Prosecution Insights
Last updated: April 19, 2026

Examiner: BERMAN, JASON

Tech Center 1700 • Art Units: 1724 1737 1756 1794 1795

This examiner grants 63% of resolved cases

Performance Statistics

63.2%
Allow Rate
-1.8% vs TC avg
926
Total Applications
+22.0%
Interview Lift
1237
Avg Prosecution Days
Based on 901 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
20.7%
§102 Novelty
61.6%
§103 Obviousness
14.8%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18215916 SUBSTRATE STAGE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18459587 DEPOSITION APPARATUS Non-Final OA Samsung Display Co., Ltd.
18332895 MASK FRAME ASSEMBLY, MASK ASSEMBLY AND DEPOSITION APPARATUS INCLUDING MASK ASSEMBLY Non-Final OA Samsung Display Co., Ltd.
18303391 SIDE PUMPING CHAMBER AND DOWNSTREAM RESIDUE MANAGEMENT HARDWARE Non-Final OA Applied Materials, Inc.
19170372 METHOD FOR COATING A SUBSTRATE Non-Final OA Carl Zeiss SMT GmbH
18536789 FILM FORMING APPARATUS Non-Final OA Tokyo Electron Limited
18992549 DYNAMIC VACUUM SEAL SYSTEM FOR PHYSICAL VAPOR DEPOSITION SPUTTER APPLICATIONS Final Rejection TOSOH SMD, INC.
18999547 SPUTTERING TARGET, METHOD OF BONDING TARGET MATERIAL AND BACKING PLATE, AND METHOD OF MANUFACTURING SPUTTERING TARGET Non-Final OA SUMITOMO CHEMICAL COMPANY, LIMITED
18282021 CONDUCTIVE COOLING OF A LOW TEMPERATURE PEDESTAL OPERATING IN A HIGH TEMPERATURE DEPOSITION SEQUENCE Non-Final OA LAM RESEARCH CORPORATION
17433203 METHOD FOR PRODUCING TARGETS FOR PHYSICAL VAPOR DEPOSITION (PVD) Final Rejection Oerlikon Surface Solutions AG, Pfäffikon
16979697 Sputtering Target and Method for Producing Sputtering Target Non-Final OA JX Advanced Metals Corporation
18785683 METHOD FOR FORMING ROBUST HYDROPHOBIC SURFACES ON STEEL WORKPIECE Non-Final OA Nano and Advanced Materials Institute Limited
18274348 THERMAL LASER EVAPORATION SYSTEM Non-Final OA MAX-PLANCK-GESELLSCHAFT ZUR FÖRDERUNG DER WISSENSCHAFTEN E.V.
18726294 SURFACE TREATMENT APPARATUS Non-Final OA Shibaura Machine Co., Ltd.
18690746 ROTARY CATHODE END BLOCK Non-Final OA NCS VACUUM TECHNOLOGY (HEFEI) CO., LTD.
18248405 AN ATOMIC LAYER DEPOSITION APPARATUS Final Rejection BENEQ OY
18258022 METHOD AND DEVICE FOR CHANGING TEST SUBSTRATES IN A CONTINUOUS-FLOW VACUUM SYSTEM, TREATMENT METHOD, AND CONTINUOUS-FLOW VACUUM SYSTEM Non-Final OA Solayer GmbH

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