Listed by the USPTO as MOJADDEDI, OMAR F
Tech Center 2800 • Art Units: 2815 2848 2892 2898
This examiner grants 90% of resolved cases
MOJADDEDI, OMAR F works in tech center 2800 and art unit 2815. The profile covers 546 resolved cases and shows an allowance rate of 89.6%. The median time to allowance is 859 days. Interview lift is 10.3%, indicating a modest interview-associated change against a high overall allowance result.
The listed companies are Texas Instruments Incorporated, Taiwan Semiconductor Manufacturing Company, Ltd., and NANYA TECHNOLOGY Corporation. The listed firms are VOLPE KOENIG, IntelliFluence Patent Firm, and MAIER & MAIER, PLLC. The case volume and allowance rate provide a strong planning baseline, while the shorter median duration supports attention to efficient prosecution.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18674524 | DISPLAY DEVICE | Non-Final OA | LG DISPLAY CO., LTD. |
| 18520126 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18516043 | COVER WINDOW AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18823940 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18183367 | POWER MODULE AND MANUFACTURING METHOD THEREOF, CONVERTER, AND ELECTRONIC DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 17710556 | TECHNOLOGIES FOR LIQUID METAL MIXTURES FOR ELECTRICAL INTERCONNECTS | Final Rejection | Intel Corporation |
| 18822687 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18583833 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18487022 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18568570 | PASSIVE ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | Sumitomo Electric Device Innovations, Inc. |
| 18795747 | MULTI-LAYER POLYSILICON STACK FOR SEMICONDUCTOR DEVICES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18091349 | PACKAGE SUBSTRATE HAVING DEPRESSION | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18544506 | INNER SPACER AND SOURCE DRAIN EPI | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18482213 | ELECTRONIC FUSE VIA AND LOGIC DEVICE CO-INTEGRATION WITH BACKSIDE POWER DELIVERY NETWORK | Final Rejection | International Business Machines Corporation |
| 18610037 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18545325 | MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18853795 | FILM FORMING METHOD, FILM FORMING APPARATUS, AND LAMINATE | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18438067 | FORMATION OF GATE ALL AROUND DEVICE | Non-Final OA | Applied Materials, Inc. |
| 18433681 | METHODS OF MANUFACTURING INTERCONNECT STRUCTURES | Final Rejection | Applied Materials, Inc. |
| 18186103 | SWITCH BASED ON PHASE-CHANGE MATERIAL | Non-Final OA | STMicroelectronics International N.V. |
| 18780581 | INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18482217 | Heat Dissipating Structure and Methods of Forming The Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18309874 | PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FORMING THE PACKAGE MODULE | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18307101 | STRUCTURAL ENCLOSURE FOR PROTECTION AGAINST FOREIGN OBJECT DEBRIS | Final Rejection | Raytheon Company |
| 18765112 | SEMICONDUCTOR STRUCTURE HAVING A MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18733103 | SEMICONDUCTOR STRUCTURE HAVING A MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18443683 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18894486 | SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 18758061 | SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 18060835 | DIELECTRIC THIN FILM COMPRISING PEROVSKITE MATERIAL, CAPACITOR INCLUDING THE DIELECTRIC THIN FILM, AND ELECTRONIC DEVICE INCLUDING THE CAPACITOR | Non-Final OA | Cornell University |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy89.6% of resolved applications examined by Omar F Mojaddedi were allowed (546 resolved cases), compared with 61.3% across Art Unit 2815 over the last five years.
This examiner's interview lift is +10.3 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Omar F Mojaddedi took 859 days on average from filing to allowance.
Omar F Mojaddedi examines applications in Art Unit 2815 in Tech Center 2800 (Semiconductors, Circuits & Optics).
