Listed by the USPTO as AHMADI, MOHSEN
Tech Center 2800 • Art Units: 2812 2819 2896
This examiner grants 87% of resolved cases
AHMADI, MOHSEN works in Tech Center 2800 and Art Unit 2812. The examiner has 472 resolved cases, an allowance rate of 86.9%, and a median of 832 days to allowance. Interviews show a 9.5% lift in allowance outcomes, providing a measurable but secondary signal for prosecution planning.
The listed companies are Samsung Display Co., Ltd., Ams-osram AG, and Taiwan Semiconductor Manufacturing Company, Ltd. The listed firms are Haynes and Boone, LLP (24061), Womble Bond Dickinson US LLP, and Alliance IP, LLC - Intel. The profile supports expectations of an allowance-oriented docket with a median timeline approaching two years, while leaving room for application-specific strategy.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18630248 | INTEGRATED CIRCUITS HAVING HIGHLY COMPACT DEVICES THEREIN, AND MEMORY DEVICES USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18745977 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18114106 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18547344 | SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND ELECTRONIC DEVICE HAVING SEMICONDUCTOR SUBSTRATE | Final Rejection | SONY GROUP CORPORATION |
| 18676612 | SEMICONDUCTOR COMPONENT AND ELECTRONIC DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18061237 | INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) | Final Rejection | Intel Corporation |
| 18841249 | OPTOELECTRONIC LIGHTING DEVICE AND METHOD | Non-Final OA | ams-OSRAM International GmbH |
| 18833836 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT, CONVERSION ELEMENT AND MANUFACTURING METHOD | Non-Final OA | AMS-OSRAM INTERNATIONAL GMBH |
| 18582902 | CHIP-TO-CHIP INTERCONNECT DESIGN | Non-Final OA | NVIDIA CORPORATION |
| 18404200 | SEMICONDUCTOR LIGHT-EMITTING DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18401185 | 3D CHIPLET INTEGRATION USING FAN-OUT WAFER-LEVEL PACKAGING | Non-Final OA | Meta Platforms Technologies, LLC |
| 18641017 | SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION LAYER AND METHOD OF FABRICATING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18472695 | Corner Reinforcement Structure for Package Interconnect | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18391914 | SEMICONDUCTOR DEVICE AND POWER AMPLIFIER INCLUDING THE SAME | Final Rejection | Samsung Electro-Mechanics Co., Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy86.9% of resolved applications examined by Mohsen Ahmadi were allowed (472 resolved cases), compared with 82.1% across Art Unit 2812 over the last five years.
This examiner's interview lift is +9.5 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Mohsen Ahmadi took 832 days on average from filing to allowance.
Mohsen Ahmadi examines applications in Art Unit 2812 in Tech Center 2800 (Semiconductors, Circuits & Optics).
