Tech Center 2800 • Art Units: 1713 2817
This examiner grants 97% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18365259 | SEMICONDUCTOR PACKAGE ASSEMBLY | Non-Final OA | MEDIATEK INC. |
| 18559958 | TUNGSTEN WORDLINE FILL IN HIGH ASPECT RATIO 3D NAND ARCHITECTURE | Non-Final OA | Lam Research Corporation |
| 18612214 | SEMICONDUCTOR DEVICE | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18484581 | SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREOF | Non-Final OA | ENKRIS SEMICONDUCTOR, INC. |
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