Tech Center 2800 • Art Units: 2813 2899
This examiner grants 79% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18348777 | SINGLE-STEP VIA-LAST PROCESS FOR MULTI-STACK WAFERS | Non-Final OA | QUALCOMM Incorporated |
| 18364291 | SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
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