4 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18467481 | MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONSTITUTED WAFER | GHEYAS, SYED I | 2893 | Non-Final OA | Sep 14, 2023 |
| 18129653 | TANDEM OLED DEVICES WITH STABLE INORGANIC CHARGE GENERATION LAYERS | SHEKER, RHYS PONIENTE | 2813 | Non-Final OA | Mar 31, 2023 |
| 17577944 | Network On Layer Enabled Architectures | LEWIS-TAYLOR, DAYTON A. | 2181 | Final Rejection | Jan 18, 2022 |
| 17362557 | TECHNIQUES FOR MANUFACTURING SPLIT-CELL 3D-NAND MEMORY DEVICES | CORNELY, JOHN PATRICK | 2812 | Non-Final OA | Jun 29, 2021 |
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