Tech Center 1700 • Art Units: 1718
This examiner grants 53% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18443517 | DLC FILM DEPOSITION APPARATUS, SEMICONDUCTOR MANUFACTURING SYSTEM INCLUDING THE DLC FILM DEPOSITION APPARATUS, AND SEMICONDUCOR MANUFACTURING METHOD USING THE DLC FILM DEPOSITION APPARATUS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18239155 | PLASMA PROCESSING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17993055 | GAS SUPPLY MODULE AND SUBSTRATE PROCESSING APPARATUS USING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18602099 | CHAMBER ARCHITECTURE FOR EPITAXIAL DEPOSITION AND ADVANCED EPITAXIAL FILM APPLICATIONS | Non-Final OA | Applied Materials, Inc. |
| 18498239 | WEB COATING COOLING DRUM WITH TURBULATORS FOR HIGH FLUX METALLIC LITHIUM DEPOSITION | Final Rejection | Applied Materials, Inc. |
| 18223184 | SHAPED FACEPLATE FOR EXTREME EDGE FILM UNIFORMITY | Non-Final OA | Applied Materials, Inc. |
| 18122530 | PROCESSING SYSTEMS, CHAMBERS, AND RELATED METHODS INCLUDING THERMOELECTRIC GENERATORS FOR ENERGY HARNESSING | Final Rejection | Applied Materials, Inc. |
| 17835730 | HIGH-EFFICIENCY RF REMOTE PLASMA SOURCE APPARATUS | Final Rejection | Applied Materials, Inc. |
| 17566584 | UNIFORMITY CONTROL FOR PLASMA PROCESSING USING WALL RECOMBINATION | Final Rejection | Applied Materials, Inc. |
| 17549703 | METHOD TO MEASURE RADICAL ION FLUX USING A MODIFIED PIRANI VACUUM GAUGE ARCHITECTURE | Final Rejection | Applied Materials, Inc |
| 17463966 | INTEGRATED EPITAXY AND PRECLEAN SYSTEM | Final Rejection | Applied Materials, Inc. |
| 17244752 | SUBSTRATE SUPPORT APPARATUS, METHODS, AND SYSTEMS HAVING ELEVATED SURFACES FOR HEAT TRANSFER | Final Rejection | Applied Materials, Inc. |
| 18308149 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | SCREEN Holdings Co., Ltd. |
| 17880880 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 18902536 | CERAMIC SUSCEPTOR AND METHOD OF MANUFACTURING SAME | Final Rejection | MiCo Ceramics Ltd. |
| 18536813 | DEPOSITION APPARATUS AND PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 17994711 | PLASMA PROCESSING APPARATUS AND MICROWAVE RADIATION SOURCE | Non-Final OA | Tokyo Electron Limited |
| 17879803 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18432699 | MIST CVD FILM FORMATION DEVICE AND FILM FORMATION METHOD | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18638154 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | ASM IP Holding B.V. |
| 18170289 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PLASMA GENERATING APPARATUS | Non-Final OA | Kokusai Electric Corporation |
| 17186498 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 18083555 | ANTENNA ASSEMBLY AND PLASMA PROCESSING EQUIPMENT INCLUDING SAME | Final Rejection | SEMES CO., LTD. |
| 18250653 | GAS ABATEMENT BY PLASMA | Final Rejection | Edwards Limited |
| 18042198 | C-shroud Modification For Plasma Uniformity Without Impacting Mechanical Strength Or Lifetime Of The C-shroud | Final Rejection | Lam Research Corporation |
| 18009903 | MATCHED CHEMISTRY COMPONENT BODY AND COATING FOR A SEMICONDUCTOR PROCESSING CHAMBER | Final Rejection | Lam Research Corporation |
| 18164799 | WAFER PLACEMENT TABLE | Non-Final OA | NGK Insulators, Ltd. |
| 17791075 | SUBSTRATE PROCESSING APPARATUS AND METHOD | Non-Final OA | Picosun Oy |
| 18580516 | REACTION CHAMBER AND SEMICONDUCTOR EQUIPMENT | Non-Final OA | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| 18681894 | AN ATOMIC LAYER DEPOSITION REACTION CHAMBER AND AN ATOMIC LAYER DEPOSITION REACTOR | Non-Final OA | BENEQ OY |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy