Tech Center 2800 • Art Units: 2817 2895
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18052252 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18559178 | PHOTOELECTRIC CONVERSION DEVICE AND IMAGING MACHINE | Non-Final OA | SONY GROUP CORPORATION |
| 18482717 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18511078 | Semiconductor Package | Non-Final OA | SEIKO EPSON CORPORATION |
| 18543734 | GATE CUT STRUCTURE FOR TRANSISTORS | Non-Final OA | International Business Machines Corporation |
| 18488448 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18370459 | LATERAL BIPOLAR JUNCTION TRANSISTOR DEVICE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company LTD |
| 18150385 | INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18496674 | IMAGE SENSING DEVICE AND IMAGING DEVICE INCLUDING THE SAME | Non-Final OA | SK hynix Inc. |
| 18187599 | SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS STACKED IN STAGGERED MANNER | Final Rejection | SK hynix Inc. |
| 18482954 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18449502 | SELECTIVE WIRE COATING DURING WIRE BONDING | Non-Final OA | Sandisk Technologies, Inc. |
| 18359645 | THERMALLY CONDUCTIVE SPACER | Non-Final OA | Sandisk Technologies, Inc. |
| 18355111 | NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES | Non-Final OA | Sandisk Technologies, Inc. |
| 18496656 | HYBRID SUBSTRATES AND MANUFACTURING METHODS THEREOF | Non-Final OA | Avago Technologies International Sales Pte. Limited |
| 18190460 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | RENESAS ELECTRONICS CORPORATION |
| 18217044 | Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor | Non-Final OA | Infineon Technologies Austria AG |
| 17860392 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS DISPOSED | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18488284 | Direct Bonded Semiconductor Die Package | Non-Final OA | Wolfspeed, Inc. |
| 18312552 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Xintec Inc. |
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