Listed by the USPTO as GREEN, TELLY D
Tech Center 2800 • Art Units: 2800 2811 2821 2822 2898
This examiner grants 82% of resolved cases
Telly D. Green is a USPTO patent examiner in tech center 2800 and art unit 2800. The profile includes 1325 resolved cases, an allowance rate of 82.0%, and a median of 837 days to allowance. The interview lift is 4.0%, which is modest relative to the allowance rate and indicates a limited measured association between interviews and allowance outcomes. The 837-day median provides a timing reference for applicants preparing prosecution budgets and continuation strategies.
The company record centers on Taiwan Semiconductor Manufacturing Company, Ltd., Samsung Electronics Co., Ltd., and Samsung Display Co., Ltd. The leading firms are FISH & RICHARDSON P.C. (TC), Harrity & Harrity , LLP, and JCIPRNET. These recurring organizations may help practitioners identify the examiner's subject-matter mix and representative experience.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18886654 | POWER SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18679639 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18671559 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18653101 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18642174 | GATE STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE GATE STRUCTURES | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18432463 | SEMICONDUCTOR MEMORY MODULE INCLUDING FIXING STRUCTURE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18544670 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18755726 | ORGANIC LIGHT EMITTING DISPLAY DEVICE | Final Rejection | Samsung Display Co., Ltd. |
| 18397467 | LIGHT EMITTING ELEMENT AND DISPLAY DEVICE INCLUDING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18411414 | IMAGE SENSOR AND ELECTRONIC DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18807506 | CONFIGURABLE BONDING PAD ROUTING | Non-Final OA | QUALCOMM Incorporated |
| 18800827 | CONFINED EPITAXIAL REGIONS FOR SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING CONFINED EPITAXIAL REGIONS | Non-Final OA | Intel Corporation |
| 18654618 | LOW RESISTANCE STAIRCASE RIVET CONTACT USING METAL-TO-METAL STRAP CONNECTION | Non-Final OA | Micron Technology, Inc. |
| 18323376 | STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18416432 | IC PACKAGE WITH DIE AND COPPER POSTS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18432661 | LOGIC CROSS-COUPLE WITH BACKSIDE INTERCONNECTS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18204092 | SYSTEMS, APPARATUSES, AND METHODS FOR BACK-TO-BACK DIE FOR SEMICONDUCTOR PACKAGES | Final Rejection | STMicroelectronics International N.V. |
| 18788134 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18768426 | ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18764945 | SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18754706 | BACKSIDE CAPACITOR TECHNIQUES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18741714 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18413276 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18503425 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18783501 | SELECTIVE ETCHING TO INCREASE THRESHOLD VOLTAGE SPREAD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18753744 | Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18324036 | HEAT DISSIPATION IN SEMICONDUCTOR DEVICES | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18151629 | INTEGRATED CIRCUIT PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18254159 | MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED WAFER SLICES AND PROCESS FOR MAKING THE SAME | Non-Final OA | Qorvo US, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy82.0% of resolved applications examined by Telly D Green were allowed (1,325 resolved cases), compared with 69.7% across Art Unit 2800 over the last five years.
This examiner's interview lift is +4.0 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Telly D Green took 837 days on average from filing to allowance.
Telly D Green examines applications in Art Unit 2800 in Tech Center 2800 (Semiconductors, Circuits & Optics).
