Tech Center 2800 • Art Units: 2817
This examiner grants 95% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18303607 | INTEGRATED CIRCUIT INCLUDING MULTI-HEIGHT CELLS AND METHOD OF DESIGNING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18342473 | PHOTOELECTRIC CONVERSION APPARATUS, EQUIPMENT, LAYERED STRUCTURE | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18462830 | CHEMICAL MECHANICAL POLISHING PROCESS USING STEAM FOR POLISHING FLUID DELIVERY AND AN APPARATUS FOR IMPLEMENTING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18128484 | ATOMIC LAYER DEPOSITION OF SILICON-CARBON-AND-NITROGEN-CONTAINING MATERIALS | Final Rejection | Applied Materials, Inc. |
| 18486349 | METHOD FOR MANUFACTURING A VERTICAL FIELD EFFECT TRANSISTOR STRUCTURE AND CORRESPONDING VERTICAL FIELD EFFECT TRANSISTOR STRUCTURE | Non-Final OA | Robert Bosch GmbH |
| 18486322 | PIXEL SENSORS AND METHODS OF MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18474240 | SEMICONDUCTOR DEVICE AND LAYOUT METHOD OF THE SAME | Non-Final OA | Realtek Semiconductor Corporation |
| 18353546 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP STRUCTURES FOR WORD LINE CONTACTS AND METHODS OF EMPLOYING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 17757189 | BURIED HETEROSTRUCTURE SEMICONDUCTOR OPTICAL AMPLIFIER AND METHOD FOR FABRICATING THE SAME | Non-Final OA | NATIONAL RESEARCH COUNCIL OF CANADA |
| 18242145 | MINIATURIZED LENS PACKAGING MODULE, PREPARATION METHOD OF THE LENS PACKAGING MODULE, AND ELECTRONIC DEVICE HAVING THE LENS PACKAGING MODULE | Non-Final OA | Rayprus Technology (Foshan) Co., Ltd. |
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