Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2895
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18052252 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18543734 | GATE CUT STRUCTURE FOR TRANSISTORS | Non-Final OA | International Business Machines Corporation |
| 18488448 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18370459 | LATERAL BIPOLAR JUNCTION TRANSISTOR DEVICE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company LTD |
| 18150385 | INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18496674 | IMAGE SENSING DEVICE AND IMAGING DEVICE INCLUDING THE SAME | Non-Final OA | SK hynix Inc. |
| 18482954 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18496656 | HYBRID SUBSTRATES AND MANUFACTURING METHODS THEREOF | Non-Final OA | Avago Technologies International Sales Pte. Limited |
| 18543719 | DIODE, FIELD EFFECT TRANSISTOR HAVING THE DIODE, AND METHOD FOR MANUFACTURING THE DIODE | Non-Final OA | MIRISE Technologies Corporation |
| 18190460 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | RENESAS ELECTRONICS CORPORATION |
| 18359645 | THERMALLY CONDUCTIVE SPACER | Final Rejection | Sandisk Technologies, Inc. |
| 17860392 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS DISPOSED | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18488284 | Direct Bonded Semiconductor Die Package | Non-Final OA | Wolfspeed, Inc. |
| 18526100 | CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME | Non-Final OA | TONG HSING ELECTRONIC INDUSTRIES, LTD. |
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