Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2826
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18524094 | SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18512923 | METHOD AND SYSTEM FOR PROCESSING SUBSTRATES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18382300 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18491559 | PHOTOELECTRIC CONVERSION DEVICE HAVING INSULATOR WITH A BAND SHAPE, AND PHOTOELECTRIC CONVERSION SYSTEM | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18187755 | PHOTOELECTRIC CONVERSION DEVICE AND EQUIPMENT | Final Rejection | CANON KABUSHIKI KAISHA |
| 17861834 | MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE | Final Rejection | ROHM CO., LTD. |
| 18454107 | DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17661418 | DIAMOND-METAL COMPOSITE HIGH POWER DEVICE PACKAGES | Final Rejection | MACOM Technology Solutions Holdings, Inc. |
| 18240560 | STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEANDERING DIELECTRIC ISOLATION STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 17982849 | LIGHT IRRADIATION DEVICE AND LIGHT SOURCE UNIT | Final Rejection | Ushio Denki Kabushiki Kaisha |
| 18382572 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TONG HSING ELECTRONIC INDUSTRIES, LTD. |
| 18393633 | CHIP PACKAGE WITH HEAT DISSIPATION AND ELECTROMAGNETIC PROTECTION | Non-Final OA | WALTON ADVANCED ENGINEERING, INC. |
| 18527703 | FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS | Non-Final OA | PANJIT INTERNATIONAL INC. |
| 17931826 | METHOD OF BONDING THIN SUBSTRATES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 17940662 | SEMICONDUCTOR DEVICE | Final Rejection | EPISTAR CORPORATION |
| 18532950 | SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE | Non-Final OA | SHENZHEN STS MICROELECTRONICS CO., LTD. |
| 18486232 | MONOLITHIC MULTIPLE-CHANNEL PROTECTION DEVICE | Final Rejection | Littelfuse Semiconductor (Wuxi) Co., Ltd. |
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