAID | 3723 | §102§103§112 | Non-Final OA | — | Pending | May 14, 2024 |
| 18663985 | SEMICONDUCTOR DEVICES WITH GATE BUS LAYOUTS FOR HANDLING UNCLAMPED INDUCTIVE SWITCHING CURRENT | THROCKMORTON, ROBERT EMIL | 2818 | §102§103§112 | Non-Final OA | — | Pending | May 14, 2024 |
| 18655542 | SEMICONDUCTOR DEVICES HAVING METAL GATE RUNNERS WITH ASYMMETRIC OUTER GATE RUNNERS, UNEVENLY-SPACED INNER GATE RUNNERS AND/OR SPINE-RIB INNER GATE RUNNERS WITH MULTIPLE RIBS | HA, NATHAN W | 2814 | §102§103 | Non-Final OA | — | Pending | May 06, 2024 |
| 18636381 | POWER TRANSISTOR WITH SOFT RECOVERY BODY DIODE | ALAM, MOHAMMED R | 2897 | §102§103DP | Non-Final OA | — | Pending | Apr 16, 2024 |
| 18633618 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING ENHANCED AVALANCHE ROBUSTNESS AND METHODS OF FORMING SUCH DEVICES | SALERNO, SARAH KATE | 2814 | §102 | Non-Final OA | — | Pending | Apr 12, 2024 |
| 18612356 | POWER DEVICES WITH BARRIER METAL EXTENSION AND SEALING | GHEYAS, SYED I | 2893 | §102§103 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18610394 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND METHODS OF FORMING THE SAME | SPALLA, DAVID C | 2893 | §102 | Non-Final OA | — | Pending | Mar 20, 2024 |
| 18598866 | MOSFETS WITH IMPLANTED CHARGE COMPENSATION REGIONS | MEHTA, RATISHA | 2817 | §102§103 | Non-Final OA | — | Pending | Mar 07, 2024 |
| 18589080 | DC LINK SNUBBER DEVICE CONFIGURED FOR CONNECTION TO A POWER MODULE AND/OR THE LIKE AND PROCESSES OF IMPLEMENTING THE SAME | TIKU, SISAY G | 2838 | §103 | Non-Final OA | 70d | Pending | Feb 27, 2024 |
| 18586142 | DEVICE PACKAGE HAVING A CONTACTLESS SENSOR AND PROCESS OF IMPLEMENTING THE SAME | CHIU, TSZ K | 2898 | §102§103 | Final Rejection | — | Pending | Feb 23, 2024 |
| 18584179 | Integrated Active Cooling in Power Packages | TRAPANESE, WILLIAM C | 2812 | §103 | Final Rejection | — | Pending | Feb 22, 2024 |
| 18581339 | SILICON CARBIDE POWER DEVICES HAVING EXPANDED CREEPAGE DISTANCES | TORNOW, MARK W | 2891 | §102§103 | Non-Final OA | — | Pending | Feb 19, 2024 |
| 18443031 | Layered Metallization in Power Semiconductor Packages | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18422617 | Anti-Reflective Layer for Protecting an N-Polar Group III-Nitride Semiconductor Structure | MULERO FLORES, ERIC MANUEL | 2898 | §103§112 | Final Rejection | — | Pending | Jan 25, 2024 |
| 18422677 | Thermally Stable FinFET Device for High Temperature Operation | LOHAKARE, PRATIKSHA JAYANT | 2818 | §103 | Final Rejection | — | Pending | Jan 25, 2024 |
| 18412190 | Power Semiconductor Device Having Improved Transient Handling Without Field Insulating Layer | GALVAN, ANGELICA ROS ESTIGOY | 2815 | §102§112 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18405721 | Power Semiconductor Devices Including Shape-Memory Metallization | MAZUMDER, DIDARUL A | 2812 | §102§103 | Final Rejection | 33d | Pending | Jan 05, 2024 |
| 18403068 | SILICON CARBIDE BASED SEMICONDUCTOR DEVICES WITH RING-SHAPED CHANNEL REGIONS AND/OR CHANNEL REGIONS THAT EXTEND IN MULTIPLE DIRECTIONS IN PLAN VIEW | LEE, EUGENE | 2815 | §103 | Final Rejection | — | Pending | Jan 03, 2024 |
| 18545648 | Electroless Deposition Process for Semiconductor Devices | PAGE, STEVEN MITCHELL CHR | 2812 | §102 | Final Rejection | — | Pending | Dec 19, 2023 |
