Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2895 2897
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18679992 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18432351 | INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18052252 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18426918 | DISPLAY DEVICE | Non-Final OA | LG DISPLAY CO., LTD. |
| 18544012 | ELECTRONIC DEVICE | Final Rejection | Commissariat à l'Énergie Atomique et aux Énergies Alternatives |
| 18543862 | HIGH EFFICIENCY QUANTUM DOT IMAGE SENSORS AND METHODS OF FORMING THE SAME | Non-Final OA | Adeia Semiconductor Bonding Technologies Inc. |
| 18641571 | EX-SITU MANUFACTURE OF METAL MICRO-WIRES AND FIB PLACEMENT IN IC CIRCUITS | Non-Final OA | Texas Instruments Incorporated |
| 18158982 | CAPILLARY FOR STITCH BOND | Final Rejection | Texas Instruments Incorporated |
| 18658874 | APPARATUSES AND METHODS FOR COUPLING A PLURALITY OF SEMICONDUCTOR DEVICES | Non-Final OA | MICRON TECHNOLOGY, INC. |
| 18426796 | CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18359645 | THERMALLY CONDUCTIVE SPACER | Final Rejection | Sandisk Technologies, Inc. |
| 18663675 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18619879 | ISOLATING BACKSIDE CONTACTS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18400523 | AIRGAP SPACER WITH BACKSIDE POWER DELIVERY | Final Rejection | International Business Machines Corporation |
| 18543734 | GATE CUT STRUCTURE FOR TRANSISTORS | Final Rejection | International Business Machines Corporation |
| 18190460 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | RENESAS ELECTRONICS CORPORATION |
| 18665848 | SEMICONDUCTOR DEVICE HAVING BIT LINE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18643049 | SEMICONDUCTOR DEVICE HAVING BIT LINE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18488284 | Direct Bonded Semiconductor Die Package | Final Rejection | Wolfspeed, Inc. |
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