Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1712 1713 1716 1718 1759
This examiner grants 44% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18634430 | LOW PARAMETER PLASMA ASHING TECHNIQUES | Non-Final OA | Micron Technology, Inc. |
| 18619083 | SILICON ETCH BYPRODUCT REMOVAL | Non-Final OA | Applied Materials, Inc. |
| 18442378 | METHOD AND APPARATUS FOR SUBSTRATE NOTCH SENSING ON CMP HEAD FOR LOCAL PLANARIZATION | Non-Final OA | Applied Materials, Inc. |
| 18422727 | CHOKE PLATES FOR SEMICONDUCTOR MANUFACTURING PROCESSING CHAMBERS | Non-Final OA | Applied Materials, Inc. |
| 18233760 | APPARATUS DESIGN FOR FILM REMOVAL FROM THE BEVEL AND EDGE OF THE SUBSTRATE | Non-Final OA | Applied Materials, Inc. |
| 17831781 | PLASMA CHAMBER WITH A MULTIPHASE ROTATING CROSS-FLOW WITH UNIFORMITY TUNING | Final Rejection | Applied Materials, Inc. |
| 18733073 | Inner Wall and substrate Processing Apparatus | Non-Final OA | TOKYO ELECTRON LIMITED |
| 18586860 | SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18044184 | GAS SUPPLY SYSTEM AND GAS SUPPLY METHOD | Final Rejection | FUJIKIN INCORPORATED |
| 18758576 | EDGE RING ARRANGEMENT WITH MOVEABLE EDGE RINGS | Non-Final OA | LAM RESEARCH CORPORATION |
| 17793366 | Optimization of Radiofrequency Signal Ground Return in Plasma Processing System | Non-Final OA | Lam Research Corporation |
| 18032397 | APPARATUS FOR PROCESSING A WAFER-SHAPED ARTICLE | Non-Final OA | LAM RESEARCH AG |
| 17522897 | SYSTEM FOR PROCESSING SUBSTRATE | Final Rejection | EUGENE TECHNOLOGY CO., LTD. |
| 18521813 | POLISHING APPARATUS | Final Rejection | EBARA CORPORATION |
| 18458866 | SUBSTRATE PROCESSING APPARATUS AND PROTECTIVE LAYER FORMING METHOD | Final Rejection | Ebara Corporation |
| 18181295 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | SCREEN Holdings Co., Ltd. |
| 18175995 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 18408369 | ETCHING DEVICE AND ETCHING METHOD | Final Rejection | ULVAC, INC. |
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