Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17952285 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18333000 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 17375282 | FORMING OF HIGH ASPECT RATIO FEATURES AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE HIGH ASPECT RATIO FEATURES | Non-Final OA | SK hynix Inc. |
| 18167905 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Winbond Electronics Corp. |
| 17967378 | CHIP PACKAGE STRUCTURE AND PACKAGE MODULE THEREOF | Non-Final OA | AZUREWAVE TECHNOLOGIES, INC. |
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