Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713 1718
This examiner grants 53% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18443517 | DLC FILM DEPOSITION APPARATUS, SEMICONDUCTOR MANUFACTURING SYSTEM INCLUDING THE DLC FILM DEPOSITION APPARATUS, AND SEMICONDUCOR MANUFACTURING METHOD USING THE DLC FILM DEPOSITION APPARATUS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17993055 | GAS SUPPLY MODULE AND SUBSTRATE PROCESSING APPARATUS USING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18787053 | PROTECTED METALLIC COMPONENTS, REACTION CHAMBERS INCLUDING PROTECTED METALLIC COMPONENTS, AND METHODS FOR FORMING AND UTILIZING PROTECTED METALLIC COMPONENTS | Non-Final OA | ASM IP Holding B.V. |
| 18638154 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | ASM IP Holding B.V. |
| 18195456 | FILM FORMING APPARATUS WITH ANNULAR EXHAUST DUCT | Non-Final OA | ASM IP Holding B.V. |
| 18498239 | WEB COATING COOLING DRUM WITH TURBULATORS FOR HIGH FLUX METALLIC LITHIUM DEPOSITION | Final Rejection | Applied Materials, Inc. |
| 18223184 | SHAPED FACEPLATE FOR EXTREME EDGE FILM UNIFORMITY | Non-Final OA | Applied Materials, Inc. |
| 18122530 | PROCESSING SYSTEMS, CHAMBERS, AND RELATED METHODS INCLUDING THERMOELECTRIC GENERATORS FOR ENERGY HARNESSING | Final Rejection | Applied Materials, Inc. |
| 17566584 | UNIFORMITY CONTROL FOR PLASMA PROCESSING USING WALL RECOMBINATION | Final Rejection | Applied Materials, Inc. |
| 17463966 | INTEGRATED EPITAXY AND PRECLEAN SYSTEM | Final Rejection | Applied Materials, Inc. |
| 18308149 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | SCREEN Holdings Co., Ltd. |
| 18250653 | GAS ABATEMENT BY PLASMA | Non-Final OA | Edwards Limited |
| 18432699 | MIST CVD FILM FORMATION DEVICE AND FILM FORMATION METHOD | Final Rejection | Murata Manufacturing Co., Ltd. |
| 17994711 | PLASMA PROCESSING APPARATUS AND MICROWAVE RADIATION SOURCE | Non-Final OA | Tokyo Electron Limited |
| 17879803 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 17232319 | SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17186498 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 18682869 | ION BEAM ETCH SYSTEM AND METHOD | Non-Final OA | Lam Research Corporation |
| 18009903 | MATCHED CHEMISTRY COMPONENT BODY AND COATING FOR A SEMICONDUCTOR PROCESSING CHAMBER | Final Rejection | Lam Research Corporation |
| 18164799 | WAFER PLACEMENT TABLE | Non-Final OA | NGK Insulators, Ltd. |
| 17710269 | PLASMA GENERATION UNIT, AND APPARATUS FOR TREATING SUBSTRATE WITH THE SAME | Final Rejection | PSK INC. |
| 18681894 | AN ATOMIC LAYER DEPOSITION REACTION CHAMBER AND AN ATOMIC LAYER DEPOSITION REACTOR | Non-Final OA | BENEQ OY |
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