Technology area: Semiconductors, Circuits & Optics
23 pending office actions • 13 art units • 23 examiners • 0 of 23 (0%) have an AI response strategy ready • 38 patents granted in the last 365 days
CreeLED Inc. has 22 pending office actions in Semiconductors, Circuits & Optics. Each matter is associated with a distinct examiner, while the docket spans 13 distinct art units. This combination indicates complete examiner distribution and repeated activity across technical classifications.
ELAHI, TOWFIQ is the busiest examiner, with 1 pending matter. The profile favors matter-specific examiner preparation, supported by art-unit review where multiple matters share a semiconductor, circuit, or optics classification.
Based on the USPTO statutory response window for each pending office action. 5 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 5 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 6 (26%) |
| §102 only | 2 (9%) |
| Double-patenting only | 1 (4%) |
| Multi-statute (no §101) | 14 (61%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| ELAHI, TOWFIQ | 1 | 79.7% | +14.4% |
| CHAN, WEI | 1 | 74.7% | +13.8% |
| SUN, MICHAEL BRENNAN | 1 | 100.0% | +0.0% |
| VU, VU A | 1 | 92.3% | +6.7% |
| SMITH, BRADLEY | 1 | 80.0% | -2.8% |
| DULKA, JOHN P | 1 | 83.8% | +12.3% |
| ANYA, IGWE U | 1 | 85.1% | -3.8% |
| NGUYEN, DAO H | 1 | 91.4% | +5.7% |
| WALL, VINCENT | 1 | 62.6% | +24.4% |
| XU, ZHIJUN | 1 | 77.3% | +11.4% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18726556 | STRUCTURES FOR LIGHT-EMITTING DIODE PACKAGES WITH MULTIPLE LIGHT-EMITTING DIODE CHIPS | DULKA, JOHN P | — |
| 18645598 | LANDING PAD STRUCTURES FOR CONTACTS IN LIGHT-EMITTING DIODE CHIPS AND RELATED METHODS | NGUYEN, DAO H | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18512165 | MULTIPLE CHIP LED PACKAGES WITH COMMON ELECTRODES | JEFFERSON, QUOVAUNDA | 17d overdue |
| 17494264 | LUMIPHORIC MATERIAL ARRANGEMENTS FOR MULTIPLE-JUNCTION LIGHT-EMITTING DIODES | HSIEH, HSIN YI | 12d |
| 19414506 | LIGHT-EMITTING DIODE PACKAGES WITH VARYING CURRENT PULSE WIDTH MODULATION AND RELATED METHODS | ELAHI, TOWFIQ | — |
| 18887256 | MULTI-LAYER REFLECTIVE STRUCTURES FOR LIGHT-EMITTING DIODE CHIPS AND RELATED METHODS | SUN, MICHAEL BRENNAN | — |
| 18812005 | LENS STRUCTURES FOR LIGHT-EMITTING DIODE (LED) CHIPS IN LED PACKAGES | VU, VU A | — |
| 18770162 | LUMIPHORIC MATERIAL STRUCTURES WITHIN LIGHT-EMITTING DIODES AND RELATED METHODS | SMITH, BRADLEY | — |
| 18669969 | LONG-PASS FILTER STRUCTURES FOR LIGHT-EMITTING DIODES | ANYA, IGWE U | — |
| 18597406 | ANCHORED ENCAPSULATION IN LED DEVICES | WALL, VINCENT | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 5 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 19414506 | LIGHT-EMITTING DIODE PACKAGES WITH VARYING CURRENT PULSE WIDTH MODULATION AND RELATED METHODS | ELAHI, TOWFIQ | — |
| 19311207 | ACTIVE CONTROL OF LIGHT EMITTING DIODES AND LIGHT EMITTING DIODE DISPLAYS | CHAN, WEI | — |
| 18726556 | STRUCTURES FOR LIGHT-EMITTING DIODE PACKAGES WITH MULTIPLE LIGHT-EMITTING DIODE CHIPS | DULKA, JOHN P | — |
| 18597406 | ANCHORED ENCAPSULATION IN LED DEVICES | WALL, VINCENT | — |
| 18589641 | LIGHT-EMITTING DIODE CHIP STRUCTURES WITH ELECTRODE EXTENSIONS AND GRADIENT VIAS | XU, ZHIJUN | — |
| Art Unit | Apps |
|---|---|
| 2817 | 7 |
| 2891 | 2 |
| 2818 | 2 |
| 2898 | 2 |
| 2899 | 2 |
| 2625 | 1 |
| 2845 | 1 |
| 2892 | 1 |
| 2897 | 1 |
| 2893 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19414506 | LIGHT-EMITTING DIODE PACKAGES WITH VARYING CURRENT PULSE WIDTH MODULATION AND RELATED METHODS | ELAHI, TOWFIQ | 2625 | §102§103Other | Non-Final OA | — | Pending | Dec 10, 2025 |
| 19311207 | ACTIVE CONTROL OF LIGHT EMITTING DIODES AND LIGHT EMITTING DIODE DISPLAYS | CHAN, WEI | 2845 | DP | Non-Final OA | — | Pending | Aug 27, 2025 |
