Listed by the USPTO as SMITH, CHAD
Tech Center 2800 • Art Units: 2874
This examiner grants 79% of resolved cases
SMITH, CHAD works in Tech Center 2800 and Art Unit 2874. He has 934 resolved cases, a 78.9% allowance rate, and a 20.4% interview lift. The median time to allowance is 870 days.
His listed companies are Huawei Technologies Co., Ltd., Intel Corporation, and Taiwan Semiconductor Manufacturing Company, Ltd. His listed firms are Alliance IP, LLC - Intel, JCIPRNET, and ARENTFOX SCHIFF LLP. The substantial case volume and allowance rate provide a useful basis for applicants assessing likely outcomes, while the interview lift supports considering examiner interviews.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18281500 | Optical Bandsplitter | Non-Final OA | Telefonaktiebolaget LM Ericsson (publ) |
| 18036280 | OPTICAL FILTER AND METHODS | Non-Final OA | Telefonaktiebolaget LM Ericsson (publ) |
| 18683923 | IMAGE DISPLAY APPARATUS AND DISPLAY APPARATUS | Final Rejection | SONY GROUP CORPORATION |
| 18734566 | CHIP AND OPTICAL COMMUNICATION DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18607089 | ELECTRO-OPTIC MODULATOR, MANUFACTURING METHOD THEREOF, AND OPTICAL COMMUNICATION SYSTEM | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18406249 | OPTICAL FIBER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF, OPTICAL FIBER INTERCONNECTION BOARD, AND FIBER DISPOSING DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18346039 | PHOTONIC INTEGRATED CIRCUIT AND OPTICAL COUPLER DESIGNS FOR IMPROVING PROCESS TOLERANCE | Non-Final OA | Intel Corporation |
| 18194147 | TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING ANGLES | Non-Final OA | Intel Corporation |
| 18732211 | PHOTONIC INTEGRATED CIRCUITS TO GLASS SUBSTRATE BONDING | Non-Final OA | Applied Materials, Inc. |
| 18635478 | TAPERED LIGHT ABSORPTION STRUCTURE FOR INTEGRATED CIRCUIT PHOTODETECTOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18365234 | SEMICONDUCTOR PACKAGE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18323483 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy78.9% of resolved applications examined by Chad Smith were allowed (934 resolved cases), compared with 78.9% across Art Unit 2874 over the last five years.
This examiner's interview lift is +20.4 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Chad Smith took 870 days on average from filing to allowance.
Chad Smith examines applications in Art Unit 2874 in Tech Center 2800 (Semiconductors, Circuits & Optics).
