Listed by the USPTO as TUTTLE, ETHAN ALEXANDER
Tech Center 2800 • Art Units: 2800 2897
This examiner grants 0% of resolved cases
TUTTLE, ETHAN ALEXANDER works in USPTO technology center 2800 and art unit 2800. The profile contains 2 resolved cases, with a 0.0% allowance rate and a 0.0% interview lift. Median time to allowance is 1093 days.
Top company entries are Samsung Electronics Co., Ltd., Samsung Display Co., Ltd., and Taiwan Semiconductor Manufacturing Company, Ltd. The listed firms are NORTH AMERICA INTELLECTUAL PROPERTY CORPORATION, Eschweiler & Potashnik, LLC (TSMC), and FISH & RICHARDSON P.C. (TC). The small record requires substantial caution when using these measures for prosecution decisions.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18434122 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18434391 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18434108 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18419436 | DISPLAY APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 18475026 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18576036 | ARRAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18476868 | SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES WITH DIE-TO-DIE INTERFACES | Final Rejection | Avago Technologies International Sales Pte. Limited |
| 18745272 | METHODS AND APPARATUS FOR COOLING DIE STACKS | Non-Final OA | Adeia Semiconductor Bonding Technologies Inc. |
| 18692909 | SEMICONDUCTOR PACKAGE | Non-Final OA | LG INNOTEK CO., LTD. |
| 18653535 | THROUGH-CHIP VIAS EXTENDING THROUGH MULTIPLE CHIPS FOR TOP-DOWN POWER REDISTRIBUTION | Non-Final OA | International Business Machines Corporation |
| 18478798 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18407705 | RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18407800 | FEEDTHROUGH VIA WITH REDUCED RESISTANCE FOR DIRECT CONNECTION TO BACKSIDE METALS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18815864 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 17848500 | MODULAR POWER TRANSISTOR COMPONENT ASSEMBLIES WITH FLIP CHIP INTERCONNECTIONS | Final Rejection | MACOM Technology Solutions Holdings, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy0.0% of resolved applications examined by Ethan Alexander Tuttle were allowed (2 resolved cases), compared with 69.7% across Art Unit 2800 over the last five years.
This examiner's interview lift is +0.0 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Ethan Alexander Tuttle took 1,093 days on average from filing to allowance.
Ethan Alexander Tuttle examines applications in Art Unit 2800 in Tech Center 2800 (Semiconductors, Circuits & Optics).
