12 pending office actions • 7 clients
| Client (Assignee) | Pending OAs |
|---|---|
| Macdermid Enthone Inc. | 3 |
| Kuprion Inc. | 3 |
| Alpha Assembly Solutions Inc. | 2 |
| Element Solutions, Inc. | 1 |
| Macdermid, Incorporated | 1 |
| Aveni | 1 |
| Kuprion Inc. | 1 |
| App # | Title | Client | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|---|
| 18999059 | Electrolyte and Deposition of a Copper Barrier Layer in a Damascene Process | Element Solutions, Inc. | HASKE, WOJCIECH | 1794 | Non-Final OA | Dec 23, 2024 |
| 18897145 | METHOD AND SYSTEM FOR DIFFERENTIATING PERFORMANCE BETWEEN INTEGRATED SOLUTIONS | Alpha Assembly Solutions Inc. | BROWN, SARA GRACE | 3625 | Non-Final OA | Sep 26, 2024 |
| 18717636 | Method of Metallization by a Nickel or Cobalt Alloy for the Manufacture of Semiconductor Devices | Macdermid Enthone Inc. | BAREFORD, KATHERINE A | 1718 | Non-Final OA | Jun 07, 2024 |
| 18706411 | HEAT SPREADERS FEATURING COEFFICIENT OF THERMAL EXPANSION MATCHING AND HEAT DISSIPATION USING SAME | Kuprion Inc. | DECKER, JAMIL ALEXANDER | 2835 | Non-Final OA | May 01, 2024 |
| 18685635 | ELECTROLESS ANTIPATHOGENIC COATING | Macdermid, Incorporated | STEINKE, SEAN JAMES | 1619 | Non-Final OA | Feb 22, 2024 |
| 18534907 | SUPPRESSION OF MANGANESE DIOXIDE FORMATION IN MANGANESE (III)-BASED ETCHING SOLUTIONS | Macdermid Enthone Inc. | LU, JIONG-PING | 1713 | Non-Final OA | Dec 11, 2023 |
| 18566137 | Heat Pipes Featuring Coefficient of Thermal Expansion Matching and Heat Dissipation Using Same | Kuprion Inc. | RUBY, TRAVIS C | 3763 | Non-Final OA | Dec 01, 2023 |
| 18383959 | BORIC ACID-FREE SATIN NICKEL | Macdermid Enthone Inc. | WONG, EDNA | 1795 | Final Rejection | Oct 26, 2023 |
| 18281850 | Biofilm-Resistant Articles Coated with Metal Nanoparticle Agglomerates | Kuprion Inc. | LIU, TRACY | 1614 | Non-Final OA | Sep 13, 2023 |
| 18277695 | Electrolyte and Method for Cobalt Electrodeposition | Aveni | COHEN, BRIAN W | 1759 | Non-Final OA | Aug 17, 2023 |
| 18205590 | LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES | Alpha Assembly Solutions Inc. | WALCK, BRIAN D | 1738 | Non-Final OA | Jun 05, 2023 |
| 17995487 | SPRAY FORMULATIONS COMPRISING METAL NANOPARTICLE AGGLOMERATES AND SURFACE DISINFECTION THEREWITH | Kuprion Inc. | MAEWALL, SNIGDHA | 1612 | Non-Final OA | Oct 05, 2022 |
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