Listed by the USPTO as LU, JIONG-PING
Tech Center 2800 • Art Units: 1713 1716 2815
This examiner grants 84% of resolved cases
LU, JIONG-PING is assigned to tech center 2800 and art unit 1713. The record contains 974 resolved cases, with an allowance rate of 83.6%. The median time to allowance is 781 days, providing a comparatively short timing reference within this examiner-specific record.
The interview lift is 7.9%, indicating a smaller interview-associated change than the allowance measure. The listed companies are Applied Materials Inc., RESONAC Corporation, and Fujimi Incorporated. The listed firms are FITCH, EVEN, TABIN & FLANNERY, LLP, FOLEY & LARDNER LLP, and MILES & STOCKBRIDGE PC. Practitioners can use the substantial resolved-case record to frame expectations, while treating interviews as a targeted mechanism for clarifying claim scope and addressing the application’s specific prior-art issues.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18750176 | ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18982214 | DEPOSITION OF ORGANIC FILMS | Non-Final OA | ASM IP Holding B.V. |
| 18840069 | ATOMIC LAYER ETCHING USING AN INHIBITOR | Non-Final OA | Lam Research Corporation |
| 18732053 | SYSTEMS FOR PROCESSING ONE OR MORE SEMICONDUCTOR DEVICES, AND RELATED METHODS | Final Rejection | Micron Technology, Inc. |
| 18395132 | SINGLE MASK MULTI-CRITICAL DIMENSION ETCHING USING ETCH STOP | Non-Final OA | Tokyo Electron Limited |
| 18554225 | ETCHING METHOD AND PROCESSING DEVICE | Non-Final OA | Tokyo Electron Limited |
| 19004865 | PLASMA PROCESSING APPARATUS | Non-Final OA | Hitachi High-Tech Corporation |
| 18894665 | CARBON REPLENISHMENT OF SILICON-CONTAINING MATERIALS TO REDUCE THICKNESS LOSS | Non-Final OA | Applied Materials, Inc. |
| 18819904 | TRENCH-BASED SUPER JUNCTION STRUCTURES VIA SIDEWALL DOPING | Non-Final OA | Applied Materials, Inc. |
| 18781125 | CONFORMAL SELECTIVE ETCHING OF SILICON OXIDE | Non-Final OA | Applied Materials, Inc. |
| 18234685 | PLASMA ETCHING IN SEMICONDUCTOR PROCESSING | Non-Final OA | Applied Materials, Inc. |
| 18221505 | CYCLIC ETCH OF SILICON OXIDE AND SILICON NITRIDE | Non-Final OA | Applied Materials, Inc. |
| 18680497 | POLISHING COMPOSITION AND METHOD FOR CONDUCTING A MATERIAL REMOVING OPERATION | Final Rejection | SAINT-GOBAIN CERAMICS & PLASTICS, INC. |
| 18856974 | POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | Non-Final OA | Resonac Corporation |
| 18264534 | POLISHING LIQUID, POLISHING LIQUID SET AND POLISHING METHOD | Final Rejection | RESONAC CORPORATION |
| 17797333 | CMP POLISHING LIQUID AND POLISHING METHOD | Non-Final OA | Resonac Corporation |
| 18821589 | SYSTEMS AND METHODS FOR IMPROVING THE BOILING HEAT TRANSFER OF A HEAT TRANSFER COIL | Non-Final OA | Rheem Manufacturing Company |
| 18721939 | METHOD FOR PERFORMING NANOTRANSFER WITHOUT CHEMICAL TREATMENT AND SUBSTRATE FABRICATED BY THE METHOD | Final Rejection | NANYANG TECHNOLOGICAL UNIVERSITY |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy83.6% of resolved applications examined by Jiong-Ping Lu were allowed (974 resolved cases), compared with 62.4% across Art Unit 1713 over the last five years.
This examiner's interview lift is +7.9 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Jiong-Ping Lu took 781 days on average from filing to allowance.
Jiong-Ping Lu examines applications in Art Unit 1713 in Tech Center 2800 (Semiconductors, Circuits & Optics).