| 18540135 | ASYMMETRIC EDGE TERMINATION | WALL, VINCENT | 2898 | §103 | Non-Final OA | — | Pending | Dec 14, 2023 |
| 18518105 | REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE POWER MODULE | HOQUE, MOHAMMAD M | 2817 | §102§103 | Non-Final OA | — | Pending | Nov 22, 2023 |
| 18514038 | MASK INTEGRATION FOR TRENCHED SEMICONDUCTOR DEVICE STRUCTURES | CHANG, JAY C | 2817 | §102 | Final Rejection | — | Pending | Nov 20, 2023 |
| 18510756 | ENHANCED ISOLATION FOR ON-CHIP CURRENT SENSORS | LOPEZ, JORGE ANDRES | 2897 | §103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18510734 | GATE TRENCH POWER SEMICONDUCTOR DEVICES WITH DEEP JFET PATTERNS | MCDONALD, JASON ANDREW | 2898 | §103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18505197 | PACKAGED TRANSISTOR WITH CHANNELED DIE ATTACH MATERIALS AND PROCESS OF IMPLEMENTING THE SAME | NGUYEN, KHIEM D | 2892 | §102§103Other | Final Rejection | — | Pending | Nov 09, 2023 |
| 18383733 | GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS CONFIGURED WITH A LOW RESISTANCE CONTACT LAYER FOR SOURCE AND/OR DRAIN CONTACTS AND PROCESS FOR IMPLEMENTING THE SAME | MENZ, DOUGLAS M | 2897 | §102§103 | Final Rejection | — | Pending | Oct 25, 2023 |
| 18493838 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND SUPPORT SHIELDS THAT EXTEND TO DIFFERENT DEPTHS | RAMOS-DIAZ, FERNANDO JOSE | 2818 | §102§103§112 | Final Rejection | 7d | Pending | Oct 25, 2023 |
| 18488284 | Direct Bonded Semiconductor Die Package | SUN, YU-HSI DAVID | 2817 | §102§103 | Final Rejection | 22d | Pending | Oct 17, 2023 |
| 18487665 | Multifunctional Adhesion Promoter for Semiconductor Device Packages | FANG, SHANE | 1766 | §102§103§112 | Non-Final OA | — | Pending | Oct 16, 2023 |
| 18476452 | POWER SILICON CARBIDE BASED SEMICONDUCTOR DEVICES WITH SELECTIVE JFET IMPLANTS THAT ARE SELF-ALIGNED WITH THE WELL REGIONS AND METHODS OF MAKING SUCH DEVICES | NGUYEN, SOPHIA T | 2893 | §103 | Final Rejection | 39d | Pending | Sep 28, 2023 |
| 18475370 | Semiconductor Die Bonding | LIU, MIKKA H | 2817 | §103 | Final Rejection | — | Pending | Sep 27, 2023 |
| 18475298 | Power Semiconductor Device Having Shaped Trench Ends | RAHIM, NILUFA | 2893 | §102§103§112 | Final Rejection | 18d overdue | Pending | Sep 27, 2023 |
| 18471003 | Corrosion Resistant Metal Structures for Wide Bandgap Semiconductor Devices | HAN, JONATHAN | 2818 | §103 | Non-Final OA | — | Pending | Sep 20, 2023 |
| 18456782 | Thermal Enhanced Power Semiconductor Package | PRASAD, NEIL R | 2897 | §102§103Other | Final Rejection | 35d | Pending | Aug 28, 2023 |
| 18453414 | POWER SEMICONDUCTOR DEVICES HAVING GATE TRENCHES WITH ASYMMETRICALLY ROUNDED UPPER AND LOWER TRENCH CORNERS AND/OR RECESSED GATE ELECTRODES AND METHODS OF FABRICATING SUCH DEVICES | CHEN, YU | 2896 | §103 | Final Rejection | 56d | Pending | Aug 22, 2023 |
| 18213500 | SILICON CARBIDE SEMICONDUCTOR DEVICES WITH SUPERJUNCTIONS | LIU, XIAOMING | 2812 | §102§103 | Non-Final OA | 16d overdue | Pending | Jun 23, 2023 |
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Start Free TrialWolfspeed Inc. has 69 pending office actions as of October 2026, spread across 22 art units and 60 examiners.
Syed I Gheyas has the most, with 3 of Wolfspeed Inc.'s pending office actions.
Mostly Semiconductors, Circuits & Optics (USPTO Tech Center 2800), based on where its pending office actions are examined.
