Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2881
This examiner grants 81% of resolved cases
Felix Bryan Andrews, in Art Unit 2812 within Tech Center 2800, has resolved 62 cases. The allowance rate is 80.6%, and the median days to allowance is 1213. This indicates a high likelihood of success for applicants, though the process typically involves a long duration. The 1213-day median pendency is an important factor to consider in the overall patent strategy.
The interview lift is 5.1%, providing a modest benefit to the 80.6% allowance rate. This positive lift indicates that interviews can be a useful tactical tool for resolving minor issues or clarifying technical points. With 62 resolved cases, the data shows a favorable environment for patent prosecution. Practitioners should feel confident in the 80.6% allowance rate but remain mindful of the 1213-day timeline. The 5.1% lift can be used as a supplementary strategy to ensure a smooth path toward a grant.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18786931 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18758153 | METHOD OF PROCESSING A SUBSTRATE | Non-Final OA | SAMSUNG ELECTRONICS CO,.LTD. |
| 18751638 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18440215 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18440304 | MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18795730 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18758082 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18630547 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18440290 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18819004 | SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 17901457 | SOLID-STATE IMAGING DEVICE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE | Final Rejection | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 17855667 | SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS | Final Rejection | Intel Corporation |
| 18090452 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, AND MEMORY SYSTEM | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 18578327 | PHOTODETECTION DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18278501 | ELECTRONIC ELEMENT MOUNTING BOARD, ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS | Non-Final OA | KYOCERA CORPORATION |
| 18797564 | POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE SAME | Non-Final OA | Infineon Technologies AG |
| 18786700 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18638088 | SEMICONDUCTOR ELECTRODE STRUCTURES AND METHODS OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18403681 | SEMICONDUCTOR DEVICE | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18753356 | INTEGRATED CIRCUIT DIE STITCHING USING JUMPER DIE | Non-Final OA | Zero ASIC Corporation |
| 18304319 | TRANSFERRING APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD OF BONDING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE DISPLAY | Non-Final OA | Stroke Precision Advanced Engineering Co., Ltd. |
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