Prosecution Insights
Last updated: April 19, 2026

Examiner: SANDVIK, BENJAMIN P

Tech Center 2800 • Art Units: 2812 2826

This examiner grants 76% of resolved cases

Performance Statistics

76.5%
Allow Rate
+8.5% vs TC avg
1167
Total Applications
+6.0%
Interview Lift
999
Avg Prosecution Days
Based on 1142 resolved cases, 2023–2026

Rejection Statute Breakdown

0.5%
§101 Eligibility
25.2%
§102 Novelty
60.5%
§103 Obviousness
6.7%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18524094 SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18115205 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME Final Rejection LG Display Co., Ltd.
18382300 DISPLAY DEVICE Non-Final OA Samsung Display Co., LTD.
18491559 PHOTOELECTRIC CONVERSION DEVICE HAVING INSULATOR WITH A BAND SHAPE, AND PHOTOELECTRIC CONVERSION SYSTEM Non-Final OA CANON KABUSHIKI KAISHA
18187755 PHOTOELECTRIC CONVERSION DEVICE AND EQUIPMENT Final Rejection CANON KABUSHIKI KAISHA
18454107 DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
17861834 MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE Non-Final OA ROHM CO., LTD.
18222876 MEMORY AND FABRICATION METHOD THEREOF AND MEMORY SYSTEM Non-Final OA YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18343447 GUARD RING CAPACITOR METHOD AND STRUCTURE Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
17661418 DIAMOND-METAL COMPOSITE HIGH POWER DEVICE PACKAGES Final Rejection MACOM Technology Solutions Holdings, Inc.
18240560 STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEANDERING DIELECTRIC ISOLATION STRUCTURE AND METHODS OF FORMING THE SAME Non-Final OA SANDISK TECHNOLOGIES LLC
17931826 METHOD OF BONDING THIN SUBSTRATES Non-Final OA ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
18382572 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Non-Final OA TONG HSING ELECTRONIC INDUSTRIES, LTD.
18527703 FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS Non-Final OA PANJIT INTERNATIONAL INC.
17940662 SEMICONDUCTOR DEVICE Final Rejection EPISTAR CORPORATION
18532950 SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE Non-Final OA SHENZHEN STS MICROELECTRONICS CO., LTD.
18486232 MONOLITHIC MULTIPLE-CHANNEL PROTECTION DEVICE Non-Final OA Littelfuse Semiconductor (Wuxi) Co., Ltd.

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