Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2823 2893
This examiner grants 85% of resolved cases
Mohammad M. Hoque serves in Tech Center 2800 and Art Unit 2800. The examiner has 763 resolved cases. The data indicates an allowance rate of 85.2 percent. This figure serves as a primary metric for assessing the probability of success. The median days to allowance is 802. This duration represents the time required to reach a grant. Applicants should account for this timeframe when planning their strategy.
The interview lift for Hoque is 9.5 percent. This percentage shows that interviews are a productive tool for advancing applications. The 9.5 percent interview lift is lower than the 85.2 percent allowance rate. For the 763 resolved cases, the median days to allowance of 802 provides a clear expectation for the prosecution lifecycle. In Art Unit 2800, the interview lift suggests that verbal communication is a helpful approach. This data offers a baseline for practitioners in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18816999 | SEMICONDUCTOR DEVICE WITH POWER GATING ELEMENT | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18590905 | MULTILAYER METAL-INSULATOR-METAL CAPACITORS FOR INCREASED CAPACITANCE DENSITY | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18439634 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO, LTD. |
| 18432152 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18417032 | LIGHT EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18326216 | SEMICONDUCTOR DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC DEVICE AND IMAGE FORMING APPARATUS | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18839351 | METHODS OF FABRICATING MICRO ELECTRO-MECHANICAL SYSTEMS STRUCTURES | Non-Final OA | The University of British Columbia |
| 18476029 | INTEGRATED CIRCUIT WITH STACKED INTERPOSER | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18667552 | ANTIFUSE STRUCTURE | Non-Final OA | International Business Machines Corporation |
| 18537365 | STACKED FORKSHEET FET WITH SHARED AND/OR INDEPENDENT GATES | Non-Final OA | International Business Machines Corporation |
| 18531912 | BACKSIDE CONTACT EXTENSION FOR STACKED FIELD EFFECT TRANSISTOR | Non-Final OA | International Business Machines Corporation |
| 18444092 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18511666 | PROTECTION AGAINST PLASMA INDUCED DAMAGES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18785172 | RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18511581 | HgZnTe DETECTOR ON SILICON SUBSTRATE | Non-Final OA | Raytheon Company |
| 18518105 | REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE POWER MODULE | Non-Final OA | Wolfspeed, Inc. |
| 18707950 | THROUGH-VIA SUBSTRATE, MOUNTING SUBSTRATE, AND METHOD FOR MANUFACTURING THROUGH-VIA SUBSTRATE | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18886782 | METHOD FOR TRANSFERRING BLOCKS FROM A DONOR SUBSTRATE ONTO A RECEIVER SUBSTRATE BY IMPLANTING IONS IN THE DONOR SUBSTRATE THROUGH A MASK, BONDING THE DONOR SUBSTRATE TO THE RECEIVER SUBSTRATE, AND DETACHING THE DONOR | Non-Final OA | Soitec |
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