Tech Center 1700 • Art Units: 1724 1737 1756 1794 1795
This examiner grants 64% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18736317 | SUBSTRATE HOLDING UNIT AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18672023 | SUBSTRATE SUPPORTING UNIT, APPARATUS FOR TREATING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 19174249 | COBALT-TANTALUM ALLOY SPUTTERING TARGET ASSEMBLY AND METHOD OF MAKING | Non-Final OA | Honeywell International Inc. |
| 18515842 | Semiconductor Device, Method and Machine of Manufacture | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18762529 | HIGH TEMPERATURE PRECURSOR GAS DELIVERY MANIFOLD | Non-Final OA | Applied Materials, Inc. |
| 18662017 | METHODS AND APPARATUS THAT USE INDUCTIVELY COUPLED PLASMA RESONATOR SOURCES | Non-Final OA | Applied Materials, Inc. |
| 18628349 | PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18536789 | FILM FORMING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18992549 | DYNAMIC VACUUM SEAL SYSTEM FOR PHYSICAL VAPOR DEPOSITION SPUTTER APPLICATIONS | Final Rejection | TOSOH SMD, INC. |
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