Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18260491 | SOLID-STATE IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18249353 | IMAGING ELEMENT AND IMAGING DEVICE HAVING A POLYGONAL TRANSFER GATE OPENING | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18139699 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS | Final Rejection | Applied Materials, Inc. |
| 17855667 | SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS | Final Rejection | Intel Corporation |
| 17833600 | MEMORY PACKAGE ON EXTENDED BASE DIE OVER SOC DIE FOR PACKAGE LAYER COUNT AND FORM FACTOR REDUCTION | Final Rejection | Intel Corporation |
| 17901457 | SOLID-STATE IMAGING DEVICE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18278501 | ELECTRONIC ELEMENT MOUNTING BOARD, ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS | Non-Final OA | KYOCERA CORPORATION |
| 18090452 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, AND MEMORY SYSTEM | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18304319 | TRANSFERRING APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD OF BONDING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE DISPLAY | Final Rejection | Stroke Precision Advanced Engineering Co., Ltd. |
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