7 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18418507 | POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION | DRAVININKAS, ADAM B | 2835 | Non-Final OA | Jan 22, 2024 |
| 18399678 | METHOD OF MANUFACTURING PRE-MOLDED LEAD FRAME FOR PACKAGING | NGUYEN, SOPHIA T | 2893 | Non-Final OA | Dec 28, 2023 |
| 18527703 | FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS | SANDVIK, BENJAMIN P | 2812 | Non-Final OA | Dec 04, 2023 |
| 18455156 | PACKAGE WITH EMBEDDED TRACES | TRAN, TAN N | 2812 | Final Rejection | Aug 24, 2023 |
| 17983305 | DIE SUCTION ASSISTANCE DEVICE | GARFT, CHRISTOPHER | 3632 | Non-Final OA | Nov 08, 2022 |
| 17961544 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | BOEGEL, CHEVY JACOB | 2812 | Final Rejection | Oct 06, 2022 |
| 17529231 | METHOD OF FORMING POWER SEMICONDUCTOR DEVICE COMPRISING FORMING AN ISOLATION TRENCH STRUCTURE IN THE TERMINATION REGION | MAI, ANH D | 2893 | Non-Final OA | Nov 17, 2021 |
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