Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713 1722 1737
This examiner grants 46% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18344992 | PHOTORESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17939153 | ADDITIVE FOR PHOTORESIST, PHOTORESIST COMPOSITION FOR EUV INCLUDING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17908255 | OXIME ESTER PHOTOINITIATORS | Non-Final OA | BASF SE |
| 17942677 | RESIN COMPOSITION, FILM, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE | Final Rejection | FUJIFILM Corporation |
| 17486125 | COMPOUND, POLYMERIZABLE COMPOSITION, CURED PRODUCT, OPTICAL FILM, POLARIZING PLATE, AND IMAGE DISPLAY DEVICE | Final Rejection | FUJIFILM Corporation |
| 16964038 | PHOTORESIST RESIN, PRODUCTION METHOD FOR PHOTORESIST RESIN, PHOTORESIST RESIN COMPOSITION, AND PATTERN FORMATION METHOD | Non-Final OA | DAICEL CORPORATION |
| 17612058 | A NEGATIVE TONE LIFT OFF RESIST COMPOSITION COMPRISING AN ALKALI SOLUBLE RESIN AND A PHOTO ACID GENERATOR, AND A METHOD FOR MANUFACTURING METAL FILM PATTERNS ON A SUBSTRATE. | Non-Final OA | Merck Patent GmbH |
| 18349633 | Resist Material And Patterning Process | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18331314 | Resist Underlayer Film Material, Patterning Process, And Method For Forming Resist Underlayer Film | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18142910 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18124929 | RESIST COMPOSITION AND PATTERN FORMING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18180946 | RESIST MATERIAL AND PATTERNING PROCESS | Final Rejection | SHIN-ETSU CHEMICAL CO., LTD. |
| 17108223 | ONIUM SALT COMPOUND, CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18213185 | RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 17600381 | BISMALEIMIDE COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION USING SAME, CURED PRODUCT THEREOF, AND SEMICONDUCTOR ELEMENT | Final Rejection | NIPPON KAYAKU KABUSHIKI KAISHA |
| 18260917 | PROTECTIVE FILM FORMING AGENT, AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP | Non-Final OA | TOKYO OHKA KOGYO CO., LTD. |
| 18254802 | RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | Non-Final OA | TOKYO OHKA KOGYO CO., LTD. |
| 18267192 | METHOD OF PREPARING FILM AND COMPOSITION THEREFOR | Non-Final OA | DOW SILICONES CORPORATION |
| 18391906 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION | Non-Final OA | JSR CORPORATION |
| 18135838 | RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING PATTERN, POLYMER, AND COMPOUND | Final Rejection | JSR CORPORATION |
| 17823426 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF PRODUCING PATTERNED CURED PRODUCT USING THE SAME, AND CURED PRODUCT OF PHOTOSENSITIVE RESIN COMPOSITION | Non-Final OA | Showa Denko Materials Co., Ltd. |
| 17767655 | PHOTOSENSITIVE RESIN FILM, RESIST PATTERN FORMING METHOD, AND WIRING PATTERN FORMING METHOD | Non-Final OA | Showa Denko Materials Co., Ltd. |
| 17634927 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRODUCTION METHOD FOR MULTILAYER PRINTED WIRING BOARD | Final Rejection | Showa Denko Materials Co., Ltd. |
| 17490923 | IODINE-CONTAINING ACID CLEAVABLE COMPOUNDS, POLYMERS DERIVED THEREFROM, AND PHOTORESIST COMPOSITIONS | Non-Final OA | ROHM AND HAAS ELECTRONIC MATERIALS LLC |
| 18044390 | I-LINE NEGATIVE PHOTORESIST COMPOSITION FOR REDUCING HEIGHT DIFFERENCE BETWEEN CENTER AND EDGE AND REDUCING LER, AND I-LINE NEGATIVE PHOTORESIST COMPOSITION FOR IMPROVING PROCESS MARGIN | Final Rejection | YOUNG CHANG CHEMICAL CO., LTD |
| 17730227 | MODIFIED FILM-FORMING RESIN CONTAINING ACID INHIBITOR, PREPARATION METHOD THEREFOR, AND PHOTORESIST COMPOSITION | Non-Final OA | JIANGSU NATA OPTO- ELECTRONIC MATERIAL CO., LTD. |
| 17633383 | Resin Composition, Method for Manufacturing Cured Product, Cured Product, Patterned Cured Product, Interlayer Insulation Film, Cover Coating Layer, Surface Protection Film, and Electronic Component | Non-Final OA | HD Microsystems, Ltd. |
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