Prosecution Insights
Last updated: October 02, 2026

Examiner: TORNOW, MARK W

Tech Center 2800 • Art Units: 2891

This examiner grants 77% of resolved cases

Analysis

Mark W. Tornow is an examiner in Art Unit 2891 of Tech Center 2800. He has 752 resolved cases and an allowance rate of 77.4 percent. This 77.4 percent rate suggests a good probability of success for applications that reach a final disposition. This figure serves as a baseline for practitioners navigating the prosecution process.

The interview lift is 13.0 percent. This 13.0 percent lift indicates that interviews are a productive way to advance prosecution and increase the likelihood of an allowance. Practitioners should consider this lift when deciding whether to engage in a formal discussion to resolve outstanding issues and improve upon the 77.4 percent baseline for the 752 resolved cases.

The median days to allowance is 1054. This 1054-day timeframe represents the typical duration of the prosecution process. For the applications in Art Unit 2891, the 1054-day median and the 77.4 percent allowance rate provide a reliable set of expectations for applications assigned to Tornow.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

77.4%
Allow Rate
+9.4% vs TC avg
770
Total Applications
+13.0%
Interview Lift
1054
Avg Prosecution Days
Based on 752 resolved cases, 2023–2026

Rejection Statute Breakdown

0.6%
§101 Eligibility
26.7%
§102 Novelty
45.9%
§103 Obviousness
21.3%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18411543 DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME Non-Final OA Samsung Display Co., LTD.
18426691 SUBSTRATES INCLUDING RAISED INTERCONNECTS DISPOSED ON A DIE-SIDE SURFACE TO SUPPORT INCREASED INTERCONNECT DENSITY AND RELATED METHODS Non-Final OA QUALCOMM Incorporated
18343892 MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FOR HYBRID BONDING AND DIE ENCAPSULATION Non-Final OA Intel Corporation
18204212 PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY Non-Final OA Intel Corporation
18652354 THERMOELECTRIC COOLER INTEGRATION Non-Final OA INTERNATIONAL BUSINESS MACHINES CORPORATION
18426664 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18581339 SILICON CARBIDE POWER DEVICES HAVING EXPANDED CREEPAGE DISTANCES Non-Final OA Wolfspeed, Inc.
18786905 SINGLE CHIP MULTI BAND LED Non-Final OA SEOUL VIOSYS CO., LTD.

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