Listed by the USPTO as KIELIN, ERIK J
Tech Center 2800 • Art Units: 2814 2815 2893
This examiner grants 68% of resolved cases
This examiner is assigned to Tech Center 2800 and Art Unit 2814, with 648 resolved cases. The allowance rate is 67.7%, and the median time to allowance is 868 days. The record supports a meaningful view of prosecution behavior, with an allowance outcome below profiles characterized by very high allowance rates and a median timeline that remains important for filing strategy.
The interview lift is 5.6%, indicating a limited positive association between interviews and allowance outcomes. Interviews may still help clarify technical or claim issues, but the data does not suggest relying on them as the primary lever. The leading companies are Taiwan Semiconductor Manufacturing Company, Ltd., Samsung Electronics Co., Ltd., and KIOXIA Corporation. The leading firms are FISH & RICHARDSON P.C., BIRCH STEWART KOLASCH & BIRCH, and CANTOR COLBURN LLP.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18767435 | CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18674263 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18429611 | INTEGRATED CIRCUIT DEVICES | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18397231 | ORGANIC LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18753757 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18442336 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18719575 | SILICON CARBIDE SUBSTRATE, METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE | Non-Final OA | DENSO CORPORATION |
| 18713288 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18740673 | COATING PROCESSING APPARATUS AND METHOD FOR FORMING COATING FILM | Non-Final OA | Kioxia Corporation |
| 18605999 | MEMORY DEVICE | Final Rejection | Kioxia Corporation |
| 18066206 | Integrated circuit FLUID sensor | Non-Final OA | Texas Instruments Incorporated |
| 18667255 | EMBEDDED COOLING FOR AN INTEGRATED CIRCUIT CONFIGURED WITH A BACKSIDE POWER RAIL | Final Rejection | NVIDIA CORPORATION |
| 18244175 | SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR POWER MODULE FOR A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | Non-Final OA | Hitachi Energy Ltd |
| 18677332 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18757887 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | Non-Final OA | STMicroelectronics International N.V. |
| 18644231 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18588069 | INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREADER LAYERS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18459089 | STRESS AND WARPAGE MODULATING STRUCTURE FOR MULTI-STACKED WAFER AND DIE LEVEL BONDING PACKAGES | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18177144 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17887122 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18790273 | CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18766246 | COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD FOR 3D INTEGRATED CIRCUITS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18602392 | INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18327220 | 3D Stacking Structure and Method of Fabricating the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy67.7% of resolved applications examined by Erik J Kielin were allowed (648 resolved cases), compared with 74.2% across Art Unit 2814 over the last five years.
This examiner's interview lift is +5.6 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Erik J Kielin took 868 days on average from filing to allowance.
Erik J Kielin examines applications in Art Unit 2814 in Tech Center 2800 (Semiconductors, Circuits & Optics).
