4 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18480385 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | FAN, SU JYA | 2818 | Non-Final OA | Oct 03, 2023 |
| 18312552 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | SUN, YU-HSI DAVID | 2817 | Final Rejection | May 04, 2023 |
| 18307004 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | HOQUE, MOHAMMAD M | 2817 | Final Rejection | Apr 26, 2023 |
| 18149029 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | LOHAKARE, PRATIKSHA JAYANT | 2818 | Final Rejection | Dec 30, 2022 |
IP Author helps IP teams respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.
Start Free Trial