Tech Center 2800 • Art Units: 2817
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18799115 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18411050 | ELECTRONIC DEVICE | Non-Final OA | Innolux Corporation |
| 18809484 | BREAKING METHOD | Non-Final OA | DISCO CORPORATION |
| 18768400 | FLASH MEMORY DEVICE AND METHOD FOR FORMING THE SAME | Non-Final OA | Winbond Electronics Corp. |
| 18412005 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
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