Listed by the USPTO as JUNG, MICHAEL YOO LIM
Tech Center 2800 • Art Units: 2800 2812 2817 2895 2898
This examiner grants 83% of resolved cases
JUNG, MICHAEL YOO LIM works in Tech Center 2800 and Art Unit 2800. The profile records 1295 resolved cases and an 82.8% allowance rate. The large docket and strong majority allowance result provide substantial historical support for using this examiner profile in prosecution planning.
The interview lift is 10.5%, indicating a positive association between interviews and allowance, although the recorded change is more limited than the overall allowance result. The median time to allowance is 872 days, which gives applicants a concrete reference for expected prosecution duration. The leading companies are Taiwan Semiconductor Manufacturing Company, Ltd., Samsung Display Co., Ltd., and Intel Corporation. The listed firms are Akona IP PC - Intel, AMPACC Law Group, PLLC, and BIRCH STEWART KOLASCH & BIRCH, LLP.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18348934 | MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES | Non-Final OA | Apple Inc. |
| 18768760 | DISPLAY MODULE, DISPLAY APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18680467 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18716459 | SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18344260 | PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING | Non-Final OA | Intel Corporation |
| 17846303 | SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES | Final Rejection | Intel Corporation |
| 18739954 | HYBRID DIELECTRIC BAR | Non-Final OA | International Business Machines Corporation |
| 18783529 | BARRIER STRUCTURE CONFIGURED TO INCREASE PERFORMANCE OF III-V DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18753091 | CHIP PACKAGE HAVING MULTIPLE CHIPS | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18786532 | Nanostructure Field-Effect Transistor Device and Method of Forming | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18628173 | SEMICONDUCTOR PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy82.8% of resolved applications examined by Michael Yoo Lim Jung were allowed (1,295 resolved cases), compared with 69.7% across Art Unit 2800 over the last five years.
This examiner's interview lift is +10.5 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Michael Yoo Lim Jung took 872 days on average from filing to allowance.
Michael Yoo Lim Jung examines applications in Art Unit 2800 in Tech Center 2800 (Semiconductors, Circuits & Optics).
