Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2826 2878
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18633456 | CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18406800 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Samsung Electronics Co., Ltd. |
| 18473126 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18685512 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18417185 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | SAMSUNG DISPLAY CO., LTD. |
| 17931826 | METHOD OF BONDING THIN SUBSTRATES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18394364 | SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE | Final Rejection | NXP B.V. |
| 18394399 | PACKAGING ARCHITECTURE FOR PHOTONIC COMPONENTS | Non-Final OA | NOKIA SOLUTIONS AND NETWORKS OY |
| 18768468 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18423616 | INTEGRATED CHIP AND METHOD OF FORMING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18404226 | HYBRID NANOSTRUCTURE SCHEME AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18586259 | MIXED ACTIVATING AND REDUCING AGENT FOR BONDING | Non-Final OA | Tokyo Electron Limited |
| 18628447 | LED LAMP WITH INFRARED OUTPUT | Non-Final OA | LUMILEDS LLC |
| 18956678 | OPTICAL SENSOR PACKAGING AND METHOD OF MANUFACTURE | Non-Final OA | STMicroelectronics International N.V. |
| 18614936 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICONDUCTOR DEVICE AND MOUNTING ASSEMBLY | Non-Final OA | STMicroelectronics International N.V. |
| 17982849 | LIGHT IRRADIATION DEVICE AND LIGHT SOURCE UNIT | Final Rejection | Ushio Denki Kabushiki Kaisha |
| 18410202 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Winbond Electronics Corp. |
| 18382572 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TONG HSING ELECTRONIC INDUSTRIES, LTD. |
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