Tech Center 2800 • Art Units: 2817
This examiner grants 96% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18303607 | INTEGRATED CIRCUIT INCLUDING MULTI-HEIGHT CELLS AND METHOD OF DESIGNING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18342473 | PHOTOELECTRIC CONVERSION APPARATUS, EQUIPMENT, LAYERED STRUCTURE | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18128484 | ATOMIC LAYER DEPOSITION OF SILICON-CARBON-AND-NITROGEN-CONTAINING MATERIALS | Final Rejection | Applied Materials, Inc. |
| 18343339 | INTEGRATED CIRCUIT DEVICE, SYSTEM AND METHOD | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18486349 | METHOD FOR MANUFACTURING A VERTICAL FIELD EFFECT TRANSISTOR STRUCTURE AND CORRESPONDING VERTICAL FIELD EFFECT TRANSISTOR STRUCTURE | Non-Final OA | Robert Bosch GmbH |
| 18166642 | MODULE AND METHOD FOR MANUFACTURING MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18474240 | SEMICONDUCTOR DEVICE AND LAYOUT METHOD OF THE SAME | Non-Final OA | Realtek Semiconductor Corporation |
| 18457362 | LOW ON-RESISTANCE HIGH POWER SWITCH | Non-Final OA | Visic Technologies Ltd. |
| 18466242 | FIELD EFFECT TRANSISTOR WITH INTEGRATED SERIES CAPACITANCE | Non-Final OA | MACOM Technology Solutions Holdings, Inc. |
| 18353546 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP STRUCTURES FOR WORD LINE CONTACTS AND METHODS OF EMPLOYING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 17757189 | BURIED HETEROSTRUCTURE SEMICONDUCTOR OPTICAL AMPLIFIER AND METHOD FOR FABRICATING THE SAME | Non-Final OA | NATIONAL RESEARCH COUNCIL OF CANADA |
| 18242145 | MINIATURIZED LENS PACKAGING MODULE, PREPARATION METHOD OF THE LENS PACKAGING MODULE, AND ELECTRONIC DEVICE HAVING THE LENS PACKAGING MODULE | Non-Final OA | Rayprus Technology (Foshan) Co., Ltd. |
| 18486242 | IMAGE SENSOR | Non-Final OA | POWERTECH TECHNOLOGY INC. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy