Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2826 2878
This examiner grants 77% of resolved cases
Benjamin P. Sandvik serves as an examiner in Tech Center 2800 and Art Unit 2812. The examiner has handled 1172 resolved cases, providing a robust dataset for analysis. The allowance rate for these cases is 76.9 percent. This 76.9 percent rate indicates a favorable environment for applicants seeking patent protection under this examiner's review.
The data shows an interview lift of 6.2 percent. This 6.2 percent lift suggests that interviews can provide a benefit to the prosecution outcome. The median days to allowance is 992. This 992-day period represents the typical timeline for applications that reach a grant in Art Unit 2812. The 1172 resolved cases reflect the examiner's extensive experience within Tech Center 2800.
Applicants can use the 992 median days to allowance to plan their IP strategy and resource allocation. The 76.9 percent allowance rate is a primary indicator of the examiner's historical receptiveness to applications. Furthermore, the 6.2 percent interview lift offers a data point for evaluating the impact of direct communication during the examination process.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18406800 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Samsung Electronics Co., Ltd. |
| 18394364 | SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE | Final Rejection | NXP B.V. |
| 18752888 | DISPLAY APPARATUS | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18655033 | HYBRID BONDING IN TOPOGRAPHIC PACKAGES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 17931826 | METHOD OF BONDING THIN SUBSTRATES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18688851 | DISPLAY APPARATUS | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18394399 | PACKAGING ARCHITECTURE FOR PHOTONIC COMPONENTS | Non-Final OA | NOKIA SOLUTIONS AND NETWORKS OY |
| 18714550 | GRADIENT LINER IN METAL FILL | Non-Final OA | Lam Research Corporation |
| 18956678 | OPTICAL SENSOR PACKAGING AND METHOD OF MANUFACTURE | Non-Final OA | STMicroelectronics International N.V. |
| 18614936 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICONDUCTOR DEVICE AND MOUNTING ASSEMBLY | Non-Final OA | STMicroelectronics International N.V. |
| 18789054 | SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACK | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18788414 | SEMICONDUCTOR STRUCTURE HAVING EPITAXIAL STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18788783 | INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18771255 | METHODS OF MANUFACTURING SPIN-ORBIT-TORQUE MAGNETIC DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18770299 | DUAL CRYSTAL ORIENTATION FOR SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18423616 | INTEGRATED CHIP AND METHOD OF FORMING THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18512339 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18885851 | FETS and Methods of Forming FETS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18674906 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18628447 | LED LAMP WITH INFRARED OUTPUT | Non-Final OA | LUMILEDS LLC |
| 18586517 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18592273 | MULTI-CHIP SEMICONDUCTOR MODULE WITH BALANCED SWITCHING | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 17982849 | LIGHT IRRADIATION DEVICE AND LIGHT SOURCE UNIT | Final Rejection | Ushio Denki Kabushiki Kaisha |
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