Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18664753 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18540008 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18537912 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18541085 | DISPLAY APPARATUS | Final Rejection | LG Display Co., Ltd. |
| 18540471 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18634167 | MICROELECTROMECHANICAL COMPONENT | Non-Final OA | Robert Bosch GmbH |
| 18589172 | PACKAGE COMPRISING A SUBSTRATE INCLUDING A VIA INTERCONNECT WITH A PARTIAL CONCENTRIC PLANAR CROSS SECTION | Non-Final OA | QUALCOMM Incorporated |
| 18346212 | TWO-TERMINAL FERROELECTRIC PEROVSKITE DIODE MEMORY ELEMENT | Non-Final OA | Intel Corporation |
| 18216914 | CONDUCTIVE LINES HAVING CONDUCTIVE METAL LINER FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Non-Final OA | Intel Corporation |
| 18738117 | SEMICONDUCTOR WAFER TEMPERATURE MEASUREMENT METHOD | Non-Final OA | Kioxia Corporation |
| 18587080 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Kioxia Corporation |
| 18617499 | SEMICONDUCTOR CHIP PACKAGES HAVING BOND OVER ACTIVE CIRCUIT (BOAC) STRUCTURES | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18664837 | MEMORY DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18620549 | SELF-ALIGNED CONTACT FORMATION ON SOURCE/DRAIN | Non-Final OA | Tokyo Electron Limited |
| 18785626 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
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