Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2823 2894
This examiner grants 75% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18244997 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18366098 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18224948 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17897974 | RECESS LEAD FOR A SURFACE MOUNT PACKAGE | Final Rejection | Texas Instruments Incorporated |
| 17587790 | PACKAGING DEVICE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | Final Rejection | Huawei Technologies Co., Ltd. |
| 18096174 | THIN SYSTEM-IN-PACKAGE WITH SHIELDED STEPPED MOLD | Non-Final OA | Apple Inc. |
| 18496900 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SEIKO EPSON CORPORATION |
| 18238057 | POWER SEMICONDUCTOR DEVICE, POWER SEMICONDUCTOR MODULE, POWER CONVERTER INCLUDING SAME, AND MANUFACTURING METHOD THEREOF | Non-Final OA | LX Semicon Co., Ltd. |
| 18069290 | ELECTRONIC DEVICE | Final Rejection | InnoLux Corporation |
| 18238954 | SACRIFICIAL LAYER FOR FORMING MERGED HIGH ASPECT RATIO CONTACTS IN 3D NAND MEMORY DEVICE | Non-Final OA | Applied Materials, Inc. |
| 18071116 | RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES | Non-Final OA | Intel Corporation |
| 17448716 | Semiconductor Die, Semiconductor Device and Method for Forming a Semiconductor Die | Non-Final OA | Intel Corporation |
| 17894063 | SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT | Final Rejection | Micron Technology, Inc. |
| 17891535 | SOLDER JOINT DESIGN FOR IMPROVED PACKAGE RELIABILITY | Non-Final OA | Micron Technology, Inc. |
| 18459207 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18364893 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18539155 | ENHANCED DOPING EFFICIENCY OF ULTRAWIDE BANDGAP SEMICONDUCTORS BY METAL-SEMICONDUCTOR ASSISTED EPITAXY | Final Rejection | THE REGENTS OF THE UNIVERSITY OF MICHIGAN |
| 17914713 | SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 17744740 | TEST STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18524627 | FLASH MEMORY STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18153710 | SEMICONDUCTOR PACKAGE SUBSTRATE MADE FROM NON-METALLIC MATERIAL AND A METHOD OF MANUFACTURING THEREOF | Final Rejection | NEXPERIA B.V. |
| 17957444 | CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFACE USING A SPACER INTERCONNECT COUPLED TO A PORTION OF THE CHIPLET | Non-Final OA | ADVANCED MICRO DEVICES, INC. |
| 18055890 | MANUFACTURING METHOD OF ELECTRONIC PACKAGE | Final Rejection | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18226409 | INTEGRATED CIRCUIT PACKAGE | Non-Final OA | STMicroelectronics (Grenoble 2) SAS |
| 18349412 | SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS FOR MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18480385 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Xintec Inc. |
| 18227892 | BONDING STRUCTURE AND PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18269456 | INTERPOSER SUBSTRATE AND METHOD FOR PRODUCING DEVICE USING THE INTERPOSER SUBSTRATE | Non-Final OA | TANAKA KIKINZOKU KOGYO K.K. |
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