Tech Center 2800 • Art Units: 2812 2893
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18368372 | IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18518096 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18370536 | IN-SITU SIDEWALL PASSIVATION TOWARD THE BOTTOM OF HIGH ASPECT RATIO FEATURES | Non-Final OA | Applied Materials, Inc. |
| 18561435 | ELECTRONIC COMPONENT | Non-Final OA | TDK CORPORATION |
| 18520946 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18385499 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18501170 | FERROELECTRIC CAPACITIVE MEMORY DEVICES WITH A MULTIPLE-WORK-FUNCTION ELECTRODE | Non-Final OA | GlobalFoundries Singapore Pte. Ltd. |
| 18117140 | LEAD FRAME AND METHOD FOR MANUFACTURING LEAD FRAME | Non-Final OA | Mitsui High-tec, Inc. |
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