Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2823 2894
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18410761 | HEAT RADIATION DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18400953 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18096174 | THIN SYSTEM-IN-PACKAGE WITH SHIELDED STEPPED MOLD | Final Rejection | Apple Inc. |
| 17666911 | POWER STRUCTURE, PREPARATION METHOD, AND DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 17587790 | PACKAGING DEVICE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | Final Rejection | Huawei Technologies Co., Ltd. |
| 18750292 | LIGHT EMITTING DIODE AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18538365 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18528982 | DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18527096 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18480582 | POLARIZING FILM AND DISPLAY DEVICE INCLUDING SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18069290 | ELECTRONIC DEVICE | Final Rejection | InnoLux Corporation |
| 18071116 | RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES | Non-Final OA | Intel Corporation |
| 17889229 | SKIP LAYER WITH AIR GAP ON GLASS SUBSTRATES | Non-Final OA | Intel Corporation |
| 17448716 | Semiconductor Die, Semiconductor Device and Method for Forming a Semiconductor Die | Final Rejection | Intel Corporation |
| 17891535 | SOLDER JOINT DESIGN FOR IMPROVED PACKAGE RELIABILITY | Final Rejection | Micron Technology, Inc. |
| 18432058 | SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18499816 | SEMICONDUCTOR STRUCTURE WITH DEVICES HAVING DIFFERENT EFFECTIVE CHANNELS AND REDUCED EFFECTIVE CAPACITANCES, AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18777250 | METHODS OF FORMING EPITAXIAL SOURCE/DRAIN FEATURES IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18516147 | SELECTIVE DEPOSITION OF MASK FOR REDUCING NANO SHEET LOSS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18349412 | SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS FOR MAKING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18238954 | SACRIFICIAL LAYER FOR FORMING MERGED HIGH ASPECT RATIO CONTACTS IN 3D NAND MEMORY DEVICE | Final Rejection | Applied Materials, Inc. |
| 17957444 | CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFACE USING A SPACER INTERCONNECT COUPLED TO A PORTION OF THE CHIPLET | Final Rejection | ADVANCED MICRO DEVICES, INC. |
| 18226409 | INTEGRATED CIRCUIT PACKAGE | Non-Final OA | STMicroelectronics (Grenoble 2) SAS |
| 18533683 | SECOND AIR GAP TYPE FOR SUBTRACTIVE INTERCONNECTS | Non-Final OA | International Business Machines Corporation |
| 18488628 | ARC PREVENTION FOR BONDED WAFERS OF A CHIP STACK | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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