Listed by the USPTO as LIU, BENJAMIN T
Tech Center 2800 • Art Units: 2812 2893
This examiner grants 75% of resolved cases
LIU, BENJAMIN T is a USPTO patent examiner in Tech Center 2800 and Art Unit 2812. The record covers 723 resolved cases, with a 75.1% allowance rate and a median of 1081 days to allowance. The allowance figure indicates that most matters reached allowance, while the median timing shows that prosecution commonly extends beyond the initial examination phase.
The interview lift is 12.4%, reflecting a positive association between interviews and allowance outcomes. The listed companies are Intel, Taiwan Semiconductor Manufacturing, and Samsung Display. The listed firms are Alliance IP, Akona IP, and Alston & Bird. Applicants may treat interviews as a supporting measure while placing primary emphasis on clear written treatment of the relevant limitations.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18515259 | METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18418675 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18532692 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18752850 | QUANTUM DEVICE AND MANUFACTURING METHOD | Non-Final OA | NEC Corporation |
| 18686647 | Thin Film Transistor, Display Panel and Display Device | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18605021 | INTERPOSER SUBSTRATE WITH INTEGRATED STEP DIE CAVITY, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18126833 | FOR MEMORY ON PACKAGE WITH REDUCED THICKNESS | Non-Final OA | Intel Corporation |
| 18089865 | INTEGRATED CIRCUIT STRUCTURES HAVING TWO-LEVEL MEMORY | Final Rejection | Intel Corporation |
| 17823602 | THREE-DIMENSIONAL PACKAGE ARCHITECTURE WITH FACE DOWN BRIDGE DIES | Non-Final OA | Intel Corporation |
| 17871443 | MULTI-DIE PANEL-LEVEL HIGH PERFORMANCE COMPUTING COMPONENTS | Non-Final OA | Intel Corporation |
| 17852039 | SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT | Non-Final OA | Intel Corporation |
| 18605034 | THERMALLY REGULATED SEMICONDUCTOR DEVICE | Non-Final OA | Micron Technology, Inc. |
| 18820533 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18668478 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18584933 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18509052 | GAN-BASED, LATERAL-CONDUCTION, ELECTRONIC DEVICE WITH IMPROVED METALLIC LAYERS LAYOUT | Non-Final OA | STMICROELECTRONICS S.R.L. |
| 18731031 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18433509 | TRAPPING FILM FOR DEEP TRENCH ISOLATION STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18521913 | FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18760800 | EPITAXY REGIONS WITH LARGE LANDING AREAS FOR CONTACT PLUGS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18374410 | POWER MODULE | Final Rejection | UT-Battelle, LLC |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy75.1% of resolved applications examined by Benjamin T Liu were allowed (723 resolved cases), compared with 82.1% across Art Unit 2812 over the last five years.
This examiner's interview lift is +12.4 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Benjamin T Liu took 1,081 days on average from filing to allowance.
Benjamin T Liu examines applications in Art Unit 2812 in Tech Center 2800 (Semiconductors, Circuits & Optics).
