7 pending office actions • 4 art units • 7 examiners • 0 of 7 (0%) have an AI response strategy ready • 10 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 6 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 6 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 2 (29%) |
| Multi-statute (no §101) | 5 (71%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| LEE, EUGENE | 1 | 81.8% | +5.7% |
| DRAVININKAS, ADAM B | 1 | 74.8% | +14.8% |
| NGUYEN, SOPHIA T | 1 | 45.0% | +13.7% |
| SANDVIK, BENJAMIN P | 1 | 76.7% | +6.2% |
| TRAN, TAN N | 1 | 86.7% | +10.0% |
| GARFT, CHRISTOPHER | 1 | 59.1% | +23.1% |
| MAI, ANH D | 1 | 37.9% | +10.0% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18455156 | PACKAGE WITH EMBEDDED TRACES | TRAN, TAN N | 13d |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 5 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18418507 | POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION | DRAVININKAS, ADAM B | 80d overdue |
| 17983305 | DIE SUCTION ASSISTANCE DEVICE | GARFT, CHRISTOPHER | 56d overdue |
| 18527703 | FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS | SANDVIK, BENJAMIN P | 8d overdue |
| 17529231 | METHOD OF FORMING POWER SEMICONDUCTOR DEVICE COMPRISING FORMING AN ISOLATION TRENCH STRUCTURE IN THE TERMINATION REGION | MAI, ANH D | 19d |
| 18764577 | ULTRA-THIN PACKAGED COMPONENT | LEE, EUGENE | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 5 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18418507 | POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION | DRAVININKAS, ADAM B | 80d overdue |
| 17983305 | DIE SUCTION ASSISTANCE DEVICE | GARFT, CHRISTOPHER | 56d overdue |
| 18399678 | METHOD OF MANUFACTURING PRE-MOLDED LEAD FRAME FOR PACKAGING | NGUYEN, SOPHIA T | 2d overdue |
| 18455156 | PACKAGE WITH EMBEDDED TRACES | TRAN, TAN N | 13d |
| 17529231 | METHOD OF FORMING POWER SEMICONDUCTOR DEVICE COMPRISING FORMING AN ISOLATION TRENCH STRUCTURE IN THE TERMINATION REGION | MAI, ANH D | 19d |
| Art Unit | Apps |
|---|---|
| 2893 | 2 |
| 2812 | 2 |
| 2835 | 1 |
| 3632 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18764577 | ULTRA-THIN PACKAGED COMPONENT | LEE, EUGENE | — | §103§112 | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18418507 | POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION | DRAVININKAS, ADAM B | 2835 | §102§103 | Non-Final OA | 80d overdue | Pending | Jan 22, 2024 |
| 18399678 | METHOD OF MANUFACTURING PRE-MOLDED LEAD FRAME FOR PACKAGING | NGUYEN, SOPHIA T | 2893 | §103 | Non-Final OA | 2d overdue | Pending | Dec 28, 2023 |
| 18527703 | FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS | SANDVIK, BENJAMIN P | 2812 | §102§103§112 | Final Rejection | 8d overdue | Pending | Dec 04, 2023 |
| 18455156 | PACKAGE WITH EMBEDDED TRACES | TRAN, TAN N | 2812 | §103 | Final Rejection | 13d | Pending | Aug 24, 2023 |
| 17983305 | DIE SUCTION ASSISTANCE DEVICE | GARFT, CHRISTOPHER | 3632 | §102§103 | Non-Final OA | 56d overdue | Pending | Nov 08, 2022 |
| 17529231 | METHOD OF FORMING POWER SEMICONDUCTOR DEVICE COMPRISING FORMING AN ISOLATION TRENCH STRUCTURE IN THE TERMINATION REGION | MAI, ANH D | 2893 | §103§112 | Non-Final OA | 19d | Pending | Nov 17, 2021 |
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