Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713 1718
This examiner grants 53% of resolved cases
Kurt D Sweely is an examiner in Tech Center 1700 and Art Unit 1713. With 229 resolved cases, the examiner has an allowance rate of 52.4 percent. This 52.4 percent rate indicates a docket where a portion of the applications result in a patent grant. The 229 resolved cases provide a sample size, suggesting that these metrics are a reflection of the examiner's prosecution patterns.
The interview lift is 33.8 percent. This 33.8 percent lift is a significant increase over the base allowance rate. This suggests that interviews are a highly effective tool for moving cases toward allowance. The median days to allowance is 1354. For practitioners, the 33.8 percent lift is a key takeaway. It indicates that direct communication can improve the odds of success beyond the 52.4 percent base rate and help navigate the 1354-day timeline more effectively toward a grant. Strategy should prioritize interviews to capitalize on this lift.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18825121 | COOLING SYSTEM FOR SEMICONDUCTOR EQUIPMENT | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18443517 | DLC FILM DEPOSITION APPARATUS, SEMICONDUCTOR MANUFACTURING SYSTEM INCLUDING THE DLC FILM DEPOSITION APPARATUS, AND SEMICONDUCOR MANUFACTURING METHOD USING THE DLC FILM DEPOSITION APPARATUS | Final Rejection | Samsung Electronics Co., Ltd. |
| 18418868 | CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING METHOD | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18383207 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18787053 | PROTECTED METALLIC COMPONENTS, REACTION CHAMBERS INCLUDING PROTECTED METALLIC COMPONENTS, AND METHODS FOR FORMING AND UTILIZING PROTECTED METALLIC COMPONENTS | Final Rejection | ASM IP Holding B.V. |
| 18585313 | WAFER PROCESSING APPARATUS WITH FILM UNIFORMITY IMPROVEMENT CAPABILITIES | Non-Final OA | ASM IP Holding B.V. |
| 18195456 | FILM FORMING APPARATUS WITH ANNULAR EXHAUST DUCT | Final Rejection | ASM IP Holding B.V. |
| 18105275 | REACTOR COOLING SYSTEM | Non-Final OA | ASM IP Holding B.V. |
| 17847470 | SUBSTRATE PROCESSING APPRATUS INCLUDING A SUBSTRATE LIFT MECHANISM | Final Rejection | ASM IP Holding B.V. |
| 18432699 | MIST CVD FILM FORMATION DEVICE AND FILM FORMATION METHOD | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18690918 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Hitachi High-Tech Corporation |
| 18427691 | MINIMIZING RADICAL RECOMBINATION USING ALD SILICON OXIDE SURFACE COATING WITH INTERMITTENT RESTORATION PLASMA | Final Rejection | Lam Research Corporation |
| 18550664 | ADJUSTABLE DIELECTRIC CONSTANT CERAMIC WINDOW | Non-Final OA | Lam Research Corporation |
| 18042198 | C-shroud Modification For Plasma Uniformity Without Impacting Mechanical Strength Or Lifetime Of The C-shroud | Final Rejection | Lam Research Corporation |
| 18003139 | INTEGRATION OF VAPOR DEPOSITION PROCESS INTO PLASMA ETCH REACTOR | Final Rejection | Lam Research Corporation |
| 18437139 | SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17232319 | SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18617280 | ARC REDUCTION USING UNREFERENCED FLOATING POWER SUPPLIES | Non-Final OA | Applied Materials, Inc. |
| 18232668 | SHOWERHEAD FOR FAST DELIVERY OF INCOMPATABLE PRECURSORS | Non-Final OA | Applied Materials, Inc. |
| 18223184 | SHAPED FACEPLATE FOR EXTREME EDGE FILM UNIFORMITY | Final Rejection | Applied Materials, Inc. |
| 18122530 | PROCESSING SYSTEMS, CHAMBERS, AND RELATED METHODS INCLUDING THERMOELECTRIC GENERATORS FOR ENERGY HARNESSING | Final Rejection | Applied Materials, Inc. |
| 17835730 | HIGH-EFFICIENCY RF REMOTE PLASMA SOURCE APPARATUS | Non-Final OA | Applied Materials, Inc. |
| 17549703 | METHOD TO MEASURE RADICAL ION FLUX USING A MODIFIED PIRANI VACUUM GAUGE ARCHITECTURE | Non-Final OA | Applied Materials, Inc |
| 17244752 | SUBSTRATE SUPPORT APPARATUS, METHODS, AND SYSTEMS HAVING ELEVATED SURFACES FOR HEAT TRANSFER | Non-Final OA | Applied Materials, Inc. |
| 18648828 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18616526 | PLASMA ETCHING APPARATUS AND PLASMA ETCHING METHOD | Final Rejection | Tokyo Electron Limited |
| 18108391 | PLASMA PROCESSING APPARATUS | Final Rejection | TOKYO ELECTRON LIMITED |
| 18222607 | METHOD AND TOOL FOR FILM DEPOSITION | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 17880880 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | SCREEN Holdings Co., Ltd. |
| 18416864 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | EUGENE TECHNOLOGY CO., LTD. |
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