Tech Center 2800 • Art Units: 2817 2829 2893
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17711917 | INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC DELAY | Final Rejection | Intel Corporation |
| 17883241 | Integrated Memory Comprising Gated Regions Between Charge-Storage Devices and Access Devices | Final Rejection | Micron Technology, Inc. |
| 18253501 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 17889381 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17460909 | SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18524386 | MODIFYING TSV LAYOUT AND THE STRUCTURES THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co. Ltd. |
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18383055 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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