Listed by the USPTO as PIZARRO CRESPO, MARCOS D
Tech Center 2800 • Art Units: 2814
This examiner grants 67% of resolved cases
PIZARRO CRESPO, MARCOS D is assigned to technology center 2800 and art unit 2814. The profile covers 572 resolved cases, with an allowance rate of 66.6%. The case volume supports a useful view of recurring outcomes, while the rate indicates that allowances form a substantial portion of the record.
The median time to allowance is 1334 days. Interview lift is 14.5%, showing that interviews are associated with a higher allowance rate than matters without interviews. The effect supports interviews as a targeted supplement to written prosecution.
The recurring companies are Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., and Texas Instruments Incorporated. The listed firms are JCIPRNET, BIRCH STEWART KOLASCH & BIRCH, LLP, and Duane Morris LLP (UDC). Counsel should prepare for an extended prosecution path and use technically precise responses to preserve allowance prospects.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18450730 | IMAGE SENSOR WITH ENHANCED MULTI-SUBSTRATE STRUCTURES AND INTERCONNECTS | Final Rejection | Samsung Electronics Co., Ltd. |
| 18143735 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17820090 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18253628 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SONY GROUP CORPORATION |
| 18294529 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 17476373 | INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES | Non-Final OA | QUALCOMM Incorporated |
| 17934721 | MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT | Non-Final OA | Intel Corporation |
| 17126636 | MICROELECTRONIC STRUCTURES INCLUDING BRIDGES | Non-Final OA | Intel Corporation |
| 18162183 | JOINT STRUCTURE | Non-Final OA | TDK CORPORATION |
| 17514984 | CONDUCTIVE MEMBERS WITH UNOBSTRUCTED INTERFACIAL AREA FOR DIE ATTACH IN FLIP CHIP PACKAGES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17504182 | ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17879097 | SELECTION GATE STRUCTURE AND FABRICATION METHOD FOR 3D MEMORY | Final Rejection | Applied Materials, Inc. |
| 17089047 | PMOS High-K Metal Gates | Non-Final OA | Applied Materials, Inc. |
| 18311243 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18167081 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18156414 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18043730 | ADHESIVE FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | Non-Final OA | Resonac Corporation |
| 18166517 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Industrial Technology Research Institute |
| 18365273 | NON-COMMON CAPPING LAYER ON AN ORGANIC DEVICE | Final Rejection | UNIVERSAL DISPLAY CORPORATION |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy66.6% of resolved applications examined by Marcos D Pizarro Crespo were allowed (572 resolved cases), compared with 74.2% across Art Unit 2814 over the last five years.
This examiner's interview lift is +14.5 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Marcos D Pizarro Crespo took 1,334 days on average from filing to allowance.
Marcos D Pizarro Crespo examines applications in Art Unit 2814 in Tech Center 2800 (Semiconductors, Circuits & Optics).
