Listed by the USPTO as ANGUIANO, MICHAEL
Tech Center 2800 • Art Units: 2899
This examiner grants 53% of resolved cases
ANGUIANO, MICHAEL works in Tech Center 2800 and Art Unit 2899. The profile reports 30 resolved cases, a 53.3% allowance rate, and a median of 1340 days to allowance. The interview lift is 16.3%.
The listed companies are Samsung Electronics Co., Ltd., Intel Corporation, and Kia Corporation. The listed firms are HARNESS, DICKEY & PIERCE, P.L.C., AGORA LAW GROUP, PLLC, and FISH & RICHARDSON P.C. (TC). The limited resolved-case base supports cautious use of the figures. Counsel can account for the reported timing in client planning and consider interviews when a specific claim or technical issue can be addressed directly.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18666962 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18422406 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18299896 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co, Ltd. |
| 18158692 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17690376 | TWO-DIMENSIONAL MATERIAL STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE TWO-DIMENSIONAL MATERIAL STRUCTURE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18090055 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18041621 | Package-on-Package Assembly with Improved Thermal Management | Final Rejection | Google LLC |
| 18656251 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, POWER CONVERSION CIRCUIT, AND VEHICLE | Non-Final OA | Huawei Digital Power Technologies Co., Ltd. |
| 18188577 | STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY | Non-Final OA | Intel Corporation |
| 17957257 | EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS | Final Rejection | Intel Corporation |
| 17350184 | MILLIMETER WAVE COMPONENTS IN A GLASS CORE OF A SUBSTRATE | Non-Final OA | Intel Corporation |
| 17889395 | DEEP TRENCH CAPACITOR BRIDGE FOR MULTI-CHIP PACKAGE | Non-Final OA | Altera Corporation |
| 18798770 | POWER MODULES | Non-Final OA | Kia Corporation |
| 18756902 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | KIA CORPORATION |
| 17792996 | ALLOY FILM ETCH | Final Rejection | Lam Research Corporation |
| 17940715 | ACCESS CIRCUITRY STRUCTURES FOR THREE-DIMENSIONAL MEMORY ARRAY | Final Rejection | Micron Technology, Inc. |
| 17812141 | MICROELECTRONIC DEVICES WITH CONTACTS EXTENDING THROUGH METAL OXIDE REGIONS OF STEP TREADS, AND RELATED SYSTEMS AND METHODS | Final Rejection | Micron Technology, Inc. |
| 18830312 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PATTERN FORMING METHOD | Non-Final OA | Kioxia Corporation |
| 18663782 | MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 17893746 | INTEGRATED CIRCUIT HAVING AN IMPROVED METAL LAYER | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17896329 | THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | SK hynix Inc. |
| 17931256 | ELECTRONIC APPARATUS | Non-Final OA | ROHM Co., LTD. |
| 18594527 | BARRIER ENCAPSULATION FOR ORGANIC LIGHT-EMITTING DIODES | Non-Final OA | Applied Materials, Inc. |
| 17885577 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17809432 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18676665 | CHIP COMPLEX WITH EMBEDDED INTERPOSER | Non-Final OA | Advanced Micro Devices, Inc. |
| 18670762 | ANTIFUSE-TYPE MEMORY WITH FIN FIELD-EFFECT TRANSISTOR | Non-Final OA | eMemory Technology Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy53.3% of resolved applications examined by Michael Anguiano were allowed (30 resolved cases), compared with 81.9% across Art Unit 2899 over the last five years.
This examiner's interview lift is +16.3 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Michael Anguiano took 1,340 days on average from filing to allowance.
Michael Anguiano examines applications in Art Unit 2899 in Tech Center 2800 (Semiconductors, Circuits & Optics).
