Tech Center 2800 • Art Units: 2817
This examiner grants 96% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18214341 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18334100 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18376287 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND ENHANCED ELECTRICAL PROPERTIES | Non-Final OA | Applied Materials, Inc. |
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