Technology area: Semiconductors, Circuits & Optics
53 pending office actions • 2 clients • 50 examiners • 25 art units • 0 of 53 (0%) have an AI response strategy ready • 2 patents granted in the last 365 days
onsemi (BHB) operates in Semiconductors, Circuits & Optics and shows 53 pending office actions across 30052 career applications. Its resolved allowance rate is 87.43%, indicating that the recorded resolved matters reached allowance at a high frequency.
The average of 3.67 office actions per allowance indicates that allowance commonly follows multiple prosecution events. The combination of a large application history and an active pending docket supports structured docket monitoring, consistent amendment practice, and careful attention to recurring examination issues.
Based on the USPTO statutory response window for each pending office action. 11 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 11 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 1 (2%) |
| §103 only | 16 (30%) |
| §102 only | 2 (4%) |
| §112 only | 1 (2%) |
| Double-patenting only | 2 (4%) |
| Multi-statute (no §101) | 30 (57%) |
| No statute on record | 1 (2%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| VU, VU A | 2 | 92.3% | +6.7% |
| ARROYO, TERESA M | 2 | 72.0% | +23.2% |
| CIESLEWICZ, ANETA B | 2 | 66.9% | +0.2% |
| MORLAN, ROBERT M | 1 | 74.3% | +15.6% |
| JEAN PIERRE, PEGUY | 1 | 94.3% | -0.8% |
| ALLGOOD, ALESA M | 1 | 82.5% | +18.5% |
| GONZALEZ, MILTON | 1 | 77.7% | +12.7% |
| JACKSON, STEPHEN W | 1 | 92.5% | +7.3% |
| LIN, AMIE CHINYU | 1 | 84.4% | +30.9% |
| RETEBO, METASEBIA T | 1 | 89.6% | +5.2% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18955820 | FAULT PROTECTION TESTING IN A HIGH-POWER SWITCHING SYSTEM | JACKSON, STEPHEN W | — |
| 18795699 | TAPE HEATING METHODS | VU, VU A | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | CIESLEWICZ, ANETA B | 16d overdue |
| 18341958 | ELECTROPLATING SYSTEMS AND METHODS | MENDEZ, ZULMARIAM | 12d |
| 17814566 | HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL | BULLARD-CONNOR, GENEVIEVE GRACE | 23d |
| 18533355 | TRANSISTOR WITH INTEGRATED SOURCE-DRAIN DIODE | MINNEY, GABRIEL SEBASTIAN | 70d |
| 17814750 | POWER DEVICE INCLUDING METAL LAYER | NGUYEN, THANH T | 79d |
| 19241981 | LOCALLY UNIQUE MAC ADDRESS RESOLUTION | MORLAN, ROBERT M | — |
| 19042666 | LOW POWER PHASE DETECTION | JEAN PIERRE, PEGUY | — |
| 19034535 | INDUCTIVE ANGULAR POSITION SENSOR | ALLGOOD, ALESA M | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 19241981 | LOCALLY UNIQUE MAC ADDRESS RESOLUTION | MORLAN, ROBERT M | — |
| 19034535 | INDUCTIVE ANGULAR POSITION SENSOR | ALLGOOD, ALESA M | — |
| 19018146 | HARMONIC DISTORTION REDUCTION IN INDUCTIVE POSITION SENSORS | GONZALEZ, MILTON | — |
| 18917293 | SECURE SERIAL BUS WITH AUTOMOTIVE APPLICATIONS | LIN, AMIE CHINYU | — |
| 18529657 | METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEMICONDUDCTOR STRUCTURES | ARROYO, TERESA M | — |
| 18193847 | SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS | ARROYO, TERESA M | — |
| Client (Assignee) | Pending OAs |
|---|---|
| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC | 52 |
| United Silicon Carbide, Inc. | 1 |
| Art Unit | Apps |
|---|---|
| 2893 | 8 |
| 2818 | 5 |
| 2897 | 4 |
| 2812 | 4 |
| 2899 | 4 |
| 1714 | 3 |
| 2898 | 3 |
