4 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18489746 | PANEL LEVEL SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | NGUYEN, SOPHIA T | 2893 | Non-Final OA | Oct 18, 2023 |
| 18369441 | CHIP SIZE PACKAGE AND SYSTEM | PHAM, HOAI V | 2892 | Non-Final OA | Sep 18, 2023 |
| 18168509 | METHOD FOR AUTO-ALIGNED MANUFACTURING OF A TRENCH-GATE MOS TRANSISTOR, AND SHIELDED-GATE MOS TRANSISTOR | HOQUE, MOHAMMAD M | 2817 | Final Rejection | Feb 13, 2023 |
| 18079610 | THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION | ONUTA, TIBERIU DAN | 2814 | Final Rejection | Dec 12, 2022 |
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