Tech Center 2800 • Art Units: 2818 2894
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18135530 | 3DSFET DEVICE INCLUDING SELF-ALIGNED SOURCE/DRAIN CONTACT STRUCTURE WITH SPACER STRUCTURE AT SIDE SURFACE THEREOF | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17874738 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT USING ETCHING PROCESS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17965626 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 17831418 | DISPLAY APPARATUS HAVING A REFRACTIVE LAYER | Non-Final OA | Samsung Display Co., Ltd. |
| 17923775 | LIGHT EMITTING ELEMENT AND DISPLAY DEVICE INCLUDING ORGANIC MATERIALS WITH HOLE TRANSPORT PROPERTIES AND ELECTRON TRANSPORT PROPERTIES | Final Rejection | Sony Semiconductor Solutions Corporation |
| 18193052 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18147457 | ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER | Non-Final OA | Intel Corporation |
| 17889694 | SEMICONDUCTOR ISOLATION DEVICE AND METHOD | Non-Final OA | Micron Technology, Inc. |
| 18467909 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Kokusai Electric Corporation |
| 18397445 | LED DEVICE AND INK COMPOSITION COMPRISING THE SAME | Non-Final OA | Kookmin University Industry Academy Cooperation Foundation |
| 18253196 | LOW RESISTANCE PULSED CVD TUNGSTEN | Final Rejection | Lam Research Corporation |
| 18355765 | BONDED THREE-DIMENSIONAL MEMORY DEVICE HAVING TEMPORARY ELECTRICAL GROUNDING PATHS IN DUMMY BLOCK AND METHODS OF MAKING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 17897975 | CENTRALLY SYMMETRIC VERTICAL TRANSFER GATE | Final Rejection | CISTA SYSTEM CORP. |
| 18002703 | SEMICONDUCTOR DEVICE AND POWER CONVERTER | Non-Final OA | Hitachi Power Semiconductor Device, Ltd. |
| 18127736 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | Non-Final OA | Semiconductor Manufacturing International (Shanghai) Corporation |
| 18149029 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | XINTEC INC. |
| 17708734 | MULTILAYER STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING CRYSTAL FILM CONTAINING A CRYSTALLINE METAL OXIDE AS A MAJOR COMPONENT, THE CRYSTALLINE METAL OXIDE CONTAINING AT LEAST GALLUM | Final Rejection | FLOSFIA INC. |
| 18077209 | PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | JCET GROUP CO., LTD. |
| 17970562 | PIXEL OF MICRODISPLAY HAVING INTEGRATED CATADIOPTRIC LIGHT EXTRACTION SYSTEM | Non-Final OA | SUNDIODE KOREA |
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