Listed by the USPTO as KOLB, THADDEUS J
Tech Center 2800 • Art Units: 2817
This examiner grants 86% of resolved cases
KOLB, THADDEUS J works in tech center 2800 and art unit 2817. The profile contains 35 resolved cases, an allowance rate of 85.7%, and a median of 1342 days to allowance. The allowance rate shows that most resolved matters reached allowance, but the limited case volume constrains the breadth of any general conclusion.
The interview lift is 20.8%, indicating a positive association between interviews and allowance in the available record. Practitioners may use interviews to clarify prosecution issues, while treating the figures as directional because the record is limited. The listed companies are Taiwan Semiconductor Manufacturing Company, Ltd., Intel Corporation, and Innolux Corporation. The associated firms are JCIPRNET, McClure, Qualey & Rodack, LLP, and Essential Patents Group, LLP.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18231341 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17821920 | Warpage Compensation for BGA Package | Non-Final OA | Apple Inc. |
| 18349861 | Tiling Display Device | Non-Final OA | LG Display Co., Ltd. |
| 17822589 | EMBEDDED TRACE SUBSTRATE (ETS) WITH EMBEDDED METAL TRACES HAVING MULTIPLE THICKNESS FOR INTEGRATED CIRCUIT (IC) PACKAGE HEIGHT CONTROL | Non-Final OA | QUALCOMM Incorporated |
| 17957403 | HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES | Non-Final OA | Intel Corporation |
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | Final Rejection | Intel Corporation |
| 17932735 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | InnoLux Corporation |
| 17815297 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | InnoLux Corporation |
| 17873521 | Semiconductor Package Interconnection Structure | Final Rejection | Avago Technologies International Sales Pte. Limited |
| 17854998 | ELECTROSTATIC DISCHARGE PROTECTION DEVICES WITH HIGH CURRENT CAPABILITY | Non-Final OA | Texas Instruments Incorporated |
| 18422055 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE | Non-Final OA | MEDIATEK INC. |
| 18472862 | MEMORY DEVICE WITH TWISTED BIT LINES AND METHODS OF MANUFACTURING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18461538 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17897196 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17873170 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17813212 | MULTIPLE NON-ACTIVE DIES IN A MULTI-DIE PACKAGE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18655999 | SEMICONDUCTOR DEVICE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co, Ltd. |
| 17809039 | SEMICONDUCTOR PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18462082 | IMAGE SENSOR PACKAGES AND RELATED METHODS | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy85.7% of resolved applications examined by Thaddeus J Kolb were allowed (35 resolved cases), compared with 81.7% across Art Unit 2817 over the last five years.
This examiner's interview lift is +20.8 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Thaddeus J Kolb took 1,342 days on average from filing to allowance.
Thaddeus J Kolb examines applications in Art Unit 2817 in Tech Center 2800 (Semiconductors, Circuits & Optics).
