Tech Center 1700 • Art Units: 1724 1737 1756 1794 1795
This examiner grants 64% of resolved cases
Jason Berman is an examiner in Tech Center 1700, working within Art Unit 1724. The examiner has handled 923 resolved cases, providing a view of the prosecution style. The allowance rate stands at 63.8 percent, indicating the probability of success for applicants. This 63.8 percent figure serves as the primary benchmark for evaluating the likelihood of a grant on this docket. The 923 resolved cases establish a consistent record of performance.
The interview lift is 21.0 percent, suggesting that formal discussions with the examiner provide a positive benefit. This 21.0 percent lift indicates that an interview can improve the chances of allowance compared to the 63.8 percent baseline. Practitioners should consider this impact when deciding whether to request an interview. The median days to allowance is 1239, which is the typical duration for applications that reach issuance. This 1239 median days to allowance provides a clear expectation for pendency.
The data in Art Unit 1724 shows that the interview lift is 21.0 percent, offering an additional tool for success. The 1239 median days to allowance helps set expectations for the overall timeline in Tech Center 1700. The 63.8 percent allowance rate remains a key metric for evaluating the likelihood of a grant. These metrics offer a data-driven foundation for developing a successful strategy before this examiner and managing client expectations.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18756872 | PLASMA PROCESSING APPARATUS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18736317 | SUBSTRATE HOLDING UNIT AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18672023 | SUBSTRATE SUPPORTING UNIT, APPARATUS FOR TREATING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18282021 | CONDUCTIVE COOLING OF A LOW TEMPERATURE PEDESTAL OPERATING IN A HIGH TEMPERATURE DEPOSITION SEQUENCE | Final Rejection | LAM RESEARCH CORPORATION |
| 18762529 | HIGH TEMPERATURE PRECURSOR GAS DELIVERY MANIFOLD | Non-Final OA | Applied Materials, Inc. |
| 18628349 | PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18536789 | FILM FORMING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18472815 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Kokusai Electric Corporation |
| 18215757 | MODULES FOR DELIVERY SYSTEMS AND RELATED METHODS | Final Rejection | ENTEGRIS, INC. |
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