Prosecution Insights
Last updated: August 06, 2026

Panjit International Inc.

7 pending office actions • 4 art units • 7 examiners • 0 of 7 (0%) have an AI response strategy ready • 10 patents granted in the last 365 days

Portfolio Summary

7
Total Pending OAs
5
Non-Final OAs
2
Final Rejections
0
Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 6 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

4
Overdue
0
Due this week
2
Due this month
0
Due in next 60 days
0
Due later

Deadline Fire Line

Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 6 of the docket's apps have a known mailing date.

-30dToday30d60d90d120d
Overdue (4)Due ≤ 30 days (2)

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

5
Hard (71%)
2
Medium (29%)
0
Easy (0%)
0
Unknown (0%)

Rejection Statute Mix

BucketCases
§103 only2 (29%)
Multi-statute (no §101)5 (71%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

0
Life Sciences
0% of docket
0
Information Tech
0% of docket
0
Communications
0% of docket
5
Semiconductors
71% of docket
1
Mechanical / Eng
14% of docket
1
Business / Other
14% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

70 h
Manual time on pending OAs
14 h
Time saved (low, 20%)
24 h
Time saved (mid, 35%)
0.6 wks
FTE-weeks freed (mid)

Top Examiners on this docket

ExaminerApps on this docketAllow rateInterview lift
LEE, EUGENE 1 81.8% +5.7%
DRAVININKAS, ADAM B 1 74.8% +14.8%
NGUYEN, SOPHIA T 1 45.0% +13.7%
SANDVIK, BENJAMIN P 1 76.7% +6.2%
TRAN, TAN N 1 86.7% +10.0%
GARFT, CHRISTOPHER 1 59.1% +23.1%
MAI, ANH D 1 37.9% +10.0%

Quick Wins (1)

Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.

App #TitleExaminerDue in
18455156 PACKAGE WITH EMBEDDED TRACES TRAN, TAN N 13d

Hard Cases (5)

Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 5 ordered by deadline are shown.

App #TitleExaminerDue in
18418507 POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION DRAVININKAS, ADAM B 80d overdue
17983305 DIE SUCTION ASSISTANCE DEVICE GARFT, CHRISTOPHER 56d overdue
18527703 FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS SANDVIK, BENJAMIN P 8d overdue
17529231 METHOD OF FORMING POWER SEMICONDUCTOR DEVICE COMPRISING FORMING AN ISOLATION TRENCH STRUCTURE IN THE TERMINATION REGION MAI, ANH D 19d
18764577 ULTRA-THIN PACKAGED COMPONENT LEE, EUGENE

Interview Candidates (5)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 5 ordered by deadline are shown.

App #TitleExaminerDue in
18418507 POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION DRAVININKAS, ADAM B 80d overdue
17983305 DIE SUCTION ASSISTANCE DEVICE GARFT, CHRISTOPHER 56d overdue
18399678 METHOD OF MANUFACTURING PRE-MOLDED LEAD FRAME FOR PACKAGING NGUYEN, SOPHIA T 2d overdue
18455156 PACKAGE WITH EMBEDDED TRACES TRAN, TAN N 13d
17529231 METHOD OF FORMING POWER SEMICONDUCTOR DEVICE COMPRISING FORMING AN ISOLATION TRENCH STRUCTURE IN THE TERMINATION REGION MAI, ANH D 19d

Top Art Units

Art UnitApps
2893 2
2812 2
2835 1
3632 1

Pending Office Actions

App #TitleExaminerArt UnitStatutesStatusDue inAIFiled
18764577 ULTRA-THIN PACKAGED COMPONENT LEE, EUGENE §103§112 Non-Final OA Pending Jul 05, 2024
18418507 POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION DRAVININKAS, ADAM B 2835 §102§103 Non-Final OA 80d overdue Pending Jan 22, 2024
18399678 METHOD OF MANUFACTURING PRE-MOLDED LEAD FRAME FOR PACKAGING NGUYEN, SOPHIA T 2893 §103 Non-Final OA 2d overdue Pending Dec 28, 2023
18527703 FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS SANDVIK, BENJAMIN P 2812 §102§103§112 Final Rejection 8d overdue Pending Dec 04, 2023
18455156 PACKAGE WITH EMBEDDED TRACES TRAN, TAN N 2812 §103 Final Rejection 13d Pending Aug 24, 2023
17983305 DIE SUCTION ASSISTANCE DEVICE GARFT, CHRISTOPHER 3632 §102§103 Non-Final OA 56d overdue Pending Nov 08, 2022
17529231 METHOD OF FORMING POWER SEMICONDUCTOR DEVICE COMPRISING FORMING AN ISOLATION TRENCH STRUCTURE IN THE TERMINATION REGION MAI, ANH D 2893 §103§112 Non-Final OA 19d Pending Nov 17, 2021

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