Listed by the USPTO as VU, VU A
Tech Center 4100 • Art Units: 2800 2812 2817 2823 2828 2893 2897 4100
This examiner grants 92% of resolved cases
VU, VU A works in Tech Center 4100 and Art Unit 2800. The record reflects 1368 resolved cases, a 92.3% allowance rate, and a median of 672 days to allowance. Interviews show a 6.7% lift, so the profile emphasizes a strong allowance record and comparatively short median path more than interview activity.
Samsung Display Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., and Samsung Electronics Co., Ltd. are the leading companies. The listed firms are CANTOR COLBURN LLP, SCHWABE, WILLIAMSON & WYATT, P.C., and Womble Bond Dickinson US LLP. The substantial record supports confident planning around claim presentation and response timing.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18742376 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18521965 | SEMICONDUCTOR CHIP HAVING A FRICTION STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD |
| 18657500 | LIGHT EMITTING DISPLAY APPARATUS | Final Rejection | LG Display Co., Ltd. |
| 18646268 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18620497 | DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18620407 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18398732 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18716691 | Optic for an Under-Display Image Sensor of an Electronic Device | Non-Final OA | Google LLC |
| 18254848 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18841905 | Light-Emitting Substrate, Backlight Module, and Display Apparatus | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18738095 | BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18375084 | INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING | Non-Final OA | Intel Corporation |
| 17956760 | SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING | Non-Final OA | Intel Corporation |
| 18839951 | METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | Non-Final OA | ams-OSRAM International GmbH |
| 18362635 | IC PACKAGE WITH IMMERSION TIN ON FLANK | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18798659 | IMAGE SENSING DEVICE | Non-Final OA | SK hynix Inc. |
| 18766673 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18895404 | NITRIDE SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18745485 | REDUCED STRAIN AND STOP LAYER FOR Si/SiGe EPI STACKS | Non-Final OA | Applied Materials, Inc. |
| 18781293 | SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMING THE SEMICONDUCTOR STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18785053 | Semiconductor Devices and Methods of Manufacture | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18741654 | DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18915263 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18770886 | MICRO-ELECTROMECHANICAL SYSTEM DEVICE USING A METALLIC MOVABLE PART AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18841160 | PATTERN INSPECTION METHOD, METHOD FOR MANUFACTURING RESIST PATTERN, TARGET SUBSTRATE SELECTION METHOD, AND METHOD FOR MANUFACTURING TARGET SUBSTRATE | Non-Final OA | Resonac Corporation |
| 18785246 | BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 18916723 | Method for forming layout pattern of static random access memory | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18679754 | HIGH-ELECTRON-MOBILITY TRANSISTOR HAVING GROUP-III-NITRIDE CAPPING LAYER SEPARATED FROM CONTACT | Non-Final OA | MACOM Technology Solutions Holdings, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy92.3% of resolved applications examined by Vu A Vu were allowed (1,368 resolved cases), compared with 69.7% across Art Unit 2800 over the last five years.
This examiner's interview lift is +6.7 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Vu A Vu took 672 days on average from filing to allowance.
Vu A Vu examines applications in Art Unit 2800 in Tech Center 4100.
