Listed by the USPTO as ZARNEKE, DAVID A
Tech Center 2800 • Art Units: 1746 2874 2891
This examiner grants 71% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18665893 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18606843 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18457535 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18685775 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18293834 | LIGHT EMITTING DIODE CHIP AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18075360 | SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT | Non-Final OA | Intel Corporation |
| 17992010 | REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED COMPONENT | Final Rejection | Intel Corporation |
| 17988051 | BUMPLESS HYBRID ORGANIC GLASS INTERPOSER | Final Rejection | Intel Corporation |
| 17833650 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | Non-Final OA | Intel Corporation |
| 17833648 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | Final Rejection | Intel Corporation |
| 18347313 | Liquid Immersion-Cooled Power Module | Final Rejection | Kia Corporation |
| 18684565 | OPTOELECTRONIC COMPONENT, LIGHTING UNIT AND METHOD OF MANUFACTURING AN OPTOELECTRONIC COMPONENT | Non-Final OA | ams-OSRAM International GmbH |
| 18657165 | THROUGH DIELECTRIC VIA | Non-Final OA | International Business Machines Corporation |
| 18214159 | CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18371179 | LOW RESISTIVITY METAL STACKS AND METHODS OF DEPOSITING THE SAME | Final Rejection | Applied Materials, Inc. |
| 18772736 | Image Sensors With Dummy Pixel Structures | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18430507 | SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18451263 | SEMICONDUCTOR STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18606922 | METHODS FOR SINGULATING SEMICONDUCTOR DIE FROM SILICON CARBIDE SUBSTRATES | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18845285 | INDIVIDUALIZED PIECE-PROCESSED ADHESIVE FILM, METHOD FOR MANUFACTURING A CONNECTION STRUCTURE, AND CONNECTION STRUCTURE | Non-Final OA | DEXERIALS CORPORATION |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy71.1% of resolved applications examined by David A Zarneke were allowed (823 resolved cases), compared with 57.1% across Art Unit 1746 over the last five years.
This examiner's interview lift is +11.1 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by David A Zarneke took 1,023 days on average from filing to allowance.
David A Zarneke examines applications in Art Unit 1746 in Tech Center 2800 (Semiconductors, Circuits & Optics).
