Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2823 2893
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18590905 | MULTILAYER METAL-INSULATOR-METAL CAPACITORS FOR INCREASED CAPACITANCE DENSITY | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18439634 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO, LTD. |
| 18432152 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18510954 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18492821 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18231838 | SEMICONDUCTOR DEVICE HAVING A BONDED STRUCTURE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18579368 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18444216 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18417032 | LIGHT EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18476029 | INTEGRATED CIRCUIT WITH STACKED INTERPOSER | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18781766 | ASYMMETRIC VERTICAL THIN FILM TRANSISTOR SELECTOR | Non-Final OA | Micron Technology, Inc. |
| 18409702 | MICROELECTRONIC DEVICES INCLUDING THROUGH-SILICON VIAS, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 17976625 | SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES | Non-Final OA | Micron Technology, Inc. |
| 18785172 | RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18405844 | STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18672951 | DUMMY FEATURES FOR DISSIPATING HEAT IN PACKAGES INCLUDING ADVANCED SEMICONDUCTOR CHIPS | Non-Final OA | Applied Materials, Inc. |
| 18474111 | DIE PAIR DEVICE PARTITIONING | Final Rejection | Advanced Micro Devices, Inc. |
| 18316918 | SYSTEMS AND METHODS FOR PREVENTING BODY BIASING INJECTION ATTACKS | Final Rejection | Advanced Micro Devices, Inc. |
| 18335916 | POWER MOSFET DEVICE HAVING IMPROVED SAFE-OPERATING AREA AND ON RESISTANCE, MANUFACTURING PROCESS THEREOF AND OPERATING METHOD THEREOF | Non-Final OA | STMICROELECTRONICS S.r.l. |
| 18168509 | METHOD FOR AUTO-ALIGNED MANUFACTURING OF A TRENCH-GATE MOS TRANSISTOR, AND SHIELDED-GATE MOS TRANSISTOR | Non-Final OA | STMICROELECTRONICS PTE LTD |
| 18531912 | BACKSIDE CONTACT EXTENSION FOR STACKED FIELD EFFECT TRANSISTOR | Non-Final OA | International Business Machines Corporation |
| 18458875 | VIBRATION ISOLATION ASSEMBLIES FOR ELECTRONIC DEVICES | Non-Final OA | NXP USA, Inc. |
| 18365447 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | RENESAS ELECTRONICS CORPORATION |
| 18062827 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Final Rejection | RENESAS ELECTRONICS CORPORATION |
| 18466487 | Power Semiconductor Device with Balancing Shunt Structure | Non-Final OA | Wolfspeed, Inc. |
| 18462613 | 3DS FET AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
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