Tech Center 1700 • Art Units: 1713 1722 1737
This examiner grants 46% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18047030 | PHOTOACID GENERATOR, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN USING THE PHOTOACID GENERATOR | Final Rejection | Samsung Electronics Co., Ltd. |
| 17847794 | METHOD FOR FORMING PHOTORESIST PATTERNS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17749899 | RESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18468245 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 17942677 | RESIN COMPOSITION, FILM, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE | Final Rejection | FUJIFILM Corporation |
| 16964038 | PHOTORESIST RESIN, PRODUCTION METHOD FOR PHOTORESIST RESIN, PHOTORESIST RESIN COMPOSITION, AND PATTERN FORMATION METHOD | Final Rejection | DAICEL CORPORATION |
| 16569305 | MONOMERS, PHOTORESIST RESINS, PHOTORESIST RESIN COMPOSITIONS, AND PATTERN FORMING METHOD | Non-Final OA | DAICEL CORPORATION |
| 17908255 | OXIME ESTER PHOTOINITIATORS | Final Rejection | BASF SE |
| 18570518 | COMPOSITION FOR REMOVING EDGE BEAD OF METAL-CONTAINING RESIST AND METHOD FOR FORMING PATTERN COMPRISING STEP OF REMOVING EDGE BEAD BY USING SAME | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18507311 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME AND COLOR FILTER | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18382734 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME, AND COLOR FILTER | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18213185 | RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18545034 | PELLICLE MEMBRANE, PELLICLE ASSEMBLY INCLUDING THE SAME AND METHOD OF MANUFACTURING THE PELLICLE ASSEMBLY | Non-Final OA | SK hynix Inc. |
| 18387619 | METHOD TO PATTERN A SEMICONDUCTOR SUBSTRATE USING A MULTILAYER PHOTORESIST FILM STACK | Non-Final OA | Tokyo Electron Limited |
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