Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713 1722 1737
This examiner grants 46% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18344992 | PHOTORESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | Final Rejection | Samsung Electronics Co., Ltd. |
| 18047030 | PHOTOACID GENERATOR, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN USING THE PHOTOACID GENERATOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17847794 | METHOD FOR FORMING PHOTORESIST PATTERNS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18022762 | CHEMICALLY AMPLIFIED RESIST COMPOSITION AND METHOD FOR MANUFACTURING RESIST FILM USING THE SAME | Non-Final OA | Merck Patent GmbH |
| 17612058 | A NEGATIVE TONE LIFT OFF RESIST COMPOSITION COMPRISING AN ALKALI SOLUBLE RESIN AND A PHOTO ACID GENERATOR, AND A METHOD FOR MANUFACTURING METAL FILM PATTERNS ON A SUBSTRATE. | Final Rejection | Merck Patent GmbH |
| 18468245 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 18446045 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, POSITIVE TONE PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Final Rejection | FUJIFILM Corporation |
| 16964038 | PHOTORESIST RESIN, PRODUCTION METHOD FOR PHOTORESIST RESIN, PHOTORESIST RESIN COMPOSITION, AND PATTERN FORMATION METHOD | Final Rejection | DAICEL CORPORATION |
| 17908255 | OXIME ESTER PHOTOINITIATORS | Non-Final OA | BASF SE |
| 18570518 | COMPOSITION FOR REMOVING EDGE BEAD OF METAL-CONTAINING RESIST AND METHOD FOR FORMING PATTERN COMPRISING STEP OF REMOVING EDGE BEAD BY USING SAME | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18545034 | PELLICLE MEMBRANE, PELLICLE ASSEMBLY INCLUDING THE SAME AND METHOD OF MANUFACTURING THE PELLICLE ASSEMBLY | Non-Final OA | SK hynix Inc. |
| 18271758 | POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME | Final Rejection | ASAHI KASEI KABUSHIKI KAISHA |
| 18424322 | METHOD FOR REMOVING DEFECT ON EUV MASK | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18424025 | RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, AND POLYMER | Non-Final OA | TOKYO OHKA KOGYO CO., LTD. |
| 18260917 | PROTECTIVE FILM FORMING AGENT, AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP | Final Rejection | TOKYO OHKA KOGYO CO., LTD. |
| 18349633 | Resist Material And Patterning Process | Final Rejection | SHIN-ETSU CHEMICAL CO., LTD. |
| 18331314 | Resist Underlayer Film Material, Patterning Process, And Method For Forming Resist Underlayer Film | Final Rejection | SHIN-ETSU CHEMICAL CO., LTD. |
| 18200874 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS | Final Rejection | Shin-Etsu Chemical Co., Ltd. |
| 18142910 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS | Final Rejection | Shin-Etsu Chemical Co., Ltd. |
| 17667895 | SALT, ACID GENERATOR, RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN | Non-Final OA | SUMITOMO CHEMICAL COMPANY, LIMITED |
| 18391906 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION | Final Rejection | JSR CORPORATION |
| 18528951 | SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND COMPOSITION | Non-Final OA | JSR CORPORATION |
| 18135838 | RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING PATTERN, POLYMER, AND COMPOUND | Final Rejection | JSR CORPORATION |
| 18267192 | METHOD OF PREPARING FILM AND COMPOSITION THEREFOR | Non-Final OA | DOW SILICONES CORPORATION |
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