Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713 1718
This examiner grants 53% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18825121 | COOLING SYSTEM FOR SEMICONDUCTOR EQUIPMENT | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18443517 | DLC FILM DEPOSITION APPARATUS, SEMICONDUCTOR MANUFACTURING SYSTEM INCLUDING THE DLC FILM DEPOSITION APPARATUS, AND SEMICONDUCOR MANUFACTURING METHOD USING THE DLC FILM DEPOSITION APPARATUS | Final Rejection | Samsung Electronics Co., Ltd. |
| 18418868 | CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING METHOD | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18239155 | PLASMA PROCESSING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18209641 | SHOWERHEAD AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17993055 | GAS SUPPLY MODULE AND SUBSTRATE PROCESSING APPARATUS USING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18467775 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 17837364 | MANUFACTURING APPARATUS FOR GROUP-III COMPOUND SEMICONDUCTOR CRYSTAL | Final Rejection | Panasonic Holdings Corporation |
| 18787053 | PROTECTED METALLIC COMPONENTS, REACTION CHAMBERS INCLUDING PROTECTED METALLIC COMPONENTS, AND METHODS FOR FORMING AND UTILIZING PROTECTED METALLIC COMPONENTS | Final Rejection | ASM IP Holding B.V. |
| 18678219 | SEMICONDUCTOR PROCESSING APPARATUS AND METHODS FOR CALIBRATING A SEMICONDUCTOR PROCESSING APPARATUS | Non-Final OA | ASM IP Holding B.V. |
| 18638154 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | ASM IP Holding B.V. |
| 18585313 | WAFER PROCESSING APPARATUS WITH FILM UNIFORMITY IMPROVEMENT CAPABILITIES | Non-Final OA | ASM IP Holding B.V. |
| 18105275 | REACTOR COOLING SYSTEM | Non-Final OA | ASM IP Holding B.V. |
| 17847470 | SUBSTRATE PROCESSING APPRATUS INCLUDING A SUBSTRATE LIFT MECHANISM | Final Rejection | ASM IP Holding B.V. |
| 18690918 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Hitachi High-Tech Corporation |
| 18437139 | SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17232319 | SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18590478 | GAS INJECTOR ASSEMBLY WITH IMPROVED GAS MIXING | Non-Final OA | Applied Materials, Inc. |
| 18424470 | SYSTEMS AND METHODS FOR HIGH-THROUGHPUT ANGLED ION PROCESSING | Final Rejection | Applied Materials, Inc. |
| 18232668 | SHOWERHEAD FOR FAST DELIVERY OF INCOMPATABLE PRECURSORS | Non-Final OA | Applied Materials, Inc. |
| 18223184 | SHAPED FACEPLATE FOR EXTREME EDGE FILM UNIFORMITY | Final Rejection | Applied Materials, Inc. |
| 18122530 | PROCESSING SYSTEMS, CHAMBERS, AND RELATED METHODS INCLUDING THERMOELECTRIC GENERATORS FOR ENERGY HARNESSING | Final Rejection | Applied Materials, Inc. |
| 17835730 | HIGH-EFFICIENCY RF REMOTE PLASMA SOURCE APPARATUS | Non-Final OA | Applied Materials, Inc. |
| 17566584 | UNIFORMITY CONTROL FOR PLASMA PROCESSING USING WALL RECOMBINATION | Non-Final OA | Applied Materials, Inc. |
| 17549703 | METHOD TO MEASURE RADICAL ION FLUX USING A MODIFIED PIRANI VACUUM GAUGE ARCHITECTURE | Non-Final OA | Applied Materials, Inc |
| 17463966 | INTEGRATED EPITAXY AND PRECLEAN SYSTEM | Final Rejection | Applied Materials, Inc. |
| 17244752 | SUBSTRATE SUPPORT APPARATUS, METHODS, AND SYSTEMS HAVING ELEVATED SURFACES FOR HEAT TRANSFER | Non-Final OA | Applied Materials, Inc. |
| 18648828 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18108391 | PLASMA PROCESSING APPARATUS | Final Rejection | TOKYO ELECTRON LIMITED |
| 17994711 | PLASMA PROCESSING APPARATUS AND MICROWAVE RADIATION SOURCE | Final Rejection | Tokyo Electron Limited |
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