Prosecution Insights
Last updated: October 01, 2026

Examiner: LOHAKARE, PRATIKSHA JAYANT

Tech Center 3600 • Art Units: 2818 2894 3652

This examiner grants 82% of resolved cases

Analysis

Pratiksha Jayant Lohakare has resolved 96 cases in Tech Center 3600. In Art Unit 2818, the examiner maintains an allowance rate of 82.3 percent. The median days to allowance for these cases is 1170, which is a key metric for prosecution duration. Practitioners can use this 1170-day figure to set expectations for the time required to reach a grant. The 82.3 percent rate reflects the frequency of successful outcomes for applications reaching a resolution.

The interview lift of 15.3 percent suggests that direct communication is associated with an increase in the probability of success compared to the 82.3 percent base rate. This lift indicates that interviews are a tool for resolving outstanding issues. With 96 resolved cases, the data provides the context for these strategic metrics. Practitioners should factor the 1170-day median pendency into their decision to interview. The 15.3 percent lift is a measurable factor for planning prosecution in Art Unit 2818.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

82.3%
Allow Rate
+30.3% vs TC avg
122
Total Applications
+15.3%
Interview Lift
1170
Avg Prosecution Days
Based on 96 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
16.5%
§102 Novelty
65.2%
§103 Obviousness
13.7%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18441681 IMAGE SENSOR AND METHOD OF FABRICATING THE SAME Final Rejection Samsung Electronics Co., Ltd.
18520934 SEMICONDUCTOR DEVICE AND IMAGE SENSOR INCLUDING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18486831 SEMICONDUCTOR PACKAGES Final Rejection SAMSUNG ELECTRONICS CO., LTD.
18282801 Display Substrate and Preparing Method Therefor, and Display Apparatus Non-Final OA BOE Technology Group Co., Ltd.
18734446 DISPLAY DEVICE Non-Final OA Samsung Display Co., LTD.
18408399 DISPLAY PANEL AND DEPOSITION APPARATUS Non-Final OA Samsung Display Co., Ltd.
17831418 DISPLAY APPARATUS HAVING A REFRACTIVE LAYER Non-Final OA Samsung Display Co., Ltd.
18398432 DISPLAY DEVICE Non-Final OA LG Display Co., Ltd.
18467920 METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT Final Rejection NICHIA CORPORATION
18147457 ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER Final Rejection Intel Corporation
18399400 SEMICONDUCTOR STRUCTURE, FORMING METHOD THEREOF AND SEMICONDUCTOR DEVICE Final Rejection Yangtze Memory Technologies Co., Ltd.
18607622 SEMICONDUCTOR MANUFACTURING APPARATUS Final Rejection Mitsubishi Electric Corporation
18253196 LOW RESISTANCE PULSED CVD TUNGSTEN Non-Final OA Lam Research Corporation
18335680 SEMICONDUCTOR MEMORY DEVICE Non-Final OA Kioxia Corporation
18596003 Chip Die Substrate with Edge-Mounted Capacitors Non-Final OA NVIDIA Corporation
17889694 SEMICONDUCTOR ISOLATION DEVICE AND METHOD Non-Final OA Micron Technology, Inc.
18786591 TRANSISTOR, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF HBNC LAYER Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18662286 SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN UNIT WITH TUNNEL LAYER AND METHOD FOR MANUFACTURING THE SAME Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18786529 SEMICONDUCTOR DEVICE HAVING A MULTILAYER SOURCE/DRAIN REGION AND METHODS OF MANUFACTURE Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18693428 THIN-FILM TRANSISTOR DRIVING DEVICE AND MANUFACTURING METHOD THEREOF Final Rejection SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
18422677 Thermally Stable FinFET Device for High Temperature Operation Final Rejection Wolfspeed, Inc.
18355765 BONDED THREE-DIMENSIONAL MEMORY DEVICE HAVING TEMPORARY ELECTRICAL GROUNDING PATHS IN DUMMY BLOCK AND METHODS OF MAKING THE SAME Final Rejection SANDISK TECHNOLOGIES LLC
18679463 METHOD OF MANUFACTURING ISOLATION STRUCTURE Non-Final OA MIKRO MESA TECHNOLOGY CO., LTD.
18206933 Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the Same Final Rejection Chipletz, Inc.

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