Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2895 2897
This examiner grants 78% of resolved cases
Yu-Hsi David Sun serves as a patent examiner in Tech Center 2800, working within Art Unit 2800. The examiner has reached a resolution in 879 cases. The allowance rate for these cases is 77.5 percent. This 77.5 percent rate provides a measure of how often applications are granted. Practitioners can use this data to evaluate the probability of a favorable outcome when an application is assigned to this examiner.
The record shows an interview lift of 8.4 percent. This positive 8.4 percent lift indicates that applications involving an interview are more likely to be allowed than those that are not. This suggests that direct discussion with the examiner is a productive method for resolving issues. Practitioners should consider the 8.4 percent lift when deciding whether to request an interview during prosecution in Tech Center 2800.
The median days to allowance for this examiner is 973. This 973 figure represents the middle point of the time required to move from filing to a patent grant. With 879 resolved cases, this median offers a benchmark for the duration of the prosecution process. These figures assist in managing expectations for both the timing and the results of applications in Art Unit 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18746889 | IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18679992 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18660294 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18674046 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18534698 | SEMICONDUCTOR ELEMENT, ELECTRONIC DEVICE COMPRISING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR CHIP | Final Rejection | InnoLux Corporation |
| 18544012 | ELECTRONIC DEVICE | Final Rejection | Commissariat à l'Énergie Atomique et aux Énergies Alternatives |
| 18543862 | HIGH EFFICIENCY QUANTUM DOT IMAGE SENSORS AND METHODS OF FORMING THE SAME | Non-Final OA | Adeia Semiconductor Bonding Technologies Inc. |
| 18735859 | SIDEWALL PINCH-OFF OF WORK FUNCTION METAL | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18619879 | ISOLATING BACKSIDE CONTACTS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18400523 | AIRGAP SPACER WITH BACKSIDE POWER DELIVERY | Non-Final OA | International Business Machines Corporation |
| 18641571 | EX-SITU MANUFACTURE OF METAL MICRO-WIRES AND FIB PLACEMENT IN IC CIRCUITS | Non-Final OA | Texas Instruments Incorporated |
| 18781853 | TECHNIQUES FOR POSITIONING BOND PADS OF MICROELECTRONIC DEVICES AND RELATED MICROELECTRONIC DEVICES AND SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 18658874 | APPARATUSES AND METHODS FOR COUPLING A PLURALITY OF SEMICONDUCTOR DEVICES | Non-Final OA | MICRON TECHNOLOGY, INC. |
| 18426796 | CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18444858 | SELF-ALIGNED STORAGE NODE CONTACT IN DYNAMIC RANDOM ACCESS MEMORY (DRAM) DEVICE | Non-Final OA | Applied Materials, Inc. |
| 18663675 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18675167 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | HON HAI PRECISION INDUSTRY CO., LTD. |
| 18742626 | TRENCH BASED SEMICONDUCTOR DEVICES WITH INCREASED PLANARITY | Non-Final OA | Wolfspeed, Inc. |
| 18488284 | Direct Bonded Semiconductor Die Package | Final Rejection | Wolfspeed, Inc. |
| 18681388 | MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MULTILAYER ASSEMBLY | Non-Final OA | SPREADTRUM COMMUNICATIONS (SHANGHAI) CO., LTD. |
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