Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2835 2847 2848 2896
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18745592 | ELECTRONIC DEVICE INCLUDING INTERPOSER AND METHOD FOR MANUFACTURING SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18666570 | ELECTRONIC DEVICE INCLUDING SHIELDING STRUCTURE FOR REDUCING MOUNTING VOLUME OF COMPONENT | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18697333 | FLEXIBLE PRINTED CIRCUIT BOARD, DISPLAY MODULE, AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18734526 | MOUNT BOARD AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | DENSO CORPORATION |
| 18614134 | ORTHOGONAL SYSTEM ARCHITECTURE AND NETWORK DEVICE | Non-Final OA | Huawei Technologies Co., Ltd. |
| 18672357 | BATTERY CABINET WITH BLIND MATE CONNECTORS | Non-Final OA | VERTIV CORPORATION |
| 18088460 | COIL STRUCTURE TO CONTROL VIA IMPEDANCE | Non-Final OA | Intel Corporation |
| 18652581 | PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT | Final Rejection | Micron Technology, Inc. |
| 18734352 | HYBRID DTC EMBEDDING SUBSTRATE | Non-Final OA | QUALCOMM Incorporated |
| 18668345 | PPTC SMALL PLANAR SMD TEMPERATURE SENSORS AND OVERCURRENT DEVICES | Non-Final OA | Littelfuse, Inc. |
| 18716920 | BREAKAGE FEATURES PROVIDED FOR CIRCUIT BOARDS | Non-Final OA | Hewlett-Packard Development Company, L.P. |
| 18627184 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18019989 | Aerosol Generation Device with a Nested and Flexible PCB | Final Rejection | JT INTERNATIONAL S.A. |
| 18593723 | CIRCUIT BOARD WITH ALTERNATE COMPONENT INTEGRATION CAPABILITY | Non-Final OA | AIR DISTRIBUTION TECHNOLOGIES IP, LLC |
| 18666312 | OPTICAL MODULE AND OPTICAL TRANSCEIVER | Non-Final OA | FUJITSU OPTICAL COMPONENTS LIMITED |
| 18660812 | TRANSFER PRINTING HIGH-PRECISION DEVICES | Final Rejection | X Display Company Technology Limited |
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