Prosecution Insights
Last updated: May 29, 2026

Examiner: KLUNK, MARGARET D

Tech Center 1700 • Art Units: 1712 1713 1716 1759

This examiner grants 44% of resolved cases

Performance Statistics

43.7%
Allow Rate
-21.3% vs TC avg
476
Total Applications
+30.6%
Interview Lift
1380
Avg Prosecution Days
Based on 435 resolved cases, 2023–2026

Rejection Statute Breakdown

0.3%
§101 Eligibility
3.1%
§102 Novelty
75.3%
§103 Obviousness
9.4%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18224312 DEPOSITION APPARATUS Non-Final OA Samsung Display Co., LTD.
16207958 POLISHING APPARATUS AND POLISHING METHOD Non-Final OA EBARA CORPORATION
17689392 SUBSTRATE PROCESSING APPARATUS Non-Final OA ASM IP Holding B.V.
18619083 SILICON ETCH BYPRODUCT REMOVAL Non-Final OA Applied Materials, Inc.
17893430 CLAMPED DUAL-CHANNEL SHOWERHEAD Non-Final OA Applied Materials, Inc.
17874873 SUSCEPTOR SUPPORT ASSEMBLY FOR CHEMICAL VAPOR DEPOSITION CHAMBERS Final Rejection Applied Materials, Inc.
17380788 FACE-UP WAFER EDGE POLISHING APPARATUS Non-Final OA Applied Materials, Inc.
17019061 ANTIFRAGILE SYSTEMS FOR SEMICONDUCTOR PROCESSING EQUIPMENT USING MULTIPLE SPECIAL SENSORS AND ALGORITHMS Non-Final OA Applied Materials, Inc.
18282292 ETCHING PLASMA PROCESSING APPARATUS INCLUDING CONSUMABLE METAL MEMBER Non-Final OA Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
17232563 VALVE BOX MODULE, SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
18325423 ETCHING METHOD AND PLASMA PROCESSING APPARATUS Non-Final OA Tokyo Electron Limited
17342809 STAGE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD Final Rejection Tokyo Electron Limited
17883128 METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVING FLUID GUIDING STRUCTURE Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
18181152 COMPONENT FOR FILM FORMATION APPARATUS OR ETCHING APPARATUS Non-Final OA AGC Inc.
18394198 APPARATUS AND METHOD FOR TREATING SUBSTRATE Non-Final OA SEMES CO., LTD.
18187342 ELECTRON EXCITATION ATOMIC LAYER ETCH Non-Final OA Lam Research Corporation
17912358 CERAMIC ADDITIVE MANUFACTURING TECHNIQUES FOR GAS INJECTORS Final Rejection Lam Research Corporation
18516653 CARRIER DEVICE AND SEMICONDUCTOR PROCESSING EQUIPMENT Non-Final OA BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
16761642 OPTICAL ELEMENTS HOLDER DEVICE FOR A COATING STATION Non-Final OA SATISLOH AG
18044184 GAS SUPPLY SYSTEM AND GAS SUPPLY METHOD Non-Final OA FUJIKIN INCORPORATED
17758667 LIQUID CHEMICAL PROCESSING DEVICE Final Rejection DAIKIN FINETECH, LTD.

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