Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18634167 | MICROELECTROMECHANICAL COMPONENT | Non-Final OA | Robert Bosch GmbH |
| 18664753 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18589172 | PACKAGE COMPRISING A SUBSTRATE INCLUDING A VIA INTERCONNECT WITH A PARTIAL CONCENTRIC PLANAR CROSS SECTION | Non-Final OA | QUALCOMM Incorporated |
| 18654450 | PACKAGE AND SEMICONDUCTOR DEVICE | Non-Final OA | Sumitomo Electric Device Innovations, Inc. |
| 18664744 | DIRECT LIQUID COOLING OF SEMICONDUCTOR DEVICES | Non-Final OA | Littelfuse, Inc. |
| 18623391 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | ENKRIS SEMICONDUCTOR, INC. |
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