Listed by the USPTO as NGUYEN, DAO H
Tech Center 4100 • Art Units: 2818 4100
This examiner grants 91% of resolved cases
NGUYEN, DAO H works in Technology Center 4100 and Art Unit 2818. The record includes 1276 resolved cases and an allowance rate of 91.4%, indicating a strong allowance profile across substantial activity. The median time to allowance is 713 days, providing an important timing reference for applicants coordinating prosecution with technical development or market plans.
The interview lift is 5.7%, showing a modest association with allowance outcomes. Practitioners may use interviews selectively for clarification, while emphasizing complete written responses and well-supported claim scope. The leading companies are Taiwan Semiconductor Manufacturing Company, Ltd., Samsung Electronics Co., Ltd., and LG Display Co., Ltd. The leading firms are Haynes and Boone, LLP (24061), JCIPRNET, and BIRCH STEWART KOLASCH & BIRCH, LLP.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18800139 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18753484 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18383404 | ORGANIC LIGHT EMITTING DISPLAY APPARATUS | Final Rejection | LG Display Co., Ltd. |
| 18673326 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SEIKO EPSON CORPORATION |
| 18324071 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18459664 | INTEGRATED CIRCUIT DEVICES WITH BACKSIDE BIT LINES AND WORD LINES | Non-Final OA | Intel Corporation |
| 18716457 | Manufacturing method of a system in package having several layers and associated manufacturing installation | Non-Final OA | THALES |
| 18324231 | STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18701399 | ENCLOSURE | Non-Final OA | Schott AG |
| 18750465 | SEMICONDUCTOR DEVICE WITH HIGH VOLTAGE TERMINATION | Non-Final OA | Infineon Technologies Austria AG |
| 18776907 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18433234 | TRENCH AND CHANNEL GAP FILL TUNING FOR FLOWABLE CHEMICAL VAPOR DEPOSITION (FCVD) FILMS | Non-Final OA | Applied Materials, Inc. |
| 18779109 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18769807 | STACKED SEMICONDUCTOR STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18770177 | SEMICONDUCTOR DEVICE WITH BACKSIDE CONTACT AND METHODS OF FORMING SUCH | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18633920 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18474606 | THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18463062 | HEAT SINK FOR STACKED MULTI-GATE DEVICE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18895019 | SEMICONDUCTOR PACKAGES AND THE MANUFACTURING PROCESSES THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18773308 | FIELD EFFECT TRANSISTOR WITH FIN ISOLATION STRUCTURE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18768952 | Semiconductor Device Structure With Uniform Threshold Voltage Distribution and Method of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18666215 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18386456 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOW-K DRAIN-SELECT-LEVEL ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18179858 | LATERAL SILICON BRIDGE FOR STACKED DIES | Final Rejection | Advanced Micro Devices, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy91.4% of resolved applications examined by Dao H Nguyen were allowed (1,276 resolved cases), compared with 85.2% across Art Unit 2818 over the last five years.
This examiner's interview lift is +5.7 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Dao H Nguyen took 713 days on average from filing to allowance.
Dao H Nguyen examines applications in Art Unit 2818 in Tech Center 4100.