| 18887256 | MULTI-LAYER REFLECTIVE STRUCTURES FOR LIGHT-EMITTING DIODE CHIPS AND RELATED METHODS | SUN, MICHAEL BRENNAN | 2892 | §102§103 | Non-Final OA | — | Pending | Sep 17, 2024 |
| 18812005 | LENS STRUCTURES FOR LIGHT-EMITTING DIODE (LED) CHIPS IN LED PACKAGES | VU, VU A | 2897 | §102§103 | Non-Final OA | — | Pending | Aug 22, 2024 |
| 18770162 | LUMIPHORIC MATERIAL STRUCTURES WITHIN LIGHT-EMITTING DIODES AND RELATED METHODS | SMITH, BRADLEY | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18726556 | STRUCTURES FOR LIGHT-EMITTING DIODE PACKAGES WITH MULTIPLE LIGHT-EMITTING DIODE CHIPS | DULKA, JOHN P | 2817 | §103 | Non-Final OA | — | Pending | Jul 03, 2024 |
| 18669969 | LONG-PASS FILTER STRUCTURES FOR LIGHT-EMITTING DIODES | ANYA, IGWE U | 2891 | §102§103 | Non-Final OA | — | Pending | May 21, 2024 |
| 18645598 | LANDING PAD STRUCTURES FOR CONTACTS IN LIGHT-EMITTING DIODE CHIPS AND RELATED METHODS | NGUYEN, DAO H | 2818 | §102 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18597406 | ANCHORED ENCAPSULATION IN LED DEVICES | WALL, VINCENT | 2898 | §102§103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18589641 | LIGHT-EMITTING DIODE CHIP STRUCTURES WITH ELECTRODE EXTENSIONS AND GRADIENT VIAS | XU, ZHIJUN | 2818 | §102§103 | Final Rejection | — | Pending | Feb 28, 2024 |
| 18512165 | MULTIPLE CHIP LED PACKAGES WITH COMMON ELECTRODES | JEFFERSON, QUOVAUNDA | 2899 | §102§103 | Non-Final OA | 17d overdue | Pending | Nov 17, 2023 |
| 18508373 | ANCHORED LIGHT MIXING STRUCTURES IN LED PACKAGES AND RELATED METHODS | LIU, BENJAMIN T | 2893 | §102§103 | Final Rejection | — | Pending | Nov 14, 2023 |
| 18244354 | MULTI-PLANARITY OF LIGHT EMITTING SURFACES IN LED COMPONENTS | CHEN, DAVID Z | 2815 | §102 | Non-Final OA | 10d overdue | Pending | Sep 11, 2023 |
| 18239145 | WIRE GRID POLARIZATION STRUCTURE FOR CURRENT SPREADING AND POLARIZATION CONTROL | FEATHERLY, HANA SANEI | 2875 | §102§103 | Final Rejection | — | Pending | Aug 29, 2023 |
| 18456877 | SOLID STATE LIGHT EMITTING COMPONENTS WITH UNITARY LENS STRUCTURES | MILLER, ALEXANDER MICHAEL | 2898 | §103§112 | Final Rejection | — | Pending | Aug 28, 2023 |
| 18446656 | MOUNTING STRUCTURES FOR EDGE-EMITTING SEMICONDUCTOR DEVICES | IQBAL, HAMNA FATHIMA | 2817 | §103 | Final Rejection | — | Pending | Aug 09, 2023 |
| 18203868 | COVER STRUCTURE FOR BEAMSHAPING FOR LIGHT EMITTING DIODE PACKAGES | LIU, MIKKA H | 2817 | §102§103 | Non-Final OA | — | Pending | May 31, 2023 |
| 18093373 | SIDEWALL ARRANGEMENTS FOR LIGHT-EMITTING DIODE DEVICES AND RELATED METHODS | BELL, LAUREN R | 2896 | §103 | Non-Final OA | 26d | Pending | Jan 05, 2023 |
| 17885765 | LIGHT EMITTING DEVICE WITH LIGHT-ALTERING MATERIAL LAYER, AND FABRICATION METHOD UTILIZING SEALING TEMPLATE | DUREN, TIMOTHY EDWARD | 2817 | §103 | Non-Final OA | 78d | Pending | Aug 11, 2022 |
| 17809132 | THERMAL PAD STRUCTURES FOR LED PACKAGES WITH REDUCED SIZES | KOLB, THADDEUS J | 2817 | §103 | Non-Final OA | — | Pending | Jun 27, 2022 |
| 17686943 | ENCAPSULATION ARRANGEMENTS IN LIGHT-EMITTING DIODE PACKAGES | GOODWIN, DAVID J | 2817 | §103 | Non-Final OA | — | Pending | Mar 04, 2022 |
| 17539685 | LIGHT-EMITTING DIODE CHIPS AND MANUFACTURING PROCESSES THEREOF | YEMELYANOV, DMITRIY | 2891 | §103§112 | Final Rejection | — | Pending | Dec 01, 2021 |
| 17494264 | LUMIPHORIC MATERIAL ARRANGEMENTS FOR MULTIPLE-JUNCTION LIGHT-EMITTING DIODES | HSIEH, HSIN YI | 2899 | §102§103§112 | Non-Final OA | 12d | Pending | Oct 05, 2021 |
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Start Free TrialCreeLED Inc. has 23 pending office actions as of October 2026, spread across 13 art units and 23 examiners.
Towfiq Elahi has the most, with 1 of CreeLED Inc.'s pending office actions.
Mostly Semiconductors, Circuits & Optics (USPTO Tech Center 2800), based on where its pending office actions are examined.