| 2858 | 2 |
| 2838 | 2 |
| 3645 | 2 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19241981 | LOCALLY UNIQUE MAC ADDRESS RESOLUTION | Semiconductor Components Industries, LLC | MORLAN, ROBERT M | 2409 | §102§103 | Non-Final OA | — | Pending | Jun 18, 2025 |
| 19042666 | LOW POWER PHASE DETECTION | Semiconductor Components Industries, LLC | JEAN PIERRE, PEGUY | 2845 | §102§103 | Non-Final OA | — | Pending | Jan 31, 2025 |
| 19034535 | INDUCTIVE ANGULAR POSITION SENSOR | Semiconductor Components Industries, LLC | ALLGOOD, ALESA M | 2858 | §103§112 | Non-Final OA | — | Pending | Jan 22, 2025 |
| 19018146 | HARMONIC DISTORTION REDUCTION IN INDUCTIVE POSITION SENSORS | Semiconductor Components Industries, LLC | GONZALEZ, MILTON | 2852 | Other | Non-Final OA | — | Pending | Jan 13, 2025 |
| 18955820 | FAULT PROTECTION TESTING IN A HIGH-POWER SWITCHING SYSTEM | Semiconductor Components Industries, LLC | JACKSON, STEPHEN W | 2838 | DP | Non-Final OA | — | Pending | Nov 21, 2024 |
| 18933202 | JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS | Semiconductor Components Industries, LLC | VU, VU A | 2897 | §102§103 | Non-Final OA | — | Pending | Oct 31, 2024 |
| 18917293 | SECURE SERIAL BUS WITH AUTOMOTIVE APPLICATIONS | Semiconductor Components Industries, LLC | LIN, AMIE CHINYU | 2436 | §101§102§103 | Final Rejection | — | Pending | Oct 16, 2024 |
| 18891830 | IMPROVED VOLTAGE BUFFER | Semiconductor Components Industries, LLC | RETEBO, METASEBIA T | 2836 | §102§103 | Non-Final OA | — | Pending | Sep 20, 2024 |
| 18799472 | IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER | Semiconductor Components Industries, LLC | RAHMAN, KHATIB A | 2818 | §102§103 | Non-Final OA | — | Pending | Aug 09, 2024 |
| 18796826 | SYSTEM AND METHOD FOR GATE THRESHOLD VOLTAGE MEASUREMENT | Semiconductor Components Industries, LLC | AGARED, GABRIEL T | 2837 | §102§103 | Final Rejection | — | Pending | Aug 07, 2024 |
| 18795699 | TAPE HEATING METHODS | Semiconductor Components Industries, LLC | VU, VU A | 2897 | §103 | Non-Final OA | — | Pending | Aug 06, 2024 |
| 18791299 | LOW ENERGY PHOTON DETECTION WITH CMOS IMAGERS | Semiconductor Components Industries, LLC | DANG, PHILIP | 2488 | §103 | Non-Final OA | 26d | Pending | Jul 31, 2024 |
| 18787369 | OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES | Semiconductor Components Industries, LLC | MIHALIOV, DMITRI | 2812 | §103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18775336 | METHOD OF FABRICATING SUPER-JUNCTION BASED VERTICAL GALLIUM NITRIDE JFET AND MOSFET POWER DEVICES | Semiconductor Components Industries, LLC | BOOTH, RICHARD A | 2812 | DP | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18755366 | SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING | Semiconductor Components Industries, LLC | MUSE, ISMAIL A | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18738193 | MANAGING THE GROWTH OF SILICON CARBIDE CRYSTALS | Semiconductor Components Industries, LLC | SONG, MATTHEW J | 1714 | §102§103 | Non-Final OA | — | Pending | Jun 10, 2024 |
| 18676316 | SEMICONDUCTOR PACKAGE AND RELATED METHODS | Semiconductor Components Industries, LLC | ENAD, CHRISTINE A | 2811 | §102§103 | Non-Final OA | — | Pending | May 28, 2024 |
