Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2894
This examiner grants 81% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18486831 | SEMICONDUCTOR PACKAGES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18135530 | 3DSFET DEVICE INCLUDING SELF-ALIGNED SOURCE/DRAIN CONTACT STRUCTURE WITH SPACER STRUCTURE AT SIDE SURFACE THEREOF | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18206933 | Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the Same | Non-Final OA | Chipletz, Inc. |
| 17889694 | SEMICONDUCTOR ISOLATION DEVICE AND METHOD | Non-Final OA | Micron Technology, Inc. |
| 18467909 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Kokusai Electric Corporation |
| 18095156 | SEAL RING STRUCTURES | Final Rejection | GlobalFoundries U.S. Inc. |
| 18149029 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | XINTEC INC. |
| 18002703 | SEMICONDUCTOR DEVICE AND POWER CONVERTER | Non-Final OA | Hitachi Power Semiconductor Device, Ltd. |
| 18077209 | PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | JCET GROUP CO., LTD. |
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