Listed by the USPTO as LINDSEY, COLE LEON
Tech Center 2800 • Art Units: 2812
This examiner grants 89% of resolved cases
LINDSEY, COLE LEON is a USPTO patent examiner in Tech Center 2800 and Art Unit 2812. The record covers 139 resolved cases, with an 89.2% allowance rate and a median of 1044 days to allowance. The high allowance figure indicates that most matters in the record reached allowance, while the median timing still supports planning for a prosecution period extending beyond initial examination.
The interview lift is 12.5%, showing a positive association between interviews and allowance outcomes, although the effect is smaller than the overall allowance result. The listed companies are Taiwan Semiconductor Manufacturing, Samsung Electronics, and Intel. The listed firms are Fish & Richardson, Birch Stewart Kolasch & Birch, and Crowell. Claim-focused interviews may complement an already favorable allowance environment.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18765816 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18626727 | SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE WITH CAPACITOR EMBEDDED IN DIELECTRIC LAYER | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18420969 | SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERN | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18090807 | INTEGRATED CIRCUIT STRUCTURES HAVING LAYER SELECT TRANSISTORS FOR SHARED PERIPHERALS IN MEMORY | Non-Final OA | Intel Corporation |
| 18087517 | UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING | Final Rejection | Intel Corporation |
| 18589721 | STITCH BOND TO COPPER NANOTWIN PLATED LEAD | Non-Final OA | Texas Instruments Incorporated |
| 18138811 | METHOD OF PLASMA CLEANING OF FUSED SILICA TUBES | Final Rejection | Applied Materials, Inc. |
| 18124674 | MULTI-VT INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18787573 | PASSIVATION LAYERS WITH ROUNDED CORNERS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18781361 | SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18760276 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18644188 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18786265 | Wafer Bonding Apparatus and Method | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18515472 | PACKAGING STRUCTURE AND PACKAGING METHOD | Non-Final OA | Semiconductor Manufacturing International (Shanghai) Corporation |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy89.2% of resolved applications examined by Cole Leon Lindsey were allowed (139 resolved cases), compared with 82.1% across Art Unit 2812 over the last five years.
This examiner's interview lift is +12.5 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Cole Leon Lindsey took 1,044 days on average from filing to allowance.
Cole Leon Lindsey examines applications in Art Unit 2812 in Tech Center 2800 (Semiconductors, Circuits & Optics).