| 18661875 | MANAGING GROWTH OF SILICON CARBIDE CRYSTALS | Semiconductor Components Industries, LLC | BRATLAND JR, KENNETH A | 1714 | §102§103§112 | Non-Final OA | — | Pending | May 13, 2024 |
| 18652203 | HIGH PHOTON RATE SPAD DEVICE | Semiconductor Components Industries, LLC | FLORES, MARK ANTHONY | 3648 | §102§103 | Non-Final OA | — | Pending | May 01, 2024 |
| 18647326 | METHOD OF TESTING A POWER TRANSISTOR | Semiconductor Components Industries, LLC | FREDERIKSEN, DAVID B | 2858 | §103 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18637126 | OPERATING MODE CONTROL TECHNIQUE FOR POWER FACTOR CORRECTION CIRCUITS | Semiconductor Components Industries, LLC | CORDOVA RODRIGUEZ, ULARISLAO | 2838 | §103 | Non-Final OA | — | Pending | Apr 16, 2024 |
| 18701585 | TERMINATION STRUCTURES FOR MOSFETS | Semiconductor Components Industries, LLC | BENTON, CHLOE ELAINE | 2899 | §102§103§112 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18634120 | SPLIT-GATE TRENCH SEMICONDUCTOR DEVICE HAVING STEPPED SHIELD ELECTRODE AND METHOD OF MANUFACTURING | Semiconductor Components Industries, LLC | SQUIRES, BRETT STEPHEN | 2899 | §102§103 | Non-Final OA | — | Pending | Apr 12, 2024 |
| 18631649 | HIDDEN ULTRASONIC SENSING SYSTEMS SUITABLE FOR ADVANCED DRIVER ASSISTANCE | Semiconductor Components Industries, LLC | ABULABAN, ABDALLAH | 3645 | §103 | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18621338 | PARTITIONED LEADFRAME FOR MULTI-DIE DISCRETE ELECTRONIC COMPONENTS | Semiconductor Components Industries, LLC | ARMAND, MARC ANTHONY | 2813 | §103 | Non-Final OA | — | Pending | Mar 29, 2024 |
| 18621005 | METHODS AND SYSTEMS OF LIGHT DETECTING AND RANGING | Semiconductor Components Industries, LLC | HULKA, JAMES R | 3645 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18608662 | POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT | Semiconductor Components Industries, LLC | AU, BAC H | 2898 | §102§103 | Final Rejection | — | Pending | Mar 18, 2024 |
| 18606922 | METHODS FOR SINGULATING SEMICONDUCTOR DIE FROM SILICON CARBIDE SUBSTRATES | Semiconductor Components Industries, LLC | ZARNEKE, DAVID A | 2891 | §102§103 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18592273 | MULTI-CHIP SEMICONDUCTOR MODULE WITH BALANCED SWITCHING | Semiconductor Components Industries, LLC | SANDVIK, BENJAMIN P | 2812 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18441484 | DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES | Semiconductor Components Industries, LLC | MUNOZ, ANDRES F | 2818 | §102§103 | Final Rejection | — | Pending | Feb 14, 2024 |
| 18533355 | TRANSISTOR WITH INTEGRATED SOURCE-DRAIN DIODE | United Silicon Carbide, Inc. | MINNEY, GABRIEL SEBASTIAN | 2897 | §102§103 | Final Rejection | 70d | Pending | Dec 08, 2023 |
| 18534065 | SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES | Semiconductor Components Industries, LLC | HENRY, CALEB E | 2818 | §102 | Final Rejection | 22d | Pending | Dec 08, 2023 |
| 18529657 | METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEMICONDUDCTOR STRUCTURES | Semiconductor Components Industries, LLC | ARROYO, TERESA M | 2893 | §103 | Non-Final OA | — | Pending | Dec 05, 2023 |
| 18488628 | ARC PREVENTION FOR BONDED WAFERS OF A CHIP STACK | Semiconductor Components Industries, LLC | FAN, SU JYA | 2818 | §103 | Final Rejection | — | Pending | Oct 17, 2023 |
