Listed by the USPTO as NGUYEN, THANH T
Tech Center 2800 • Art Units: 2144 2444 2448 2813 2893
This examiner grants 83% of resolved cases
NGUYEN, THANH T is associated with USPTO Technology Center 2800 and art unit 2144. The record contains 1427 resolved cases, with an allowance rate of 83.4%. The median time to allowance is 1022 days. Interview lift is 14.3%, which supports treating examiner interviews as a potentially useful component of prosecution in this docket.
The principal companies listed are Taiwan Semiconductor Manufacturing Company, Ltd., Samsung Display Co., Ltd., and BOE Technology Group Co., Ltd. The listed firms are Xsensus, Bayes PLLC, and CANTOR COLBURN LLP. The large resolved-case record provides substantial activity context for the allowance and timing figures. Practitioners can use the allowance rate to assess expected prosecution posture, while the interview result supports preparing a technically precise discussion when written amendments alone may not resolve the outstanding issues. The median timing also favors early attention to continuation and portfolio planning.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18456647 | SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18588698 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18433990 | DISPLAY APPARATUS AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18686604 | Oxide Semiconductor Layer, Thin Film Transistor and Manufacturing Method Therefor, Display Panel, and Display Device | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18285879 | DISPLAY PANEL AND METHOD FOR PREPARING THE SAME, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18060596 | THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING | Non-Final OA | Intel Corporation |
| 17031719 | 3D HETEROGENEOUS INTEGRATED CRYSTALLINE PIEZOELECTRIC BULK ACOUSTIC RESONATORS | Non-Final OA | Intel Corporation |
| 18684591 | IN-SITU CORE PROTECTION IN MULTI-PATTERNING | Non-Final OA | Lam Research Corporation |
| 18345939 | SUBSTRATE CONTACT INTEGRATION IN GALLIUM NITRIDE DEVICES | Final Rejection | Texas Instruments Incorporated |
| 18308303 | LASER DICING TO CONTROL SPLASH | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18429479 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18128506 | SEMICONDUCTOR DEVICE COMPRISING CONTACT PAD STRUCTURE | Final Rejection | Infineon Technologies AG |
| 18629386 | TRANSISTOR DEVICE HAVING A CAPACITIVE VOLTAGE DIVIDER CIRCUIT | Non-Final OA | Infineon Technologies Austria AG |
| 18204039 | SEMICONDUCTOR DEVICE, FABRICATING METHOD, MEMORY DEVICE AND DEVICE SYSTEM | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18242812 | CORRECTION OF GLOBAL CURVATURE DURING STRESS MANAGEMENT | Non-Final OA | Applied Materials, Inc. |
| 18787422 | METHOD FOR LOW-COST, HIGH-BANDWIDTH MONOLITHIC SYSTEM INTEGRATION BEYOND RETICLE LIMIT | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18420232 | MICRO-ELECTROMECHANICAL MICROPHONES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18482632 | INTEGRATED CIRCUIT PACKAGES AND METHODS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18462499 | FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing co., Ltd. |
| 18606990 | SEMICONDUCTOR STRUCTURE | Non-Final OA | ENKRIS SEMICONDUCTOR, INC. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy83.4% of resolved applications examined by Thanh T Nguyen were allowed (1,427 resolved cases), compared with 60.2% across Art Unit 2144 over the last five years.
This examiner's interview lift is +14.3 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Thanh T Nguyen took 1,022 days on average from filing to allowance.
Thanh T Nguyen examines applications in Art Unit 2144 in Tech Center 2800 (Semiconductors, Circuits & Optics).
