Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2817 2897
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18757829 | INTEGRATED CIRCUIT DEVICES INCLUDING STACKED GATE STRUCTURES WITH DIFFERENT DIMENSIONS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18667445 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18648683 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17979131 | NANOWIRE ARRAY STRUCTURES FOR INTEGRATION, PRODUCTS INCORPORATING THE STRUCTURES, AND METHODS OF MANUFACTURE THEREOF | Final Rejection | Commissariat A L'Energie Atomique Et Aux Energies Alternatives |
| 18119491 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18120904 | REFLECTIVE INORGANIC THIN FILM FOR HIGH-DENSITY PANEL-SCALE RE-DISTRIBUTION LAYER (RDL) | Non-Final OA | Intel Corporation |
| 17507010 | DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM A SURFACE OF THE GLASS | Non-Final OA | Intel Corporation |
| 18593364 | Treating the Dielectric Films Under the Bottoms of Source/Drain Regions | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18626029 | SEMICONDUCTOR PACKAGE WITH FLOATING METAL PORTION AND METHOD FOR MANUFACTURING | Non-Final OA | Infineon Technologies AG |
| 18754628 | SEMICONDUCTOR PACKAGE HAVING A THREE-DIMENSIONAL PRINTED ENCLOSURE | Non-Final OA | Sandisk Technologies, Inc. |
| 17657323 | ELECTRONIC DEVICE | Non-Final OA | Analog Devices, Inc. |
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