| 18479316 | IMAGE SENSOR CHARGE DIRECTION STRUCTURES AND METHODS | Semiconductor Components Industries, LLC | BRADFORD, PETER | 2897 | §103 | Non-Final OA | — | Pending | Oct 02, 2023 |
| 18478296 | WIRE-IN-DAM PACKAGES AND RELATED SYSTEMS AND METHODS | Semiconductor Components Industries, LLC | SWANSON, ANDREW L | 2896 | §102 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18478115 | PACKAGE TRAYS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS | Semiconductor Components Industries, LLC | BRASFIELD, QUINTON A | 2814 | §102§103 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18473998 | POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER | Semiconductor Components Industries, LLC | SRINIVASAN, SESHA SAIRAMAN | 2817 | §103 | Final Rejection | — | Pending | Sep 25, 2023 |
| 18462082 | IMAGE SENSOR PACKAGES AND RELATED METHODS | Semiconductor Components Industries, LLC | KOLB, THADDEUS J | 2817 | §102§103 | Final Rejection | — | Pending | Sep 06, 2023 |
| 18446127 | COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS | Semiconductor Components Industries, LLC | STEPHENSON, KENNETH STEPHEN | 2898 | §103 | Final Rejection | 19d overdue | Pending | Aug 08, 2023 |
| 18353148 | COMPACT DIRECT-BONDED METAL SUBSTRATE PACKAGE | Semiconductor Components Industries, LLC | CIESLEWICZ, ANETA B | 2893 | §103 | Final Rejection | — | Pending | Jul 17, 2023 |
| 18341958 | ELECTROPLATING SYSTEMS AND METHODS | Semiconductor Components Industries, LLC | MENDEZ, ZULMARIAM | 1794 | §102§103 | Non-Final OA | 12d | Pending | Jun 27, 2023 |
| 18308467 | MOLDED POWER MODULES | Semiconductor Components Industries, LLC | KLEIN, JORDAN M | 2893 | §103 | Final Rejection | 28d | Pending | Apr 27, 2023 |
| 18193847 | SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS | Semiconductor Components Industries, LLC | ARROYO, TERESA M | 2893 | §102§103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18185548 | EDGE SEALS FOR SEMICONDUCTOR DEVICES | Semiconductor Components Industries, LLC | PURVIS, SUE A | 2893 | §102§103§112 | Non-Final OA | — | Pending | Mar 17, 2023 |
| 18182552 | INTEGRATED SUBSTRATES AND RELATED METHODS | Semiconductor Components Industries, LLC | HIBBERT, DANIEL JOHNATHAN | 2899 | §103 | Non-Final OA | — | Pending | Mar 13, 2023 |
| 18174837 | SANDWICH PACKAGE FOR MICROELECTRONICS | Semiconductor Components Industries, LLC | HUTSON, NICHOLAS LELAND | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 27, 2023 |
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | Semiconductor Components Industries, LLC | CIESLEWICZ, ANETA B | 2893 | §103§112 | Final Rejection | 16d overdue | Pending | Nov 14, 2022 |
| 18053796 | SEMICONDUCTOR CRYSTAL GROWTH USING SOURCE POWDER FROM CRUCIBLE WALL | Semiconductor Components Industries, LLC | QI, HUA | 1714 | §112 | Non-Final OA | 16d overdue | Pending | Nov 09, 2022 |
| 17822403 | IMAGE SENSOR BALL GRID ARRAY PACKAGE | Semiconductor Components Industries, LLC | LASASSO, VICTOR JOSEPH | 2898 | §103 | Non-Final OA | 53d | Pending | Aug 25, 2022 |
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Start Free Trial87.4% of resolved applications prosecuted by Onsemi were allowed, across 30,052 applications in USPTO records.
3.67 office actions per allowed application on average.
53 pending office actions as of October 2026, for 2 clients, before 50 examiners in 25 art units.
