Tech Center 2800 • Art Units: 1713 1718 2812
This examiner grants 48% of resolved cases
Aiden Y. Lee is an examiner in Art Unit 1713, which is part of Tech Center 2800. He has 492 resolved cases, offering a solid statistical base for evaluating his performance. The allowance rate for this examiner is 47.8 percent, which indicates a more challenging environment for patent applicants. However, the interview lift is 25.3 percent, suggesting that direct engagement with the examiner is a highly effective way to move an application toward allowance. This 25.3 percent lift is a significant incentive for practitioners to schedule interviews.
The median time to allowance is 1286 days, which is a relatively long prosecution cycle of over three and a half years. This 1286-day timeline, combined with the 47.8 percent allowance rate, highlights the difficulties of working in Art Unit 1713. However, the 25.3 percent interview lift provides a clear path to improving those odds. With 492 resolved cases, the data reflects a consistent examination style where communication is key. Practitioners should use the lift to resolve any outstanding issues and potentially shorten the long delays indicated by the 1286-day median pendency. The data from Tech Center 2800 suggests that the interview is a critical tool for success. The 1286-day median pendency remains the primary benchmark for expected prosecution length.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18671496 | APPARATUS FOR PROCESSING A SUBSTRATE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 19265339 | MASK ASSEMBLY AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18475002 | LOADLOCK ASSEMBLY INCLUDING CHILLER UNIT | Non-Final OA | ASM IP Holding, B.V. |
| 18260841 | MANUFACTURING EQUIPMENT FOR LIGHT-EMITTING DEVICE | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 19230170 | ORGANIC VAPOR JET PRINTING SYSTEM | Non-Final OA | The Regents of The University of Michigan |
| 18280374 | PLASMA PROCESSING APPARATUS | Final Rejection | Hitachi High-Tech Corporation |
| 18588597 | HYDROPHOBIC TREATMENT DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 17799866 | HIGH TEMPERATURE SUBSTRATE SUPPORT WITH HEAT SPREADER | Non-Final OA | LAM RESEARCH CORPORATION |
| 18647384 | CHAMBER WALL POLYMER PROTECTION SYSTEM AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18486291 | PROCESS CHAMBER GAS FLOW IMPROVEMENT | Final Rejection | Applied Materials, Inc. |
| 18222671 | SEMICONDUCTOR CHEMICAL PRECURSOR WITH GAS PASSAGES | Final Rejection | Applied Materials, Inc. |
| 18374679 | PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18369219 | SUBSTRATE PROCESSING METHOD, COMPONENT PROCESSING METHOD, AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18172785 | SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Final Rejection | Kokusai Electric Corporation |
| 18247489 | VAPORIZER, GAS SUPPLY APPARATUS, AND METHOD OF CONTROLLING GAS SUPPLY APPARATUS | Final Rejection | Fujikin Incorporated |
| 18718240 | METHOD OF PATTERNING A TARGET LAYER, APPARATUS FOR PATTERNING A TARGET LAYER | Non-Final OA | ASML NETHERLANDS B.V. |
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