Prosecution Insights
Last updated: October 02, 2026

Examiner: CIESLEWICZ, ANETA B

Tech Center 2800 • Art Units: 2817 2829 2893

This examiner grants 67% of resolved cases

Performance Statistics

67.1%
Allow Rate
-0.9% vs TC avg
277
Total Applications
-0.2%
Interview Lift
1186
Avg Prosecution Days
Based on 243 resolved cases, 2023–2026

Rejection Statute Breakdown

2.8%
§101 Eligibility
23.8%
§102 Novelty
48.7%
§103 Obviousness
24.0%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18745431 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES Non-Final OA Samsung Electronics Co., Ltd.
18434840 SEMICONDUCTOR DEVICE Non-Final OA SEIKO EPSON CORPORATION
18689267 DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS Non-Final OA BOE TECHNOLOGY GROUP CO., LTD.
18407446 DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE Non-Final OA Samsung Display Co., Ltd.
18697278 DISPLAY PANEL AND DISPLAY DEVICE Non-Final OA WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
16210922 METHOD OF FORMING A STRUCTURE INCLUDING SILICON NITRIDE ON TITANIUM NITRIDE AND STRUCTURE FORMED USING THE METHOD Non-Final OA ASM IP Holding B.V.
18434787 STACKED FIELD EFFECT TRANSISTORS WITH CLADDING SILICON GERMANIUM PFET CHANNEL Non-Final OA International Business Machines Corporation
18427756 METHODS OF FORMING APPARATUS COMPRISING CRYSTALLINE SEMICONDUCTOR MATERIALS AND METAL SILICIDE MATERIALS, AND RELATED APPARATUS Non-Final OA Micron Technology, Inc.
18404233 EPITAXIAL STRUCTURES IN SEMICONDUCTOR DEVICES Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
17460909 SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND METHOD FOR FORMING THE SAME Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18524386 MODIFYING TSV LAYOUT AND THE STRUCTURES THEREOF Final Rejection Taiwan Semiconductor Manufacturing Co. Ltd.
18592284 CHIP PACKAGE ASSEMBLY WITH ON-PACKAGE CONTAINMENT SYSTEM Non-Final OA Advanced Micro Devices, Inc.
18055123 POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET Final Rejection SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
18394866 ASIC INTEGRATED MEMS DEVICE WITH EXPOSED BOND PADS FROM BOTTOM ATTACHED ASIC AND MAKING THE SAME Non-Final OA SD OPTICS, INC.

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