Listed by the USPTO as TRAN, DZUNG
Tech Center 2800 • Art Units: 2829 2893
This examiner grants 84% of resolved cases
TRAN, DZUNG works in tech center 2800 and art unit 2829. Across 1072 resolved cases, the allowance rate is 83.7% and the interview lift is 5.6%. The median time to allowance is 826 days. The large record shows a high observed allowance measure and a modest positive interview association, giving practitioners distinct signals for outcome and interview planning.
The leading companies are Magnolia White Corporation, LG Display Co., Ltd., and BOE Technology Group Co., Ltd. The recurring firms are Xsensus, Ruggiero McAllister & McMahon LLC, and Almanac IP Advisors LLP. This participant mix supports a display-technology focus when evaluating claim scope, office-action responses, and interview preparation.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18749750 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18631666 | MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18884688 | Electroluminescent Display Device and Method of Manufacturing the Same | Non-Final OA | LG Display Co., Ltd. |
| 18814361 | TRANSPARENT DISPLAY PANEL AND TRANSPARENT DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18516658 | Display Device and Method for Manufacturing the Same | Final Rejection | LG Display Co., Ltd. |
| 18454310 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18579496 | DISPLAY PANEL, METHOD FOR PREPARING SAME, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18278674 | QUANTUM DOTS LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 17913789 | DISPLAY DEVICE, DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18316165 | LATERAL SEMICONDUCTOR DEVICE COMPRISING UNIT CELLS WITH HEXAGON CONTOURS | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18439360 | PACKAGE COMPRISING A SUBSTRATE AND A PASSIVE DEVICE | Final Rejection | QUALCOMM Incorporated |
| 18129872 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT WIDENING | Non-Final OA | Intel Corporation |
| 18389496 | POWER MODULE | Final Rejection | Kia Corporation |
| 18842740 | SUBSTRATE FOR FOREIGN MATERIAL ADHESION INSPECTION, FOREIGN MATERIAL ADHESION INSPECTION DEVICE, AND FOREIGN MATERIAL ADHESION INSPECTION METHOD | Non-Final OA | Mitsubishi Electric Corporation |
| 18575942 | SEMICONDUCTOR DEVICE | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18279020 | LIGHT EMITTING ELEMENT, DISPLAY DEVICE, MANUFACTURING METHOD OF LIGHT EMITTING ELEMENT, AND MANUFACTURING METHOD OF DISPLAY DEVICE | Non-Final OA | SHARP KABUSHIKI KAISHA |
| 18366914 | SEMICONDUCTOR STRUCTURE | Final Rejection | MEDIATEK INC. |
| 18393597 | GAA NANOSHEET FET WITH SOURCE/DRAIN EXTENSION | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18666401 | BOTTOM-UP GAP FILL USING NON-CONFORMAL POISONING | Non-Final OA | Applied Materials, Inc. |
| 18643788 | Integrated Circuit Package Structure with Thermelectric Self-Cooling Device | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18613141 | DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18522293 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Magnolia White Corporation |
| 18361920 | DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18616682 | THREE-DIMENSIONAL MEMORY DEVICE WITH INTEGRATED CONTACT AND SUPPORT STRUCTURE AND METHOD OF MAKING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18588849 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A REPLACEMENT ETCH-STOP LINER FOR LAYER CONTACT VIA STRUCTURES AND METHODS FOR FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18440017 | DIE PADDLE STANDOFFS IN SEMICONDUCTOR PACKAGES | Non-Final OA | NEXPERIA B.V. |
| 18467786 | REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE | Final Rejection | NEXPERIA B.V. |
| 18517471 | BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MANUFACTURING METHOD THEREOF | Final Rejection | TONG HSING ELECTRONIC INDUSTRIES, LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy83.7% of resolved applications examined by Dzung Tran were allowed (1,072 resolved cases), compared with 53.7% across Art Unit 2829 over the last five years.
This examiner's interview lift is +5.6 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Dzung Tran took 826 days on average from filing to allowance.
Dzung Tran examines applications in Art Unit 2829 in Tech Center 2800 (Semiconductors, Circuits & Optics).
