Prosecution Insights
Last updated: August 17, 2026

Examiner: CIESLEWICZ, ANETA B

Tech Center 2800 • Art Units: 2817 2829 2893

This examiner grants 67% of resolved cases

Performance Statistics

66.7%
Allow Rate
-1.3% vs TC avg
272
Total Applications
-0.1%
Interview Lift
1185
Avg Prosecution Days
Based on 240 resolved cases, 2023–2026

Rejection Statute Breakdown

2.9%
§101 Eligibility
23.9%
§102 Novelty
48.2%
§103 Obviousness
24.2%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18697278 DISPLAY PANEL AND DISPLAY DEVICE Non-Final OA WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
18689219 MEMS SWITCH, DRIVING METHOD THEREOF, AND ELECTRONIC DEVICE Non-Final OA BOE Technology Group Co., Ltd.
18341787 DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME Final Rejection Magnolia White Corporation
18407446 DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE Non-Final OA Samsung Display Co., Ltd.
18383049 DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME Non-Final OA Samsung Display Co., Ltd.
16210922 METHOD OF FORMING A STRUCTURE INCLUDING SILICON NITRIDE ON TITANIUM NITRIDE AND STRUCTURE FORMED USING THE METHOD Non-Final OA ASM IP Holding B.V.
18434840 SEMICONDUCTOR DEVICE Non-Final OA SEIKO EPSON CORPORATION
17977401 Substrate with Differing Dielectric Constants Non-Final OA Avago Technologies International Sales Pte. Limited
18407206 DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS Non-Final OA Shanghai Tianma Micro-Electronics Co., Ltd.
18404233 EPITAXIAL STRUCTURES IN SEMICONDUCTOR DEVICES Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18401747 MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
17460909 SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND METHOD FOR FORMING THE SAME Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18055123 POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET Final Rejection SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
18394866 ASIC INTEGRATED MEMS DEVICE WITH EXPOSED BOND PADS FROM BOTTOM ATTACHED ASIC AND MAKING THE SAME Non-Final OA SD OPTICS, INC.

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